DE102008021435A1 - Gehäuse für LEDs mit hoher Leistung - Google Patents

Gehäuse für LEDs mit hoher Leistung Download PDF

Info

Publication number
DE102008021435A1
DE102008021435A1 DE102008021435A DE102008021435A DE102008021435A1 DE 102008021435 A1 DE102008021435 A1 DE 102008021435A1 DE 102008021435 A DE102008021435 A DE 102008021435A DE 102008021435 A DE102008021435 A DE 102008021435A DE 102008021435 A1 DE102008021435 A1 DE 102008021435A1
Authority
DE
Germany
Prior art keywords
housing
glass layer
base part
area
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102008021435A
Other languages
German (de)
English (en)
Inventor
Robert Hettler
Thomas Dr. Zetterer
Matthias Rindt
Josef Kiermeier
Shaifullah Bin Mohamed Kamari
Lea-Li Chew
Rohit Bhosale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Priority to DE102008021435A priority Critical patent/DE102008021435A1/de
Priority to PCT/EP2009/003109 priority patent/WO2009132838A1/de
Priority to EP09737882.2A priority patent/EP2269238B1/de
Priority to JP2011506607A priority patent/JP5536755B2/ja
Priority to CN2009801154150A priority patent/CN102017202B/zh
Priority to KR1020107026602A priority patent/KR101351738B1/ko
Priority to US12/990,437 priority patent/US8796709B2/en
Publication of DE102008021435A1 publication Critical patent/DE102008021435A1/de
Priority to JP2013266947A priority patent/JP5763742B2/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
DE102008021435A 2008-04-29 2008-04-29 Gehäuse für LEDs mit hoher Leistung Ceased DE102008021435A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102008021435A DE102008021435A1 (de) 2008-04-29 2008-04-29 Gehäuse für LEDs mit hoher Leistung
PCT/EP2009/003109 WO2009132838A1 (de) 2008-04-29 2009-04-29 Gehäuse für leds mit hoher leistung
EP09737882.2A EP2269238B1 (de) 2008-04-29 2009-04-29 Gehäuse für leds mit hoher leistung und verfahren zu dessen herstellung
JP2011506607A JP5536755B2 (ja) 2008-04-29 2009-04-29 高出力ｌｅｄ用のハウジング
CN2009801154150A CN102017202B (zh) 2008-04-29 2009-04-29 外罩及其生产方法、基体、光电部件和照明装置
KR1020107026602A KR101351738B1 (ko) 2008-04-29 2009-04-29 고출력 ｌｅｄ용 하우징
US12/990,437 US8796709B2 (en) 2008-04-29 2009-04-29 Housing for high-power LEDs
JP2013266947A JP5763742B2 (ja) 2008-04-29 2013-12-25 高出力ｌｅｄ用のハウジング

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008021435A DE102008021435A1 (de) 2008-04-29 2008-04-29 Gehäuse für LEDs mit hoher Leistung

Publications (1)

Publication Number Publication Date
DE102008021435A1 true DE102008021435A1 (de) 2009-11-19

Family

ID=40910752

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008021435A Ceased DE102008021435A1 (de) 2008-04-29 2008-04-29 Gehäuse für LEDs mit hoher Leistung

Country Status (7)

Country Link
US (1) US8796709B2 (https=)
EP (1) EP2269238B1 (https=)
JP (2) JP5536755B2 (https=)
KR (1) KR101351738B1 (https=)
CN (1) CN102017202B (https=)
DE (1) DE102008021435A1 (https=)
WO (1) WO2009132838A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011013278A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System"
DE102011013277A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System"
DE102012211553A1 (de) * 2012-07-03 2014-01-09 Osram Gmbh Gehäuse für ein halbleiterleuchtmodul

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554680B2 (ja) * 2010-10-15 2014-07-23 スタンレー電気株式会社 発光素子搭載用基板、発光装置およびこれらの製造方法
JP2012154318A (ja) * 2011-01-06 2012-08-16 Ibiden Co Ltd 排ガス処理装置
DE102011013276A1 (de) 2011-03-07 2012-09-13 Schott Ag Glassystem zum hermetischen Verbund von Cu Bauteilen
WO2012119750A1 (de) 2011-03-07 2012-09-13 Schott Ag Glassystem zum hermetischen verbund von cu bauteilen sowie gehäuse für elektronische bauteile
JP6293995B2 (ja) * 2012-03-23 2018-03-14 新光電気工業株式会社 発光素子搭載用パッケージ及びその製造方法、並びに発光素子パッケージ
US9651236B2 (en) * 2014-01-31 2017-05-16 Christie Digital Systems Usa, Inc. Light emitting device with a heat sink composed of two materials
DE102014111278A1 (de) * 2014-08-07 2016-02-11 Osram Opto Semiconductors Gmbh Leuchtdioden-Halter sowie LED-Lampe oder Leuchte zur Beleuchtung
JP6005779B2 (ja) * 2015-03-02 2016-10-12 ローム株式会社 発光装置、発光装置の製造方法、および光学装置

Citations (4)

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GB2103420B (en) * 1981-06-30 1986-01-29 Shinko Electric Ind Co Gold-plated package for semiconductor devices
WO2004053933A2 (en) 2002-12-06 2004-06-24 Cree, Inc. Composite leadframe led package and method of making the same
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation

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US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
DE10118630A1 (de) * 2001-04-12 2002-10-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements
CN101789482B (zh) 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
JP4254470B2 (ja) 2003-10-10 2009-04-15 豊田合成株式会社 発光装置
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP4192742B2 (ja) * 2003-09-30 2008-12-10 豊田合成株式会社 発光装置
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
GB2413698B (en) * 2004-04-27 2006-04-05 Lingsen Precision Ind Ltd Led package and the process making the same
JP2006012868A (ja) 2004-06-22 2006-01-12 Toshiba Corp 半導体発光素子用パッケージおよびそれを用いた半導体発光装置
WO2006013731A1 (ja) 2004-08-06 2006-02-09 A. L. M. T. Corp. 集合基板、半導体素子搭載部材、半導体装置、撮像装置、発光ダイオード構成部材、および発光ダイオード
JP3977414B1 (ja) 2004-08-06 2007-09-19 株式会社アライドマテリアル 半導体素子搭載部材、半導体装置、撮像装置、発光ダイオード構成部材、および発光ダイオード
JP2006165029A (ja) * 2004-12-02 2006-06-22 Fujikura Ltd 発光素子実装用基板及び発光素子パッケージ体
JP4920214B2 (ja) * 2005-08-18 2012-04-18 パナソニック株式会社 電子部品用パッケージとその製造方法
CN100481537C (zh) * 2005-10-21 2009-04-22 台宙晶体科技股份有限公司 二极管发光装置制造方法及其结构
KR100780196B1 (ko) * 2006-02-27 2007-11-27 삼성전기주식회사 발광다이오드 패키지, 발광다이오드 패키지용 회로기판 및그 제조방법
DE202007003496U1 (de) 2007-03-08 2007-05-10 Tai, Yun Elektronische Einrichtung mit Wärmeabführung
US7563646B2 (en) * 2007-05-31 2009-07-21 Stratedge Corporation Molded ceramic surface mount package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2103420B (en) * 1981-06-30 1986-01-29 Shinko Electric Ind Co Gold-plated package for semiconductor devices
WO2004053933A2 (en) 2002-12-06 2004-06-24 Cree, Inc. Composite leadframe led package and method of making the same
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
US20040222433A1 (en) * 2003-05-05 2004-11-11 Lamina Ceramics Light emitting diodes packaged for high temperature operation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011013278A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System"
DE102011013277A1 (de) * 2011-03-07 2012-09-13 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "2-Lagen-System"
DE102011013278B4 (de) 2011-03-07 2020-06-18 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System"
DE102012211553A1 (de) * 2012-07-03 2014-01-09 Osram Gmbh Gehäuse für ein halbleiterleuchtmodul

Also Published As

Publication number Publication date
KR20110025900A (ko) 2011-03-14
EP2269238A1 (de) 2011-01-05
JP2011523502A (ja) 2011-08-11
JP2014078749A (ja) 2014-05-01
US8796709B2 (en) 2014-08-05
US20110108857A1 (en) 2011-05-12
CN102017202A (zh) 2011-04-13
JP5763742B2 (ja) 2015-08-12
EP2269238B1 (de) 2020-08-05
WO2009132838A1 (de) 2009-11-05
KR101351738B1 (ko) 2014-01-14
JP5536755B2 (ja) 2014-07-02
CN102017202B (zh) 2012-11-21

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R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final