CN100481537C - 二极管发光装置制造方法及其结构 - Google Patents
二极管发光装置制造方法及其结构 Download PDFInfo
- Publication number
- CN100481537C CN100481537C CNB2005101095264A CN200510109526A CN100481537C CN 100481537 C CN100481537 C CN 100481537C CN B2005101095264 A CNB2005101095264 A CN B2005101095264A CN 200510109526 A CN200510109526 A CN 200510109526A CN 100481537 C CN100481537 C CN 100481537C
- Authority
- CN
- China
- Prior art keywords
- backlight unit
- diode chip
- diode
- lens
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
Abstract
Description
玻璃种类 | 热膨胀系数(ppm/℃) |
1990(K,Na,Pb)硅酸玻璃 | 13.6 |
0800(Na,Ca)硅酸玻璃 | 10.5 |
0010(K,Na,Pb)硅酸玻璃 | 10.1 |
0120(K,Na,Pb)硅酸玻璃 | 9.7 |
7040(Na,K)硼硅酸玻璃 | 5.4 |
7050(Alkah,Ba)硼硅酸玻璃 | 5.1 |
7052(Alkah)硼硅酸玻璃 | 5.3 |
7056(Alkah)硼硅酸玻璃 | 5.6 |
7070(Li,K)硼硅酸玻璃 | 3.9 |
7720(Na,Pb)硼硅酸玻璃 | 4.3 |
Claims (25)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101095264A CN100481537C (zh) | 2005-10-21 | 2005-10-21 | 二极管发光装置制造方法及其结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101095264A CN100481537C (zh) | 2005-10-21 | 2005-10-21 | 二极管发光装置制造方法及其结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1953218A CN1953218A (zh) | 2007-04-25 |
CN100481537C true CN100481537C (zh) | 2009-04-22 |
Family
ID=38059425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101095264A Expired - Fee Related CN100481537C (zh) | 2005-10-21 | 2005-10-21 | 二极管发光装置制造方法及其结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100481537C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200452842Y1 (ko) | 2007-03-08 | 2011-03-25 | 허 샨 라이드 일렉트로닉 엔터프라이즈 컴퍼니 엘티디. | 고출력 엘이디 |
DE102008021435A1 (de) * | 2008-04-29 | 2009-11-19 | Schott Ag | Gehäuse für LEDs mit hoher Leistung |
CN101752465B (zh) * | 2008-12-11 | 2012-01-25 | 浙江古越龙山电子科技发展有限公司 | 大功率发光二极管透镜封装方法 |
EP2421038A1 (en) * | 2009-04-10 | 2012-02-22 | Foshan Nationstar Optoelectronics Co., Ltd | Radiation substrate for power led and power led production and manufacturing method thereof |
WO2011123985A1 (zh) * | 2010-04-08 | 2011-10-13 | 盈胜科技股份有限公司 | 制作多层发光二极管阵列的方法 |
CN102280569B (zh) * | 2011-08-22 | 2013-10-30 | 佛山市国星光电股份有限公司 | 高导热基板及led器件及led组件 |
-
2005
- 2005-10-21 CN CNB2005101095264A patent/CN100481537C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1953218A (zh) | 2007-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: TAIZHOU CRYSTAL SCIENCE CO., LTD. Free format text: FORMER OWNER: SONGSHENG OPTO-ELECTRICAL SCIENCE CO., LTD. Effective date: 20080425 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20080425 Address after: Miaoli County of Taiwan Applicant after: Taichou Crystal Technology Co., Ltd. Address before: Taipei City, Taiwan, China Applicant before: Headlite-tech Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20091123 |