DE102006000476A1 - Lichtemissionsvorrichtung - Google Patents

Lichtemissionsvorrichtung Download PDF

Info

Publication number
DE102006000476A1
DE102006000476A1 DE102006000476A DE102006000476A DE102006000476A1 DE 102006000476 A1 DE102006000476 A1 DE 102006000476A1 DE 102006000476 A DE102006000476 A DE 102006000476A DE 102006000476 A DE102006000476 A DE 102006000476A DE 102006000476 A1 DE102006000476 A1 DE 102006000476A1
Authority
DE
Germany
Prior art keywords
light
light emitting
opening
emitting device
emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102006000476A
Other languages
German (de)
English (en)
Inventor
Toshimasa Hayashi
Takumi Narita
Hiroaki Kawaguchi
Peter Pachler
Christian Hochfilzer
Stefan Tasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic Jennersdorf GmbH
Lexedis Lighting GmbH
Toyoda Gosei Co Ltd
Original Assignee
Tridonic Optoelectronics GmbH
Lexedis Lighting GmbH
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Optoelectronics GmbH, Lexedis Lighting GmbH, Toyoda Gosei Co Ltd filed Critical Tridonic Optoelectronics GmbH
Publication of DE102006000476A1 publication Critical patent/DE102006000476A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Led Device Packages (AREA)
DE102006000476A 2005-09-22 2006-09-21 Lichtemissionsvorrichtung Ceased DE102006000476A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005-276858 2005-09-22
JP2005276858 2005-09-22
JP2006-256481 2006-09-21
JP2006256481A JP2007116138A (ja) 2005-09-22 2006-09-21 発光装置

Publications (1)

Publication Number Publication Date
DE102006000476A1 true DE102006000476A1 (de) 2007-05-24

Family

ID=37901037

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006000476A Ceased DE102006000476A1 (de) 2005-09-22 2006-09-21 Lichtemissionsvorrichtung

Country Status (3)

Country Link
US (1) US20070075306A1 (https=)
JP (1) JP2007116138A (https=)
DE (1) DE102006000476A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112018003249B4 (de) 2017-06-27 2023-06-29 Ngk Insulators, Ltd. Transparentes Einkapselungselement und Verfahren zu dessen Herstellung

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792128B2 (ja) * 1989-08-02 1998-08-27 株式会社豊田自動織機製作所 ジェットルームにおける緯入れ制御方法
US7339198B2 (en) * 2004-01-16 2008-03-04 Yu-Nung Shen Light-emitting diode chip package body and packaging method thereof
KR100724591B1 (ko) * 2005-09-30 2007-06-04 서울반도체 주식회사 발광 소자 및 이를 포함한 ｌｅｄ 백라이트
JP2007201420A (ja) * 2005-12-27 2007-08-09 Sharp Corp 半導体発光装置、半導体発光素子、および半導体発光装置の製造方法
US8323529B2 (en) * 2006-03-16 2012-12-04 Seoul Semiconductor Co., Ltd. Fluorescent material and light emitting diode using the same
CN101523625B (zh) * 2006-10-12 2012-05-23 松下电器产业株式会社 发光装置及其制造方法
US7538340B2 (en) * 2006-12-01 2009-05-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Low side emitting light source and method of making the same
TWI341038B (en) * 2006-12-18 2011-04-21 Delta Electronics Inc Electroluminescence module
KR100858287B1 (ko) 2007-05-04 2008-09-11 한국광기술원 표면 실장을 하지 않는 발광 다이오드 패키지 및 그의 제작방법
KR100900866B1 (ko) * 2007-05-09 2009-06-04 삼성전자주식회사 나노결정-금속산화물 복합체를 이용하는 발광 다이오드소자 및 그의 제조방법
KR100880638B1 (ko) 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
JP2009071254A (ja) * 2007-08-23 2009-04-02 Panasonic Electric Works Co Ltd 発光装置
DE102007041133A1 (de) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh Gehäuse mit einem Gehäuseunterteil, sowie Verfahren zur Aussendung elektromagnetischer Strahlung
WO2009031084A1 (en) * 2007-09-04 2009-03-12 Koninklijke Philips Electronics N.V. Light output device
EP2248390B1 (en) * 2008-02-27 2015-09-30 Koninklijke Philips N.V. Illumination device with led and one or more transmissive windows
JP5665160B2 (ja) * 2008-03-26 2015-02-04 パナソニックＩｐマネジメント株式会社 発光装置および照明器具
RU2496182C2 (ru) * 2008-04-08 2013-10-20 Конинклейке Филипс Электроникс Н.В. Осветительное устройство с сид и передающим основанием, включающим люминесцентный материал
DE102008025491A1 (de) * 2008-05-28 2009-12-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Leiterplatte
US8188486B2 (en) * 2008-09-16 2012-05-29 Osram Sylvania Inc. Optical disk for lighting module
JP5431706B2 (ja) * 2008-10-01 2014-03-05 ミネベア株式会社 発光装置
JP2010135488A (ja) * 2008-12-03 2010-06-17 Toshiba Corp 発光装置及びその製造方法
JP5107882B2 (ja) * 2008-12-11 2012-12-26 日東電工株式会社 光半導体封止用シート
CN101752483B (zh) * 2008-12-15 2011-09-28 富士迈半导体精密工业（上海）有限公司 发光二极管
JP4823300B2 (ja) * 2008-12-17 2011-11-24 株式会社東芝 半導体発光装置
JP4604123B2 (ja) * 2009-03-31 2010-12-22 シャープ株式会社 光源モジュールおよび該モジュールを備えた電子機器
JP2011014890A (ja) 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
JP5332960B2 (ja) * 2009-06-30 2013-11-06 日亜化学工業株式会社 発光装置
WO2011024934A1 (ja) * 2009-08-27 2011-03-03 京セラ株式会社 発光装置
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
CN102130268A (zh) * 2010-01-19 2011-07-20 富士迈半导体精密工业（上海）有限公司 固态发光元件及光源模组
JP2011171376A (ja) * 2010-02-16 2011-09-01 Olympus Corp 発光装置
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US20130199771A1 (en) * 2010-04-13 2013-08-08 Ube Industries, Ltd. Heat-dissipating substrate for led
US20130043502A1 (en) * 2010-05-31 2013-02-21 Panasonic Corporation Light emitting device and method for manufacturing the same
TWI520386B (zh) * 2010-07-29 2016-02-01 神基科技股份有限公司 發光二極體總成的結構與其製造方法
JP2012079723A (ja) * 2010-09-30 2012-04-19 Toyoda Gosei Co Ltd 発光装置
KR20120050282A (ko) 2010-11-10 2012-05-18 삼성엘이디 주식회사 발광 소자 패키지 및 그 제조 방법
TWI463694B (zh) * 2010-12-07 2014-12-01 Epistar Corp 發光元件
JP2013030599A (ja) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd 発光デバイスおよび照明器具
JP2013077798A (ja) * 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd ガラス封止ｌｅｄランプ及びその製造方法
US8733969B2 (en) * 2012-01-22 2014-05-27 Ecolivegreen Corp. Gradient diffusion globe LED light and fixture for the same
WO2013175752A1 (ja) * 2012-05-25 2013-11-28 日本電気株式会社 波長変換部材、光学素子、発光装置、及び投影装置
KR20140044103A (ko) * 2012-10-04 2014-04-14 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US8876330B2 (en) * 2012-11-15 2014-11-04 Illinois Tool Works Inc. Illumination device
JP2014123014A (ja) * 2012-12-21 2014-07-03 Casio Comput Co Ltd 光源装置、プロジェクタ
JP6212989B2 (ja) * 2013-06-28 2017-10-18 日亜化学工業株式会社 発光装置およびその製造方法
DE102013214235A1 (de) * 2013-07-19 2015-01-22 Osram Gmbh Leuchtvorrichtung mit Halbleiterlichtquellen und umlaufendem Damm
JP6225812B2 (ja) * 2014-04-18 2017-11-08 日亜化学工業株式会社 発光装置
US10032969B2 (en) * 2014-12-26 2018-07-24 Nichia Corporation Light emitting device
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置
TWI702362B (zh) * 2017-07-13 2020-08-21 東貝光電科技股份有限公司 Ｌｅｄ發光裝置
KR102528528B1 (ko) * 2018-02-05 2023-05-04 엘지이노텍 주식회사 반도체 소자 패키지 및 이를 포함하는 발광장치
JP7231809B2 (ja) * 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置
JP7475360B2 (ja) * 2019-10-30 2024-04-26 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
JP7779706B2 (ja) * 2021-11-22 2025-12-03 スタンレー電気株式会社 半導体発光装置及び半導体発光モジュール
JP7626947B2 (ja) * 2022-06-24 2025-02-05 日亜化学工業株式会社 発光モジュール

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0983018A (ja) * 1995-09-11 1997-03-28 Nippon Denyo Kk 発光ダイオードユニット
JP3185977B2 (ja) * 1998-08-12 2001-07-11 スタンレー電気株式会社 Ｌｅｄランプ
JP4061869B2 (ja) * 2001-07-26 2008-03-19 松下電工株式会社 発光装置の製造方法
JP2003046135A (ja) * 2001-07-27 2003-02-14 Matsushita Electric Ind Co Ltd 半導体発光装置
DE10137641A1 (de) * 2001-08-03 2003-02-20 Osram Opto Semiconductors Gmbh Hybrid-LED
CN1464953A (zh) * 2001-08-09 2003-12-31 松下电器产业株式会社 Led照明装置和卡型led照明光源
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
DE10245930A1 (de) * 2002-09-30 2004-04-08 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Bauelement-Modul
JP2004161871A (ja) * 2002-11-12 2004-06-10 Nichia Chem Ind Ltd 燒結蛍光体層
JP2004349646A (ja) * 2003-05-26 2004-12-09 Matsushita Electric Works Ltd 発光装置
JP4366161B2 (ja) * 2003-09-19 2009-11-18 スタンレー電気株式会社 半導体発光装置
JP4285198B2 (ja) * 2003-10-28 2009-06-24 パナソニック電工株式会社 発光装置
JP4788109B2 (ja) * 2003-10-28 2011-10-05 パナソニック電工株式会社 半導体発光装置及びその製造方法
JP2005158963A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP4821087B2 (ja) * 2003-11-28 2011-11-24 パナソニック電工株式会社 発光装置
JP5349755B2 (ja) * 2003-12-09 2013-11-20 ジーイー ライティング ソリューションズ エルエルシー 表面実装の発光チップパッケージ
JP2005175048A (ja) * 2003-12-09 2005-06-30 Sanken Electric Co Ltd 半導体発光装置
JP4622253B2 (ja) * 2004-01-22 2011-02-02 日亜化学工業株式会社 発光デバイス及びその製造方法
JP4480407B2 (ja) * 2004-01-29 2010-06-16 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP4747726B2 (ja) * 2004-09-09 2011-08-17 豊田合成株式会社 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112018003249B4 (de) 2017-06-27 2023-06-29 Ngk Insulators, Ltd. Transparentes Einkapselungselement und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
JP2007116138A (ja) 2007-05-10
US20070075306A1 (en) 2007-04-05

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
R081 Change of applicant/patentee

Owner name: TRIDONIC JENNERSDORF GMBH, AT

Free format text: FORMER OWNERS: LEXEDIS LIGHTING GESMBH, JENNERSDORF, AT; TRIDONIC OPTOELECTRONICS GESMBH, JENNERSDORF, AT; TOYODA GOSEI CO., LTD., AICHI-KEN, JP

Owner name: TOYODA GOSEI CO., LTD., JP

Free format text: FORMER OWNERS: LEXEDIS LIGHTING GESMBH, JENNERSDORF, AT; TRIDONIC OPTOELECTRONICS GESMBH, JENNERSDORF, AT; TOYODA GOSEI CO., LTD., AICHI-KEN, JP

Owner name: LEXEDIS LIGHTING GESMBH, AT

Free format text: FORMER OWNERS: LEXEDIS LIGHTING GESMBH, JENNERSDORF, AT; TRIDONIC OPTOELECTRONICS GESMBH, JENNERSDORF, AT; TOYODA GOSEI CO., LTD., AICHI-KEN, JP

R082 Change of representative

Representative=s name: TBK, DE

R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final