CS214655B2 - Method of cleaning the objects following galvanic and/or chemical treatment of the surface and facility for executing the same - Google Patents
Method of cleaning the objects following galvanic and/or chemical treatment of the surface and facility for executing the same Download PDFInfo
- Publication number
- CS214655B2 CS214655B2 CS788347A CS834778A CS214655B2 CS 214655 B2 CS214655 B2 CS 214655B2 CS 788347 A CS788347 A CS 788347A CS 834778 A CS834778 A CS 834778A CS 214655 B2 CS214655 B2 CS 214655B2
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- surface treatment
- suction
- cleaning
- drum
- liquid
- Prior art date
Links
- 239000000126 substance Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 25
- 238000004140 cleaning Methods 0.000 title claims description 22
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000004381 surface treatment Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000012756 surface treatment agent Substances 0.000 claims description 14
- 239000008199 coating composition Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000008237 rinsing water Substances 0.000 description 4
- 239000003570 air Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2758550A DE2758550C2 (de) | 1977-12-23 | 1977-12-23 | Verfahren zur Entfernung von Restmengen einer Behandlungsflüssigkeit von Gegenständen und Vorrichtung zur Durchführung des Verfahrens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CS214655B2 true CS214655B2 (en) | 1982-05-28 |
Family
ID=6027556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS788347A CS214655B2 (en) | 1977-12-23 | 1978-12-14 | Method of cleaning the objects following galvanic and/or chemical treatment of the surface and facility for executing the same |
Country Status (10)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3133629A1 (de) * | 1981-08-21 | 1983-03-03 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Vorrichtung und verfahren zur reinigung von gegenstaenden von anhaftenden fluessigen behandlungsmitteln und deren rueckgewinnung |
| DE3229455A1 (de) * | 1982-08-06 | 1984-02-09 | Hans 8500 Nürnberg Henig | Verfahren und vorrichtung zur rueckgewinnung von behandlungsloesungen in anlagen zur galvanischen und/oder chemischen oberflaechenbehandlung |
| DE3879929D1 (de) * | 1988-02-25 | 1993-05-06 | Schmid Gmbh & Co Geb | Vorrichtung zur behandlung von elektrischen leiterplatten. |
| DE4124183A1 (de) * | 1991-07-20 | 1993-01-21 | Schering Ag | Anordnung zum entfernen der behandlungsfluessigkeit von einem gut nach seiner chemischen oder elektrochemischen oberflaechenbehandlung |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE41353C (de) * | O. SCHULZ in Berlin SO., Naunynstr. 69 | Verfahren, Metallgegenstände durch Evacuiren von den in die Poren eingedrungenen oxydirenden Flüssigkeiten zu befreien | ||
| US2395397A (en) * | 1940-03-20 | 1946-02-26 | Blaw Knox Co | Apparatus for cleaning strip metal |
| GB731543A (en) * | 1952-07-14 | 1955-06-08 | James Alexander Gordon | A new or improved machine for cleaning and/or degreasing strip material |
| DE1916786U (de) * | 1964-11-25 | 1965-05-26 | Schering Ag | Vorrichtung zur trocknung galvanisch behandelter massenteile im vakuum. |
| DE1757181A1 (de) * | 1968-04-09 | 1972-04-06 | Fuetterer Paul | Verfahren zum maschinellen Reinigen von kleineren Gebinden,insbesondere Kanistern fuer Mineraloel und Vorrichtung zur Durchfuehrung dieses Verfahrens |
| DE1771725A1 (de) * | 1968-06-29 | 1971-12-30 | Demag Ag | Verfahren zum kontinuierlichen Entfernen von Feuchtigkeitsrueckstaenden von der Oberflaeche metallischer Baender |
| JPS4913020B1 (enrdf_load_stackoverflow) * | 1969-11-18 | 1974-03-28 | ||
| DE2125102A1 (de) * | 1971-05-19 | 1972-11-30 | Anton Huber Gmbh & Co Kg, 8050 Freising | Verfahren und Einrichtung zum Reinigen einer Anzahl kleiner Gegenstände |
| US3885499A (en) * | 1973-12-20 | 1975-05-27 | Hercules Inc | Thermal detonation energy-initiatable blasting caps, and detonation system and method |
| DE2416419C2 (de) * | 1974-04-04 | 1984-01-05 | Agfa-Gevaert Ag, 5090 Leverkusen | Vorrichtung zum kontinuierlichen Reinigen von bandförmigen flexiblen Schichtträgern |
| JPS5122268A (en) * | 1974-08-17 | 1976-02-21 | Yasuji Kotsutsumi | Handososano eaajojinki |
| JPS5125434A (ja) * | 1974-08-28 | 1976-03-02 | Inoue Japax Res | Renzokumetsukisochi |
| JPS5127822A (ja) * | 1974-09-02 | 1976-03-09 | Inoue Japax Res | Metsukisochi |
-
1977
- 1977-12-23 DE DE2758550A patent/DE2758550C2/de not_active Expired
-
1978
- 1978-12-12 SU SU782696906A patent/SU961566A3/ru active
- 1978-12-14 CS CS788347A patent/CS214655B2/cs unknown
- 1978-12-19 SE SE7813041A patent/SE7813041L/xx unknown
- 1978-12-20 GB GB7849198A patent/GB2013718B/en not_active Expired
- 1978-12-20 JP JP15654978A patent/JPS54119766A/ja active Granted
- 1978-12-20 CH CH1297178A patent/CH641697A5/de not_active IP Right Cessation
- 1978-12-21 AT AT914578A patent/AT360812B/de not_active IP Right Cessation
- 1978-12-22 FR FR7836109A patent/FR2412357A1/fr active Granted
- 1978-12-22 IT IT31204/78A patent/IT1101589B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| GB2013718A (en) | 1979-08-15 |
| GB2013718B (en) | 1982-06-09 |
| JPH0127154B2 (enrdf_load_stackoverflow) | 1989-05-26 |
| SU961566A3 (ru) | 1982-09-23 |
| FR2412357A1 (fr) | 1979-07-20 |
| CH641697A5 (de) | 1984-03-15 |
| IT7831204A0 (it) | 1978-12-22 |
| JPS54119766A (en) | 1979-09-17 |
| SE7813041L (sv) | 1979-06-24 |
| FR2412357B1 (enrdf_load_stackoverflow) | 1985-01-18 |
| DE2758550A1 (de) | 1979-06-28 |
| IT1101589B (it) | 1985-10-07 |
| ATA914578A (de) | 1980-06-15 |
| DE2758550C2 (de) | 1986-01-30 |
| AT360812B (de) | 1981-02-10 |
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