CN1934690A - 焊料组成物和使用该焊料组成物的隆起形成方法 - Google Patents

焊料组成物和使用该焊料组成物的隆起形成方法 Download PDF

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Publication number
CN1934690A
CN1934690A CNA2005800090261A CN200580009026A CN1934690A CN 1934690 A CN1934690 A CN 1934690A CN A2005800090261 A CNA2005800090261 A CN A2005800090261A CN 200580009026 A CN200580009026 A CN 200580009026A CN 1934690 A CN1934690 A CN 1934690A
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solder composition
semiconductor particles
solder
composition
mother metal
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CN100501955C (zh
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坂本伊佐雄
小野崎纯一
古野雅彦
齐藤浩司
安藤晴彦
白井大
平塚笃志
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Japan Science and Technology Agency
Tamura Corp
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Japan Science and Technology Agency
Tamura Corp
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract

一种焊料组成物(10)，由液态体(12)和焊料粒子(11)的混合物组成，液态体(12)含有除去氧化膜的反应温度在所述焊料粒子的熔点附近的有机酸组成的熔接剂成分，且具有在常温下流动而在基板(20)上堆积成层状的粘性。焊料粒子(11)在液态体(12)内向焊接母材上沉淀，同时是具有可均匀分散在液态体(12)内的混合比和粒径的粒剂。通过将这样的焊料组成物在具有垫式电极(22)的基板(20)上涂布、加热，焊料粒子(11)附着在与熔接剂成分反应而被除去了表面氧化膜的垫式电极(22)上，促进形成在母材上的焊料皮膜与焊料粒子(11)的焊接，焊料粒子(11)彼此的结合被熔接剂成分的反应生成物阻碍，形成没有焊桥的焊料隆起(23)。采用本发明，可提供在基板上形成隆起时可简化涂布工序的焊料组成物。

Description

焊料组成物和使用该焊料组成物的隆起形成方法
                            技术领域
本发明涉及诸如在半导体基板或插入式基板上形成突起状的焊料隆起来制造FC(flipchip)或BGA(ball grid array)时所使用的焊料组成物，以及使用该焊料组成物的隆起形成方法。
                            背景技术
现有一般的焊料隆起形成方法为：使用丝网印刷法(screen printing)或分配法(dispensing method)等在基板的垫式电极(pad electrode)上涂布糊状钎焊料(solderpaste)，加热后回流(reflow)该糊状钎焊料。该糊状钎焊料也被称作“膏状焊剂”。
一方面，在专利文献1中，记载有由特殊的焊料粉末与熔接剂的混合物形成的糊状钎焊料。该焊料粉末是通过使焊料粒子在空气中流动、在焊料粒子的表面形成氧化膜而成。这种强制地形成的氧化膜在回流时克服熔接剂作用从而抑制焊料粒子的结合。因此，在基板上全面涂抹该糊状钎焊料而回流时，在垫式电极间难以产生焊桥，因而，适合于垫式电极的高密度化和细微化。由于焊料粒子结合形成大的块而与相邻的垫式电极两方连接，从而引起垫式电极间的焊桥。
专利文献1：日本特开2000-94179号公报
                            发明内容
发明要解决的技术问题
这样，在现有的焊料隆起的形成中使用了糊状钎焊料。然而，糊状钎焊料存在下述问题：
(1)在基板上涂布糊状钎焊料时，需要印刷机或排出机等设备，而且为了在正确的位置上执行印刷和排出，需要花费时间和劳动力。即使全面涂抹不需要精密的掩模，但仍需要使用涂刷器或刮刀使糊状钎焊料形成均匀厚度的工序。
(2)丝网印刷法或分配法正在难以对付近年的更加多电极化、高密度化及微细化。即，采用丝网印刷法产生如下问题：由于需要使金属掩模的开口微细化，导致金属掩膜的机械强度降低，或从金属掩膜的开口流出糊状钎焊料变得困难。采用分配法，由于在大量垫式电极之上一个个地放置糊状钎焊料，垫式电极越多就越不适合大量生产。
(3)在专利文件1的糊状钎焊料中，必须形成高精度的焊料粒子的氧化膜的膜厚。因为太厚时在垫式电极上焊料就不能沾润，太薄时焊料粒子就会结合。此外，由于熔接剂的作用随着熔接剂的状态或种类的不同而变化，因此有必要根据熔接剂的情况高精度地控制氧化膜的膜厚。如果不能形成适当膜厚的氧化膜，就不能实现垫式电极的高密度化和微细化。
本发明的第一个目的在于，提供一种能够简化在基板上的涂布工序的焊料组成物和使用该焊料组成物的隆起形成方法。本发明的第二个目的在于，提供一种不需要形成焊料粒子氧化膜的工序就能可靠地实现制造工序的简化和焊料隆起的高密度化以及细微化的焊料组成物和使用该焊料组成物的焊料隆起形成方法。
解决问题的技术手段
为了达到前述目的，本发明的焊料组成物的特征在于，焊料组成物是液态体与焊料粒子的混合物，所述液态体包含反应温度在所述焊料粒子的熔点附近的熔接剂成分，且具有在常温下流动而在母材上堆积成层状的粘性，所述焊料粒子在所述液态体内向母材沉淀，同时是具有能均匀地分散在所述液态体内的混合比及粒径的粒剂。
本发明的焊料组成物的含有熔接剂成分的液态体在常温下流动而在母材上堆积成层状，因此在这方面与糊状钎焊料完全不同。为了得到这样的性质(流动性)，要求液态体常温下的粘度低、焊料粒子的混合比小及焊料粒子的粒径小。焊料粒子的粒径被设定在35μm～1μm附近的范围内。并且，比如焊料粒子的粒径最好这样设定：较好是35μm或以下，更好是20μm或以下，最好是10μm或以下。
又，本发明的焊料组成物也可以是如下构成。焊料粒子的表面氧化膜只具有自然氧化膜。液态体的熔接剂成分通过其反应生成物来抑制焊料粒子彼此结合，促进焊料粒子和母材之间的焊接，同时促进母材上所形成的焊料皮膜与焊料粒子的结合。这样的熔接剂成分是本发明者反复进行实验和研究而发现的成分。
作为这样的熔接剂成分比如可列举出酸。酸可大致分为无机酸(如盐酸)和有机酸(如脂肪酸)，在此以有机酸为例来说明。
本发明者发现“有机酸使焊料粒子结合的作用小，但在垫式电极上产生焊料沾润的作用却大。”。产生这样作用的理由认为是以下(1)、(2)两点。
(1)有机酸除去焊料粒子的氧化膜的作用弱。因此，即使不故意在焊料粒子上形成氧化膜，由焊料粒子的自然氧化膜也可以抑制焊料粒子之间的结合。因此，在本发明中，不需要形成焊料粒子的氧化膜的工序。另一方面，在专利文献1的现有技术中，熔接剂的作用过强，因此若不在焊料粒子上形成厚的氧化膜，焊料粒子就会彼此结合。
(2)有机酸具有因某些理由使焊料粒子在母材上蔓延而使界面合金化，同时使焊料粒子与母材上所形成的焊料皮膜结合的作用。虽然焊料粒子彼此几乎不结合，但在母材上发生焊料沾润的机理却不清楚。作为推测，认为在焊料粒子和母材之间发生了轻微的破坏氧化膜的某些反应。比如，如果是镀金的母材，由于金向焊料中的扩散效果，即使在焊料粒子上有薄的氧化膜也会产生焊料沾润。铜组成的母材时，铜与有机酸反应生成有机酸铜盐，通过该有机酸铜盐与焊料接触，由于离子化能力的差别而被还原，金属铜扩散到焊料中而进行焊料沾润。焊料粒子与母材上所形成的焊料皮膜结合的理由被认为是比如表面张力。
又，与焊料粒子一同混合的液态体也可以是油脂，该液态体中所含有的熔接剂成分也可以是油脂中所含有的游离脂肪酸。油脂具有各式各样的用途而广泛流通，因此很易于购入、价格便宜且无害，且原来就含有游离脂肪酸这样的有机酸(熔接剂成分)。特别是，脂肪酸酯(如季戊烷多元醇酯：ネオペンチルポリオ一ルエステル)一般具有优良的热稳定性、氧化稳定性，因此，最适合作为焊接的熔接剂。又，为了形成作为熔接剂成分的游离脂肪酸的含有量充分的材料，油脂的酸值最好是1或1以上。酸值就是中和油脂中所含有的游离脂肪酸所需要的氢氧化钾的毫克数。即，酸值越大，所含有的游离脂肪酸越多。
本发明所用的焊料组成物中使用的油脂一直存在到隆起形成结束，通过在这期间防止焊料与空气直接接触，抑制焊料的氧化。又，油脂所含有的有机酸虽有助于除去焊料表面的氧化膜，但对有机酸的含有量加以控制以使不完全除去焊料表面的氧化膜。由此，可实现边抑制焊料粒子之间的结合，边可焊接到母材表面上的状态。有机酸有必要具有除去母材表面的氧化膜所需的量，由此油脂的酸值最好是1或1以上。
本发明所用的焊料组成物也可以是在油脂中含有有机酸(熔接剂成分)。该有机酸既可是原来就在油脂中含有的，也可是后来添加的。有机酸具有还原焊料粒子和母材的氧化膜的效果。又，本发明者发现通过得当地控制油脂中的有机酸量而在粒子的表面残留稍许氧化膜，边抑制焊料粒子彼此的结合，边可焊接到母材上。又，本发明者发现焊料中含有锡时，在有机酸还原焊料表面的氧化膜的过程中有机酸锡盐作为副生成物而被得到，该有机酸锡盐极大地抑制焊料粒子彼此的结合。通过控制这些现象，边防止焊料粒子彼此的结合，比如边可以在垫式电极上形成不发生短路的焊料隆起。
本发明的隆起形成方法包括将本发明的焊料组成物在母材上堆积成层状的堆积工序和将母材上的焊料组成物加热后回流的回流工序。将本发明的焊料组成物滴到母材上时，焊料组成物因自重蔓延而堆积成层状。这时，在常温下即可，且可以利用焊料组成物的自然流下。由此，即使不采用印刷机和排出机，也可以简单地将焊料组成物涂布在母材上。
又，也可以在堆积工序之前设有通过搅拌焊料组成物而使焊料粒子均匀地分散在液态体中的搅拌工序。此时，即使焊料粒子由于比重差沉淀在液态体内，通过搅拌焊料组成物，焊料粒子也能均匀分散在液态体内并相对于母材均匀分布。
又，也可以在堆积工序中或之后，设有通过将母材水平旋转而使焊料组成物形成均匀的厚度的旋转涂布工序。通过水平旋转基板，母材上多余的焊料组成物被甩开，因此母材上的焊料组成物的厚度快速均匀且较薄地均匀及更正确地均匀。
又，也可以在堆积工序中，通过将母材放入容器内后将焊料组成物注入，在容器内将母材浸入焊料组成物中。此时，母材上的焊料组成物的厚度不依赖于焊料组成物的表面张力和粘度，可以是任意的值。另外，在糊状钎焊料中，是通过调整印刷厚度和焊料粒子的含有量，来改变焊料隆起大小(高度)的。与之相对，在本发明中，因为没有使用掩模，在变更焊料组成物的厚度时，不需要像现有技术那样变更掩模的厚度和开口直径，只要调整焊料组成物的滴下量，就可以简单地改变隆起的大小(高度)。
另外，在此所说的“焊料”不限于用于形成焊料隆起，也可包含有半导体片的管心焊接用和比如接合铜管所采用的称为“软焊料”等，当然也含有无铅焊料。“焊料隆起”不限于半球状和突起状，也含有膜状物。“焊料皮膜”不限于膜状物，也包含半球状和突起状物。“基板”含有半导体片和配线板等。“液态体”也可以是液体之外的其他流动体等，除油脂之外也可是其他氟系高沸点溶剂和氟系油等。
发明效果
采用本发明的焊料组成物，在常温的状态下滴到平面上时，液态体及焊料粒子一同因自重蔓延而堆积成层状，因此即使不采用印刷机和排出机，也可以简单地将焊料组成物涂布在母材上。
又，采用本发明的焊料组成物，焊料粒子的表面氧化膜只具有自然氧化膜，与焊料粒子一同混合的液态体含有特殊的熔接剂成分，由该熔接剂成分的反应生成物，在回流时抑制焊料粒子彼此的结合，通过焊料粒子在垫式电极上蔓延而与母材上的焊料皮膜结合，抑制焊桥的发生，同时可以进行焊接。并且，不需要形成焊料粒子的氧化膜的工序，因此可以简化制造工序，同时不需要正确地控制氧化膜的厚度，故可以可靠地进行高密度和微细的焊接。即，采用本发明的焊料组成物，焊料粒子在熔化时焊料粒子彼此的结合少，因此即使对于诸如窄间距的垫式电极，也可形成焊料量的偏差少且垫式电极之间不发生短路的焊料隆起。
液态体中含有的熔接剂成分是有机酸时，由于在除去焊料粒子的自然氧化膜的过程中生成的有机金属盐抑制焊料粒子彼此的结合，可以容易得到所述的熔接剂成分的作用。
与焊料粉末一同混合的液态体是油脂时，可以降低制造成本，同时即使成为废弃物也可以减轻对环境的影响。并且，油脂中原来就含有游离脂肪酸这样的有机酸，因此可以省略添加有机酸。
油脂为脂肪酸酯时，脂肪酸酯是最普通的油脂，因此可以更加降低制造成本，并且脂肪酸酯具有优良的热稳定性和氧化稳定性，因此可以最适合在焊接时使用。又，脂肪酸酯与作为活性剂使用的有机酸之间的相溶性良好，故可以提高液体特性的稳定性。
在油脂的酸值是1或1以上时，由于含有充分的游离脂肪酸(溶接剂成分)，可以适当的除去垫式电极和焊料粒子的氧化膜，因此可以提高焊料的沾润性。
采用本发明的形成方法，通过设置将本发明的焊料组成物在母材上堆积成层状的堆积工序和加热焊料组成物后回流的回流工序，即使不采用印刷机和排出机，也可以简单地将焊料组成物涂布在母材上，因此可以提高生产性。
在堆积工序前设有搅拌工序时，可以使焊料粒子在母材上分布更均匀。
在堆积工序中或之后设有旋转涂布工序时，母材上的焊料组成物的厚度快速均匀且较薄地均匀及更正确的均匀。
堆积工序中将母材浸入焊料组成物时，能将母材上的焊料组成物的厚度设定为所期望的值。也就是说，只要调整焊料组成物的滴下量，就可以简单地改变焊料隆起的大小(高度)。
                            附图的简单说明
图1是表示本发明的焊料组成物的实施方式的剖视图。
图2是表示本发明的隆起形成方法的实施方式的剖视图(滴下工序)，工序按图2[1]~图2[3]顺序进行。
图3是表示本发明的隆起形成方法的实施方式的剖视图(回流工序)，工序按图3[1]~图3[3]顺序进行。
                            实施发明的最佳方式
图1是表示本发明的焊料组成物的实施方式的剖视图。下面根据附图来说明。另外，图1是在基板上涂布了焊料组成物的状态，与左右方向相比将上下方向进行了放大表示。
本实施方式的焊料组成物10由许多焊料粒子11和由脂肪酸酯组成的液态体12的混合物组成，比如被用于在垫式电极22上形成焊料隆起。并且，液态体12含有反应温度在焊料粒子11的熔点附近的熔接剂成分，且具有在常温下流动而在母材的一个例子即基板20上堆积成层状的粘性。焊料粒子11在液态体12内向母材的一个例子即基板20上沉淀，同时是具有能均匀分散在液态体12内的混合比和粒径的粒剂。
又，焊料粒子11的表面氧化膜只有自然氧化膜(未图示)。液态体12是脂肪酸酯，因此原来就含有有机酸的一种即游离脂肪酸(熔接剂成分)。游离脂肪酸具有如下作用：在被加热到焊料粒子11的熔点或以上的状态下，通过其反应生成物抑制焊料粒子11彼此的结合，同时促进焊料粒子11和垫式电极22之间的焊接，并促进在垫式电极22上所形成的焊料皮膜与焊料粒子11之间的结合。
液态体12所含有的有机酸也可以根据需要添加。也就是说，根据焊料粒子11的氧化程度和分量，调整液态体12的有机酸含有量。比如，在形成大量的焊料隆起时，焊料粒子11也变得大量，因此为了还原全部的焊料粒子11的氧化膜，又必要含有充分的有机酸。另一方面，添加了超过形成隆起所需的过剩的焊料粒子11时，通过减少有机酸的含有量而降低液态体12的活性，使焊料粉末粒度分布中的属于微细侧的焊料粒子11不被熔化，仅使比较大的焊料粒子11形成最合适的隆起。此时，残留的未熔化的微细的焊料粒子11具有通过防止焊料粒子11相互之间的结合来减少垫式电极22的短路的效果。
焊料粒子11有必要均匀分散在液态体12中，因此最好在使用前搅拌焊料组成物10。焊料粒子11的材质可以使用锡铅系焊料或无铅焊料等。也可以使焊料粒子11的直径b小于相邻的垫式电极22之间的周端间的最短距离a。此时，分别到达相邻的两个垫式电极22上的焊料皮膜的焊料粒子11不彼此接触，因此不会结合而形成焊桥。
使焊料组成物10在常温下由于自然落下滴到具有垫式电极22的基板20上。由此，可在基板20上涂布厚度均匀的焊料组成物10。也就是说，不采用丝网印刷和分配法，就可以在基板20上形成膜厚均匀的焊料组成物10的涂布膜。涂布的均匀性对焊料隆起的偏差带来影响，因此尽可能均匀涂布。之后，通过对基板20整体进行均匀的加热，就可能形成焊料隆起。在短时间升温加热到焊料熔点或熔点以上。通过在短时间内升温，可以抑制在过程中的有机酸活性的降低。
接着，说明在本实施方式所使用的基板20。基板20是硅片。在基板20的表面21上形成有垫式电极22。在垫式电极22上形成有采用本实施方法所形成的焊料隆起。基板20通过焊料隆起与其他半导体片和配线板电连接及机械连接。垫式电极22的形状比如为圆，直径c比如是40μm。相邻的垫式电极22的中心间的距离d比如是80μm。焊料粒子14的直径b比如是3～15μm。
垫式电极22包括在基板20上形成的铝电极24、形成在铝电极24上的镍层25、形成在镍层25上的金层26。镍层25及金层26是UBM(under barrier metal或under bumpmetallurgy)层。基板20上的垫式电极22之外的部分被保护膜27覆盖。
接着，说明垫式电极22的形成方法。首先，在基板20上形成铝电极24，铝电极24之外的部分由聚酰胺树脂或氮化硅膜形成保护膜27。这些采用比如光刻技术及蚀刻技术而形成。接着，在铝电极24表面实施锌酸盐(ジンケ一ト)处理后，采用非电解镀层法在铝电极24上形成镍层25及金层26。设有该UBM层的理由是对铝电极24赋予焊料沾润性的缘故。
可以使用诸如Sn-Pb(熔点183℃)、Sn-Ag-Cu(熔点218℃)、Sn-Ag(熔点221℃)、Sn-Cu(熔点227℃)、其他无铅焊料等作为焊料粒子11的材质。
图2及图3是表示本发明的隆起形成方法的实施方式的剖视图。图2是滴下工序，工序依图2[1]～图2[3]顺序进行。图3是回流工序，工序依图3[1]～图3[3]顺序进行。下面，根据图[1]至图[3]来说明。但是，与图1相同部分付与相同的符号，因此省略说明。
在图2中，省略基板20上的垫式电极22的图示。首先，如图2[1]所示，将基板20放入承接容器30内。并且，在浇注容器31中根据需要搅拌焊料组成物10后，从浇注口32将焊料组成物10滴到基板20上。这样，焊料组成物10因自重蔓延成均匀的厚度。这时，常温即可，且可以利用焊料组成物10的自然流下。因此，即使不采用印刷机和排出机，也可以简单地将焊料组成物10涂布在基板20上。
另外，承接容器30因为在回流工序与基板20一同加热，因此其由具有耐热性的、热传导优良的，且不会产生焊料粒子11引起的焊料沾润的金属如铝组成。又，在堆积工序中或之后，通过水平旋转基板10，也可以使基板20上的焊料组成物10形成均匀的厚度。在水平旋转基板10时，采用市场上销售的旋转涂布机即可。
堆积工序的结束按照是否将焊料组成物10滴落到使基板20浸入在焊料组成物10中的程度而分成两种。图2[2]是基板20未浸入焊料组成物10中的情况，此时，在基板20上堆积成层状的焊料组成物10的厚度t1主要是由焊料组成物10的表面张力及粘性决定的数值。另一方面，图2[3]是基板20浸入焊料组成物10中的情况。此时，在基板20上堆积成层状的焊料组成物10的厚度t2可以设定为与滴落的焊料组成物10的量对应的所期望的数值。
通过以上的堆积工序，如图1所示，焊料组成物10通过全面涂布被载置在分开设置有多个垫式电极22的基板20上。这时，在包含有多个隆起电极22和位于它们之间的间隙中的保护膜27的面上到处都载置有焊料组成物10。焊料组成物10恰如油墨这样的状态。
接着，在回流工序，当基板20和焊料组成物10的加热开始时，液态体12的粘性更加降低。这样，如图3[1]所示，焊料粒子11的比重大于液态体12，因此焊料粒子11沉淀并层积在垫式电极22及保护膜27上。
接着，如图3[2]所示，焊料组成物10被加热到焊料粒子11的熔点或熔点以上。此时，由于液态体12所含有的有机酸(熔接剂成分)的作用，引起如下这样的状态。首先，焊料粒子11彼此的结合被有机酸的反应生成物抑制。但是，在图3[2]中未图示，一部分的焊料粒子11结合而变大。也就是说，焊料粒子11即使结合，只要是具有一定的大小或一定大小以下就没有问题。另一方面，焊料粒子11在垫式电极20上蔓延而在界面形成合金层。其结果，在垫式电极20上形成焊料皮膜23’，焊料粒子11进一步与焊料皮膜23’结合。即，焊料皮膜23’成长，成为图2[3]所示那样的焊料隆起23。
另外，在图3[3]中的、焊料隆起23的形成中未被使用的焊料粒子11和残留的液态体12一同在后续工序中被洗掉。
下面说明本实施方式的其他作用及效果。
采用本实施方式的焊料组成物10，焊料粉末(集合体)由表面只具有自然氧化膜的大量焊料粒子11构成，与焊料粉末一同混合的液态体12含有有机酸(熔接剂成分)，由于该有机酸的反应生成物，在回流时焊料粒子11彼此难以结合，由于焊料粒子11在垫式电极22上蔓延而与垫式电极22上的焊料皮膜23’结合，可以抑制垫式电极22之间的焊桥的发生，同时形成焊料隆起23。并且，不需要形成焊料粒子11的氧化膜的工序，因此可以节省制造工序，同时不需要正确地控制氧化膜的厚度，故可以可靠地形成高密度和微细的焊料隆起23。
采用本发明的隆起形成方法，将本实施方式的焊料组成物10在分开设有多个垫式电极22的基板20上堆积成层状，通过加热基板20上的焊料组成物10后回流，由于液态体12所含有的有机酸的作用，可以形成高密度且微细的焊料隆起23。又，以全面涂抹将焊料组成物10堆积在基板20上，通过在回流时焊料粒子11彼此几乎不结合，能抑制垫式电极22之间发生焊桥，因此能以简单的方法形成高密度且微细的焊料隆起23。
另外，本发明自不必说，并不限于所述实施方式。比如，作为硅片(FC)的替代品，可以采用微细间距的基片和插入式基片，还可以采用配线板(BGA)作为母材。又，电极材料不限于铝，也可以采用Al-Si、Al-Si-Cu、Al-Cu、Cu等。
实施例1
下面来说明将本实施方式更具体化的实施例1。
使用的焊料粒子的成分为96.5wt％Sn-3.0wt％Ag-0.5wt％Cu(熔点218℃)，平均直径为6μm(粒子分布2-11μm)。使用一种脂肪酸酯(トリメチ一ルプロパントリオレエ一ト)作为液态体。该脂肪酸酯的主要的性质如下：40℃的动粘度为48.3mm2/s，100℃的动粘度为9.2mm2u/s，酸值为2.4。不添加有机酸(熔接剂成分)，利用脂肪酸酯原来所包含的游离脂肪酸(熔接剂成分)。又，脂肪酸酯极力抑制水分的影响，因此可以进行水的蒸气压或以下的真空脱泡。
对焊料隆起形成用的基板使用了边长为10mm的正方形硅片。在硅片上，80μm间距的垫式电极形成二维阵列状。垫式电极的形状为边长40μm的正方形。垫式电极表面的材质是在非电解镀镍上所形成的零点几微米膜厚的镀金层。保护膜的材质是硅氮化物。
通过用微细管将焊料组成物50μl滴在基板整个面上来进行定量涂布，该焊料组成物是将2.0g焊料粉末分散到50ml的脂肪酸酯中形成。之后，通过在加热板上将硅片加热(70℃/min)到焊料熔点或熔点以上，形成了焊料隆起。其成品率为100％。
符号说明
10焊料组成物
11焊料粒子
12液态体
20基板
21基板的表面
22垫式电极
23焊料隆起
23’焊料皮膜
30承接容器
31浇注容器
32浇注口

Claims (16)

1.一种焊料组成物，由液态体和焊料粒子的混合物组成，其特征在于，
所述液态体含有反应温度在所述焊料粒子的熔点附近的熔接剂成分且具有在常温下流动
而在母材上堆积成层状的粘性，
所述焊料粒子在所述液态体中向母材上沉淀，同时是具有能均匀分散在所述液态体内的混合比和粒径的粒剂。
2.如权利要求1所述的焊料组成物，其特征在于，
所述焊料粒子的混合比是30wt％或以下。
3.如权利要求1所述的焊料组成物，其特征在于，
所述焊料粒子的粒径是35μm或以下。
4.如权利要求1所述的焊料组成物，其特征在于，
所述焊料粒子的表面氧化膜只有自然氧化膜。
5.如权利要求1所述的焊料组成物，其特征在于，
所述液态体所含有的熔接剂成分通过其反应生成物来抑制所述焊料粒子彼此的结合，同时促进所述焊料粒子和所述母材之间的焊接，并促进所述母材上所形成的焊料皮膜与所述焊料粒子的结合。
6.如权利要求5所述的焊料组成物，其特征在于，
所述熔接剂成分是酸。
7.如权利要求6所述的焊料组成物，其特征在于，
所述酸为有机酸。
8.如权利要求1所述的焊料组成物，其特征在于，
所述液态体是油脂。
9.如权利要求8所述的焊料组成物，其特征在于，
所述熔接剂成分是包含在所述油脂中的游离脂肪酸。
10.如权利要求8所述的焊料组成物，其特征在于，
所述油脂是脂肪酸酯。
11.如权利要求10所述的焊料组成物，其特征在于，
所述脂肪酸酯是季戊烷多元醇酯。
12.如权利要求8所述的焊料组成物，其特征在于，
所述油脂的酸值为1或1以上。
13.一种隆起形成方法，其特征在于，
包括：
堆积工序，将焊料组成物堆积在母材上，所述焊料组成物由液态体和焊料粒子的混合物组成，所述液态体含有反应温度在焊料粒子的熔点附近的熔接剂成分且具有在常温下流动而在母材上堆积成层状的粘性，所述焊料粒子在所述液态体中向母材上沉淀，同时是具有能均匀分散在所述液态体内的混合比和粒径的粒剂；
回流工序，加热所述焊料组成物，在所述母材上形成所述焊料粒子形成的隆起。
14.如权利要求13所述的隆起形成方法，其特征在于，
在所述堆积工序的前阶段，通过搅拌所述焊料组成物而使所述焊料粒子均匀地分散到所述液态体中。
15.如权利要求13所述的隆起形成方法，其特征在于，
在所述堆积工序中，通过使所述母材旋转而使所述焊料组成物旋转涂布成均匀的厚度。
16.如权利要求13所述的隆起形成方法，其特征在于，
在所述堆积工序中，在放置有所述母材的容器内注入所述焊料组成物，使所述母材浸入所述焊料组成物中。
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CN110524137B (zh) * 2018-05-25 2020-09-18 千住金属工业株式会社 焊料球、钎焊接头和接合方法
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CN113146014A (zh) * 2021-04-15 2021-07-23 广西天正钢结构有限公司 一种管材与管材焊接结构的扩散焊接方法

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EP1729334A1 (en) 2006-12-06
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