DE102011053093B4 - Leuchtvorrichtungen - Google Patents

Leuchtvorrichtungen Download PDF

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Publication number
DE102011053093B4
DE102011053093B4 DE102011053093.2A DE102011053093A DE102011053093B4 DE 102011053093 B4 DE102011053093 B4 DE 102011053093B4 DE 102011053093 A DE102011053093 A DE 102011053093A DE 102011053093 B4 DE102011053093 B4 DE 102011053093B4
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Germany
Prior art keywords
led
led cell
cell
conductive metal
cells
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DE102011053093.2A
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German (de)
English (en)
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DE102011053093A1 (de
Inventor
Chao-Hsing Chen
Chien-Fu Shen
Tsun-Kai Ko
Schang Jing Hon
Hsin Mao Liu
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ENNOSTAR CORPORATION, TW
Original Assignee
Epistar Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
DE102011053093.2A 2010-08-30 2011-08-29 Leuchtvorrichtungen Active DE102011053093B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37819110P 2010-08-30 2010-08-30
US61/378,191 2010-08-30

Publications (2)

Publication Number Publication Date
DE102011053093A1 DE102011053093A1 (de) 2012-04-12
DE102011053093B4 true DE102011053093B4 (de) 2021-12-30

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DE102011123130.0A Active DE102011123130B4 (de) 2010-08-30 2011-08-29 Leuchtvorrichtung

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Country Status (6)

Country Link
US (4) US9171883B2 (https=)
JP (4) JP5917859B2 (https=)
KR (6) KR101616094B1 (https=)
CN (2) CN106206550B (https=)
DE (2) DE102011053093B4 (https=)
TW (5) TWI702707B (https=)

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US9171883B2 (en) * 2010-08-30 2015-10-27 Epistar Corporation Light emitting device
CN102593284B (zh) * 2012-03-05 2014-06-18 映瑞光电科技(上海)有限公司 隔离深沟槽及其高压led芯片的制造方法
TWI549278B (zh) * 2012-03-12 2016-09-11 晶元光電股份有限公司 發光二極體元件
CN105977369A (zh) * 2016-05-26 2016-09-28 合肥彩虹蓝光科技有限公司 一种小电流高光效hv-led芯片
JP2019072137A (ja) * 2017-10-13 2019-05-16 サミー株式会社 回胴式遊技機
JP2019072140A (ja) * 2017-10-13 2019-05-16 サミー株式会社 回胴式遊技機
CN109950280B (zh) * 2019-02-26 2021-02-12 云谷（固安）科技有限公司 具有静电防护结构的装置及其制备方法
JP7217688B2 (ja) * 2019-09-26 2023-02-03 三菱電機株式会社 半導体装置、及び半導体素子の製造方法
WO2021146596A1 (en) 2020-01-16 2021-07-22 Matthew Hartensveld Capacitive control of electrostatic field effect optoelectronic device
CN112687780B (zh) * 2020-12-29 2022-02-11 厦门三安光电有限公司 一种高压发光二极管芯片
US20230007967A1 (en) * 2021-07-12 2023-01-12 Xiamen San'an Optoelectronics Co., Ltd. Light emitting diode device

Citations (3)

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US20080251808A1 (en) 2002-08-01 2008-10-16 Takeshi Kususe Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
US20100109030A1 (en) 2008-11-06 2010-05-06 Koninklijke Philips Electronics N.V. Series connected flip chip leds with growth substrate removed

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US5789768A (en) 1997-06-23 1998-08-04 Epistar Corporation Light emitting diode having transparent conductive oxide formed on the contact layer
US20080251808A1 (en) 2002-08-01 2008-10-16 Takeshi Kususe Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
US20100109030A1 (en) 2008-11-06 2010-05-06 Koninklijke Philips Electronics N.V. Series connected flip chip leds with growth substrate removed

Also Published As

Publication number Publication date
JP2020205454A (ja) 2020-12-24
KR101925527B1 (ko) 2018-12-05
KR20120021221A (ko) 2012-03-08
DE102011053093A1 (de) 2012-04-12
JP2016122849A (ja) 2016-07-07
KR102312627B1 (ko) 2021-10-14
US8823022B2 (en) 2014-09-02
TW201931563A (zh) 2019-08-01
TWI533432B (zh) 2016-05-11
CN106206550A (zh) 2016-12-07
CN106206550B (zh) 2019-01-15
JP6772109B2 (ja) 2020-10-21
KR20180129746A (ko) 2018-12-05
KR20160051702A (ko) 2016-05-11
KR102176761B1 (ko) 2020-11-10
TW201810597A (zh) 2018-03-16
JP2012049545A (ja) 2012-03-08
TWI578489B (zh) 2017-04-11
TW201209984A (en) 2012-03-01
TWI611553B (zh) 2018-01-11
CN102386175A (zh) 2012-03-21
TW201717352A (zh) 2017-05-16
US9171883B2 (en) 2015-10-27
KR101741130B1 (ko) 2017-05-29
US20160027745A1 (en) 2016-01-28
DE102011123130B4 (de) 2025-02-27
US20180151516A1 (en) 2018-05-31
JP6174731B2 (ja) 2017-08-02
US20120049209A1 (en) 2012-03-01
TWI662681B (zh) 2019-06-11
US10546824B2 (en) 2020-01-28
TWI702707B (zh) 2020-08-21
JP2017199927A (ja) 2017-11-02
JP7186754B2 (ja) 2022-12-09
CN102386175B (zh) 2016-08-17
KR20200128499A (ko) 2020-11-13
US20120049208A1 (en) 2012-03-01
KR20170058904A (ko) 2017-05-29
KR20190102168A (ko) 2019-09-03
US9893024B2 (en) 2018-02-13
TW201622097A (zh) 2016-06-16
KR102017859B1 (ko) 2019-09-03
KR101616094B1 (ko) 2016-04-27
JP5917859B2 (ja) 2016-05-18

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