JP4372690B2 - はんだバンプの形成方法及び装置 - Google Patents
はんだバンプの形成方法及び装置 Download PDFInfo
- Publication number
- JP4372690B2 JP4372690B2 JP2004558388A JP2004558388A JP4372690B2 JP 4372690 B2 JP4372690 B2 JP 4372690B2 JP 2004558388 A JP2004558388 A JP 2004558388A JP 2004558388 A JP2004558388 A JP 2004558388A JP 4372690 B2 JP4372690 B2 JP 4372690B2
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- JP
- Japan
- Prior art keywords
- solder
- fine particles
- liquid
- substrate
- liquid tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000000034 method Methods 0.000 title claims description 51
- 239000007788 liquid Substances 0.000 claims description 167
- 239000010419 fine particle Substances 0.000 claims description 161
- 239000000758 substrate Substances 0.000 claims description 64
- 238000002844 melting Methods 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 18
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- 229910052751 metal Inorganic materials 0.000 description 14
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000004907 flux Effects 0.000 description 6
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910018594 Si-Cu Inorganic materials 0.000 description 1
- 229910008465 Si—Cu Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
本発明の目的は、パッド電極のファインピッチ化を図れるとともに、はんだ量が多くかつバラツキも少ないはんだバンプを得られるはんだバンプの形成方法及び装置を提供することにある。
前記液体中にはんだ微粒子を供給し、
前記はんだ微粒子を落下させる際に、落下速度が一定範囲内になったときに、前記はんだ微粒子を前記基板上に落下させて、前記パッド電極上にはんだバンプを形成することを特徴とする。
11 液体槽
12 はんだ微粒子供給手段
13 不活性液体
14 はんだ微粒子
15 はんだ微粒子形成ユニット
20 基板
21 表面
22 パッド電極
23 はんだバンプ
Claims (7)
- はんだの融点以上に加熱された液体中に、パッド電極を表面に有する基板を当該表面が上になるように位置付け、
前記液体中に多量のはんだ微粒子を一斉に落下させ、
前記はんだ微粒子を落下させる際に、大きいはんだ微粒子が基板近傍を落下する時間及び小さいはんだ微粒子が基板近傍を落下する時間に、それらのはんだ微粒子が基板上に到達しないようにし、
落下速度が一定範囲内になったときに、前記はんだ微粒子を前記基板上に落下させて、前記パッド電極上にはんだバンプを形成する、はんだバンプの形成方法。 - 落下して前記パッド電極上に接した前記はんだ微粒子を、その状態ではんだ濡れが起こるまで一定時間以上保持する、請求項1に記載のはんだバンプの形成方法。
- 溶融した前記はんだを前記液体中で破砕することにより前記はんだ微粒子を形成する請求の範囲第1項記載のはんだバンプの形成方法。
- 前記はんだ微粒子の直径は、隣接する前記パッド電極同士の周端間の最短距離よりも小さい、請求項1に記載のはんだバンプの形成方法。
- はんだの融点以上に加熱された液体と、パッド電極を表面に有するとともに当該表面が上になるように前記液体中に位置付けられる基板とを収容する液体槽と、溶融した前記はんだからなるはんだ微粒子を前記液体中に供給し、当該はんだ微粒子を前記基板上に落下させるはんだ微粒子供給手段と、を備え、
前記液体槽は、前記基板及び前記液体を収容する第一の液体槽と、前記液体及び当該液体中に沈んだ溶融した前記はんだを収容する第二の液体槽とからなり、
前記第一の液体槽と前記第二の液体槽とは、上部同士が連通するとともに底部同士が連通せず、前記はんだ微粒子供給手段は、前記第二の液体槽内の溶融した前記はんだを破砕することにより前記はんだ微粒子を形成するとともに、当該はんだ微粒子を前記第二の液体槽の上部から前記第一の液体槽へ供給することを特徴とするはんだバンプの形成装置。 - 前記はんだ微粒子供給手段は、溶融した前記はんだを前記液体中で破砕することにより前記はんだ微粒子を形成する、請求項5に記載のはんだバンプの形成装置。
- 前記はんだ微粒子の直径は、隣接する前記パッド電極同士の周端間の最短距離よりも小さい、請求項5に記載のはんだバンプの形成装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002355373 | 2002-12-06 | ||
JP2002355373 | 2002-12-06 | ||
PCT/JP2002/013057 WO2004054339A1 (ja) | 2002-12-06 | 2002-12-13 | はんだ供給方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2004054339A1 JPWO2004054339A1 (ja) | 2006-04-13 |
JP4372690B2 true JP4372690B2 (ja) | 2009-11-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004558388A Expired - Fee Related JP4372690B2 (ja) | 2002-12-06 | 2002-12-13 | はんだバンプの形成方法及び装置 |
Country Status (9)
Country | Link |
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US (1) | US7350686B2 (ja) |
EP (1) | EP1569503B1 (ja) |
JP (1) | JP4372690B2 (ja) |
KR (1) | KR100807038B1 (ja) |
CN (1) | CN1701649B (ja) |
AU (1) | AU2002354474A1 (ja) |
DE (1) | DE60238450D1 (ja) |
TW (1) | TWI232717B (ja) |
WO (1) | WO2004054339A1 (ja) |
Families Citing this family (16)
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JP4892340B2 (ja) * | 2004-03-22 | 2012-03-07 | 株式会社タムラ製作所 | はんだ組成物及びこれを用いたバンプ形成方法 |
JP4576286B2 (ja) * | 2004-05-10 | 2010-11-04 | 昭和電工株式会社 | 電子回路基板の製造方法および電子部品の実装方法 |
KR101122492B1 (ko) * | 2004-11-16 | 2012-02-29 | 강준모 | 솔더 범프를 구비한 반도체 장치 및 그 제조방법 |
JP4576270B2 (ja) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | ハンダ回路基板の製造方法 |
JP2006294949A (ja) * | 2005-04-13 | 2006-10-26 | Tamura Seisakusho Co Ltd | 電極構造体及び突起電極並びにこれらの製造方法 |
WO2007007865A1 (en) | 2005-07-11 | 2007-01-18 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board |
JP2007073617A (ja) * | 2005-09-05 | 2007-03-22 | Tamura Seisakusho Co Ltd | 電極構造体、実装用基板及び突起電極並びにこれらの製造方法 |
KR100726448B1 (ko) * | 2006-03-31 | 2007-06-11 | 이원근 | 미세 볼 제조장치 및 제조방법 |
JP4685992B2 (ja) * | 2007-01-23 | 2011-05-18 | 株式会社タムラ製作所 | はんだ付け装置及びはんだ付け方法並びにはんだ付け用プログラム |
KR101051579B1 (ko) * | 2008-12-19 | 2011-07-22 | 삼성전기주식회사 | 액상 리플로우 방법 |
JP5327233B2 (ja) * | 2009-07-08 | 2013-10-30 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
CN102184874B (zh) * | 2011-04-02 | 2012-12-26 | 何永基 | 芯片接合方法 |
CN102300417B (zh) * | 2011-08-10 | 2013-09-11 | 深南电路有限公司 | 电子元件埋入式电路板及其制造方法 |
JP5821797B2 (ja) * | 2012-07-26 | 2015-11-24 | Tdk株式会社 | 電子部品の製造方法及び電子部品の製造装置 |
WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
CN109623080A (zh) * | 2019-01-24 | 2019-04-16 | 合肥巨动力系统有限公司 | 一种高效率扁线电机绕组端部焊接装置及焊接工艺 |
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2002
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- 2002-12-13 EP EP02788814A patent/EP1569503B1/en not_active Expired - Fee Related
- 2002-12-13 AU AU2002354474A patent/AU2002354474A1/en not_active Abandoned
- 2002-12-13 KR KR1020057007539A patent/KR100807038B1/ko not_active IP Right Cessation
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- 2002-12-13 DE DE60238450T patent/DE60238450D1/de not_active Expired - Lifetime
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Publication number | Publication date |
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CN1701649B (zh) | 2010-06-02 |
WO2004054339A1 (ja) | 2004-06-24 |
EP1569503A1 (en) | 2005-08-31 |
TW200414853A (en) | 2004-08-01 |
EP1569503B1 (en) | 2010-11-24 |
US7350686B2 (en) | 2008-04-01 |
KR20050062646A (ko) | 2005-06-23 |
US20060054667A1 (en) | 2006-03-16 |
DE60238450D1 (de) | 2011-01-05 |
TWI232717B (en) | 2005-05-11 |
KR100807038B1 (ko) | 2008-02-25 |
JPWO2004054339A1 (ja) | 2006-04-13 |
EP1569503A4 (en) | 2007-06-06 |
CN1701649A (zh) | 2005-11-23 |
AU2002354474A1 (en) | 2004-06-30 |
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