M379173 V 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種發光二極體元件，旨在提供一種尤適合 利用撓性線材相互串接使用之模組化發光二極體元件。 【先前技術】 近年發光二極體(Light Emitting Diode，LED)由於其具 有體積小、耐震、反應時間短、省電以及低熱度的特性，漸有 取代傳統燈泡的趨勢，並被廣泛的應用於室内外照明、建築物 外觀之裝飾燈、大型看板、甚至是景觀造型之用。 雖然發光二極體具有種種優點，但由於其本身低電壓、低 電流的特性，相對伴隨著發光亮度不足的缺點；因此，一般為 了提高發光二極體照明設備之亮度，多會將數量不等之發光二 極體元件串接為燈組或燈串之方式加以使用。 而為方便利用撓性線材進行發光二極體元件之互相串 接’習用可㈣接制之發光極體模組係將若干發光二極體元 件組合在-歸框體_，由兩對具就長度之線材伸入塑料 框體内部並與各發光二鋪元件雜連接之後，再於塑料框體 内部填注封膠材料，待封膠材料凝固定型之後，始達到將各發 光二極體元件固定於塑料框體内部之目的；於使用時，則利^ 兩對線材相對伸出塑料框體之—端相互串接。 惟’上揭可供串接侧之發光二極體模組必需以完全手工 作業之方式加以製作而成，施工過程繁複困難，當需組合的發 3 M379173 « » » 光二體元件數量愈多時，整體發光二極體模組之生產效率愈成 問題。 【新型内容】 有鑑於此，本創作之主要目的即在提供一種相對較有助於 提升產能’且方便利用撓性線材相互串接使用之串接式發光二 - 極體元件。 树上揭目的，本創作之串接式發光二極體元件係在一金 • 屬基板上建構有至少兩組串接電路，各組串接電路係具有至少 兩個相對應配置之電極接點供與外部電路電性連接；另有至少 一發光二極體設於金屬基板上，各發光二極體並至少與其中一 組申接電路電性連接；以及，至少設有一封襄層覆蓋於各發光 二極體外。 其中’各電極接點可直接以焊塾之型態呈現，或是以電連 — 接器端子之型態呈現，俾獲致-種方便利用撓性線材相互串接 • 使用之發光二極體元件。 再者，該金屬基板上係設有一銅箔線路層，另由一絕緣層 將金屬基板與銅箔線路層加以隔離；使得以利用銅羯線路層做 為串接電路之主體架構，並利用自動化封裝流程完成發光二極 體與金屬基板之結合以及與串接電路之電性連接，不但有助於 提升串接式發光二極體元件之產能，於使用時亦可運用設置於 底部之雜傳導性雛之金屬基板來加速散熱。 【實施方式】 4 本創作之特點， 得清楚地瞭解。 可參閱本案圖式及實施例之詳細說明而獲 縣屬基板U係為賴承載發光二極體12之载體，A可 =或銘基板所構成，該金屬基板u上係建構有至少祕 。路11卜各組串接電路U1係具有至少兩個相對應配置 電極接點112，各電極接‘點112可如圖所示，直接以焊塾之 型態呈現，歧叫連接《子之呈現(圖略)供與外部電 路電性連接。 該至少一發光二極體12係建構於該金屬基板i i上，並如 第二圖及第三圖所示，至少與其中—組串接電路⑴電性連 接，使成為供串聯方式串接使用之發光二極體元件10(如第四 圖所不）’或成為供㈣方式_接使狀發光二鋪元件1〇(如 第五圖所示）。 至於，該至少-封裝層13係相對覆蓋於各發光二極體12 外’其可以由樹脂或樹脂結合螢光粉所構成，主要用以對發光 二極體12構成祕、賴侧，並可對發光二極體12提供預 期之光學機制。 於實施時’該金屬基板U上係可财—_線路層m 及-絕緣層114 ’由該絕緣層114將金屬絲丨丨與銅羯線路 M379173 層113加以隔離’使得以利用銅箔線路層U3做為串接電路 111之主體架構，並利用自動化封裝流程完成發光二極體12 與金屬基板11之結合以及與串接電路111之電性連接，不但 有助於提升串接式發光二極體元件之產能，於使用時亦可運用 設置於底部之鋁或銅等熱傳導性較佳之金屬基板u來加速發 光二極體12散熱。 再者，各發光二極體12係可以如第一圖所示，以直接設M379173 V V. New Description: [New Technology Field] This creation is about a light-emitting diode component designed to provide a modular light-emitting diode component that is particularly suitable for use in series with flexible wires. [Prior Art] In recent years, due to its small size, shock resistance, short reaction time, power saving and low heat, Light Emitting Diode (LED) has gradually replaced the traditional light bulb and is widely used. Indoor and outdoor lighting, decorative lights for building exteriors, large billboards, and even landscapes. Although the light-emitting diode has various advantages, due to its low voltage and low current characteristics, it is relatively accompanied by the disadvantage of insufficient brightness of the light; therefore, generally, in order to increase the brightness of the light-emitting diode lighting device, the number will vary. The light-emitting diode elements are used in series to form a light group or a light string. In order to facilitate the use of flexible wires for the series connection of the light-emitting diode elements, the light-emitting diode module (4) is connected to a plurality of light-emitting diode elements in a frame-by-frame. After the wire of the length extends into the interior of the plastic frame and is connected with each of the light-emitting two-ply components, the sealing material is filled in the interior of the plastic frame, and after the sealing material is fixed, the components of the light-emitting diode are fixed. The purpose of the inside of the plastic frame; when in use, the two pairs of wires are connected to each other at opposite ends of the plastic frame. However, the 'light-emitting diode module for the serial connection side must be made in a completely manual way. The construction process is complicated and difficult. When the combination is required 3 M379173 « » » The number of light two-body components is more The production efficiency of the overall light-emitting diode module becomes more and more problematic. [New content] In view of this, the main purpose of this creation is to provide a series-connected light-emitting diode element that is relatively easy to increase productivity and that facilitates the use of flexible wires in series. In the tree, the serial LED component of the present invention is constructed with at least two sets of series circuits on a metal substrate, and each set of series circuits has at least two corresponding electrode contacts. And electrically connected to the external circuit; at least one light emitting diode is disposed on the metal substrate, and each of the light emitting diodes is electrically connected to at least one of the plurality of receiving circuits; and at least one layer of germanium is covered Each of the luminescent dipoles is external. The 'electrode contacts can be directly displayed in the form of solder bumps, or in the form of electrical-connector terminals, which can be easily connected by flexible wires. . Furthermore, a copper foil circuit layer is disposed on the metal substrate, and the metal substrate and the copper foil circuit layer are separated by an insulating layer; so that the copper germanium circuit layer is used as a main structure of the serial circuit, and the automation is utilized. The packaging process completes the combination of the light-emitting diode and the metal substrate and the electrical connection with the series circuit, which not only helps to improve the productivity of the series-connected light-emitting diode component, but also uses the hetero-conduction at the bottom during use. The metal substrate of the chicks accelerates heat dissipation. [Embodiment] 4 The characteristics of this creation must be clearly understood. Referring to the drawings and the detailed description of the embodiments, the U-based substrate of the county is a carrier for carrying the light-emitting diode 12, and A can be composed of a substrate or a substrate, and the metal substrate u is constructed with at least a secret. The circuit 11 of each group has at least two corresponding electrode contacts 112, and each electrode is connected to the point 112 as shown in the figure, and is directly presented in the form of a solder joint. (figure omitted) for electrical connection with external circuits. The at least one light-emitting diode 12 is constructed on the metal substrate ii, and is electrically connected to at least the series-connected circuit (1) as shown in the second and third figures, so as to be used in series for serial connection. The light-emitting diode element 10 (as shown in the fourth figure) is either a (four) mode-connected light-emitting two-layer element 1 (as shown in the fifth figure). As a result, the at least-encapsulated layer 13 is opposite to each of the light-emitting diodes 12, which may be composed of a resin or a resin-bonded phosphor, and is mainly used to form a secret and a side to the light-emitting diode 12, and The desired optical mechanism is provided for the LEDs 12. In the implementation, 'the metal substrate U can be used--the circuit layer m and the insulating layer 114' are separated from the copper wire M line M379173 layer 113 by the insulating layer 114 to make use of the copper foil circuit layer U3 is used as the main structure of the serial circuit 111, and the combination of the LED 12 and the metal substrate 11 and the electrical connection with the serial circuit 111 are completed by using an automated packaging process, which not only helps to improve the series connection diode The capacity of the bulk component can also be used to accelerate the heat dissipation of the light-emitting diode 12 by using a metal substrate u having a thermal conductivity such as aluminum or copper provided at the bottom. Furthermore, each of the light-emitting diodes 12 can be directly disposed as shown in the first figure.
於該金屬基板11板Φ之方式__金屬基板丨丨上，並可如 第六圖所7F ’在相對於各發光二極體12建構區域之外圍設有 -外框115，該外框115係可以由金屬或塑料所製成，並於外 框115之内側表層施以表面反光處理，以改善發光二極體 之光線照射效果；或是如第七圖所示，於該金躲板11上設 f 一㈣116，該凹坑116係與該金屬基板η之板面形成一The metal substrate 11 is formed on the metal substrate Φ __ metal substrate ,, and may be provided with a frame 115 at the periphery of the construction region of each of the light-emitting diodes 12 as shown in FIG. 7F, the outer frame 115 The system may be made of metal or plastic, and is subjected to surface reflection treatment on the inner surface of the outer frame 115 to improve the light-illuminating effect of the light-emitting diode; or as shown in the seventh figure, the gold hiding plate 11 The upper surface of the metal substrate η is formed by a f-(four) 116.
门度落差並將各發光二極體丨2建構於該凹坑116底部，利 用凹几116壁面之反射作用改善發光二極體η之光線照射效 果。 如八圖所示’本創作之串接式發光二極體元件10係可 利用撓性線材2G相互串接使用，或糊電連接器3()之連接， 自，增加發it二極體元件1{)之數量，更可_撓性線材2〇容 易弯曲之特性，增加各發光二極體元件W之間的配置變化。 尤其’各發光二極體元件1G係可直接於預定串接電路⑴ 之電極接點m處連接有撓性線材22，並進—步如第九圖及 6 第十圖所示，於預疋撓性線材22之尾端設有電連接器昶，方 便各發光二極體兀件1〇如第十一圖所示利用簡單之插接動作 即可相互串接使用。 值件-提的是’在第二圖所示之實施例中，各發光二極體 12健與其中一組串接電路⑴電性連接，且該組串接電路 111相對應之電極接點丨丨2係透過各發光二鋪丨2構成串接。 另外，在第三圖所示之實施例中，各發光二極體12係連接於 該兩組轉電路m之間，並可在其中—組串接· ηι與發 光二極體12之間設有至少—被動元件14，該至少—被動元件 u係可以為電阻或鎌絲，#第三騎示之發光二極體元件 Μ第五圖所示之並聯方式相互串接使用時，若其中一發光 二極體元件㈣中的發光二極體12轉，其他發光二極體元 件10仍可維持正常運作。 综上所述’本創作提供一種較佳可行之串接式發光二極體 元件，纽法提呈新型翻之申請；本創狀技_容及技術 特點巳揭示如上，然而熟悉本項技術之人士仍可能基於本創作 之揭示而作各種不背離本案創作精神之替換及修飾。因此，本 創作之保護範圍應不限於實施例所揭示者，而應包括各種不背 本幻作之替換及修飾，並為以下之申請專利所涵蓋。 【圖式簡單說明】 第—圖係為本創作第一實施例之發光二極體元件外觀結構圖。 第二圖係為本創作第一實施例中發光二極體與串接電路之電 性連接方式圖。 第二圖係為本創作第二實施例中發光二極體與串接電路之電 性連接方式圖。 第四圖係為本創作第一實施例之發光二極體元件之串接方式 參考圖。 第五圖係為本創作第二實施例之發光二極體元件之串接方式 參考圖。 第六圖係為本創作第三實施例之發光二極體元件外觀結構圖。 第七圖係為本創作第四實施例之發光二極體元件外觀結構圖。 第八圖係為本創作之發光二極體元件利用電連接器增加發光 二極體元件數量之串接方式參考圖。 第九圖係為本創作第五實施例之發光二極體元件外觀結構圖。 第十圖係為本創作第六實施例之發光二極體元件外觀結構圖。 第十一圖係為本創作第六實施例之發光二極體元件之串接方 式參考圖。 【主要元件符號說明】 10 發光二極體元件 11 金屬基板 111串接電路 M379173 電極接點 銅箱線路層 絕緣層 外框 凹坑 發光二極體 封裝層 被動元件 撓性線材 電連接器The gate drop and the light-emitting diodes 2 are constructed at the bottom of the pit 116 to improve the light-irradiating effect of the light-emitting diode η by the reflection of the wall surface of the recess 116. As shown in Figure 8, the tandem LED component 10 of the present invention can be connected in series with the flexible wire 2G, or the connection of the paste connector 3 (), since the addition of the diode component The number of 1{) is more than the characteristic that the flexible wire 2 is easily bent, and the configuration change between the respective light-emitting diode elements W is increased. In particular, each of the light-emitting diode elements 1G can be connected to the flexible wire 22 directly at the electrode contact m of the predetermined series circuit (1), and further advanced as shown in the ninth and sixth tenth views. The end of the flexible wire 22 is provided with an electrical connector 昶, so that each of the light-emitting diode components 1 can be used in series with each other by a simple plug-in action as shown in FIG. The value of the present invention is that, in the embodiment shown in the second figure, each of the LEDs 12 is electrically connected to one of the series circuits (1), and the electrode contacts corresponding to the group of series circuits 111 are connected. The 丨丨2 system is connected in series by each of the two illuminating rafts 2. In addition, in the embodiment shown in the third figure, each of the light-emitting diodes 12 is connected between the two sets of the circuit m, and can be disposed between the group-connected ηι and the light-emitting diode 12 There is at least a passive component 14, the at least passive component u can be a resistor or a wire, and the third LED light-emitting diode component is connected in series with each other in parallel in the fifth figure, if one of them The light-emitting diode 12 in the light-emitting diode element (4) is turned, and the other light-emitting diode elements 10 can still maintain normal operation. In summary, the present invention provides a better and feasible series-connected light-emitting diode component, and Newfat presents a new type of application; the present invention and the technical features are disclosed above, but familiar with the technology. Persons may still make substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of the present invention should not be limited to the embodiments disclosed, but should include various alternatives and modifications, and are covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an external structural view of the light-emitting diode element of the first embodiment of the present invention. The second figure is a schematic diagram of the electrical connection of the light-emitting diode and the series circuit in the first embodiment of the present invention. The second figure is a schematic diagram of the electrical connection of the light-emitting diode and the series circuit in the second embodiment of the present invention. The fourth figure is a reference diagram of the series connection mode of the light-emitting diode elements of the first embodiment of the present invention. The fifth figure is a reference diagram of the series connection mode of the light-emitting diode elements of the second embodiment of the present invention. The sixth drawing is an external structural view of the light-emitting diode element of the third embodiment of the present invention. The seventh drawing is an external structural view of the light-emitting diode element of the fourth embodiment of the present invention. The eighth figure is a reference diagram of the series connection method of increasing the number of light-emitting diode components by using the electrical connector of the light-emitting diode component of the present invention. The ninth drawing is an external structural view of the light-emitting diode element of the fifth embodiment of the present invention. The tenth figure is an external structural view of the light-emitting diode element of the sixth embodiment of the present invention. The eleventh drawing is a reference diagram of the tandem connection of the light-emitting diode elements of the sixth embodiment of the present invention. [Main component symbol description] 10 LED components 11 Metal substrate 111 series circuit M379173 Electrode contact Copper box wiring layer Insulation layer Frame Pit Light-emitting diode Package layer Passive component Flexible wire Electrical connector