CN102300417B - 电子元件埋入式电路板及其制造方法 - Google Patents

电子元件埋入式电路板及其制造方法 Download PDF

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CN102300417B
CN102300417B CN 201110228710 CN201110228710A CN102300417B CN 102300417 B CN102300417 B CN 102300417B CN 201110228710 CN201110228710 CN 201110228710 CN 201110228710 A CN201110228710 A CN 201110228710A CN 102300417 B CN102300417 B CN 102300417B
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electronic component
aluminium electrode
circuit board
hole
layer
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CN102300417A (zh
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谷新
霍如肖
丁鲲鹏
杨之诚
孔令文
蔡坚
鲍平华
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Shennan Circuit Co Ltd
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Abstract

本发明公开了一种电子元件埋入式电路板的制造方法，包括：将电子元件埋入电路板的芯层开设的通孔中，所述电子元件的一面具有铝电极；对所述铝电极进行锌化处理，并在锌化处理后的铝电极表面镀镍。本发明实施例还提供相应的电子元件埋入式电路板。本发明技术方案由于采用锌化处理和镀镍处理在铝电极表面形成了锌镍保护层，在后续的电路板制造流程中，该铝电极不会被激光、各种酸性或碱性的化学溶液损坏。

Description

电子元件埋入式电路板及其制造方法
技术领域
本发明涉及电路板制造技术领域，具体涉及一种电子元件埋入式电路板及其制造方法。
背景技术
常规的电源电子模块中，电源半导体芯片，例如MOSFET或IGBT芯片通常采用引线键合方式与基板连接。然而，由于其较长的互连尺寸，在开关电源中容易产生较大的应力和较大的电磁干扰(EMI)噪声。另外，随着电力电子半导体器件的快速发展，开关频率越来越高，装置体积进一步减小，寄生参数对电源性能和可靠性的影响也越来越显著，器件的功耗也越来越大。将电源芯片直接埋入印刷线路板内部，可以有效解决以上问题。
但是，电源芯片通常包含铝材质的电极(以后称为铝电极)，而铝的化学性质决定了铝电极不能与电路板的制作工艺兼容，如铝电极表面不能采用激光加工盲孔，铝电极在蚀刻等工艺中会被化学物质腐蚀损坏等。
发明内容
本发明实施例提供一种电子元件埋入式电路板及其制造方法，可以使带有铝电极的电子元件与电路板的制作工艺兼容。
一种电子元件埋入式电路板的制造方法，包括：
将电子元件埋入电路板的芯层开设的通孔中，所述电子元件的一面具有铝电极；
对所述铝电极进行锌化处理，并在锌化处理后的铝电极表面镀镍。
一种电子元件埋入式电路板，包括：
开设有通孔的芯层和埋入所述通孔中的电子元件；
所述电子元件的一面具有铝电极，所述铝电极表面具有锌化和镀镍处理后得到的锌镍保护层。
本发明实施例采用对埋入电路板的电子元件的铝电极进行锌化处理和镀镍处理的技术方案，锌化和镀镍处理后的铝电极表面增加了锌镍保护层，在后续的电路板制造流程中包括激光盲孔加工、蚀刻等工艺中，不会被激光、各种酸性或碱性的化学溶液损坏。
附图说明
图1a是本发明一个实施例电子元件埋入式电路板的制造方法的流程图；
图1b是本发明另一实施例电子元件埋入式电路板的制造方法的流程图；
图2是具有铝电极的电子元件的示意图；
图3a-m是本发明实施例电子元件埋入式电路板制作过程中的示意图。
具体实施方式
本发明实施例提供一种电子元件埋入式电路板及其制造方法，采用对埋入电路板的电子元件的铝电极进行锌化处理和镀镍处理的技术方案，由锌化和镀镍处理后的得到的锌镍保护层对铝电极进行保护，使铝电极在电路板制造流程中包括激光盲孔加工、蚀刻等工艺中，不会被激光、各种酸性或碱性的化学溶液损坏。以下分别进行详细说明。
请参考图1a，本发明实施例提供一种电子元件埋入式电路板的制造方法，包括：
110、将电子元件埋入电路板的芯层开设的通孔中，所述电子元件的一面具有铝电极。
如图2所示，所说的电子元件400的两个相对面上分别具有铝电极401和非铝电极402。该电子元件400可以是电源芯片，也可以是任何其它类型的元件。所说的非铝电极402通常是银-镍材质的电极，也可以是其它非铝金属如镍、铜等材质的电极。
如图3a所示，所说的电路板的芯层可以是单面覆铜板，包括有机树脂层501和覆盖在有机树脂层501一面的金属层502。该有机树脂层501的厚度可以根据电子元件400的厚度决定，通常在100微米到400微米之间，不能小于电子元件400的厚度。金属层502的厚度通常在3微米到100微米之间，根据实际场景确定。
如图1b所示，本步骤所述的将电子元件埋入电路板的芯层开设的通孔中具体可以包括：
111、在电路板的芯层开设通孔，所述芯层的第一面形成有第一电路图形。
如图3b所示，在芯层上开设通孔503，该通孔503的大小与电子元件的大小相匹配。通孔503的个数与需要埋入的电子元件的个数相当，可以是一个，也可以是多个。其中，所述芯层第一面的金属层502已经加工形成第一电路图形，附图中第一电路图形仍用502表示。
112、在所述芯层的第二面贴胶带。
如图3c所示，在芯层的第二面贴胶带504。该胶带504可以是紫外光UV胶带，能够在照射紫外光时失去粘性便于去除；也可以是其它胶带，例如在经过高温如150摄氏度时失去粘性的胶带。
113、将电子元件置于所述通孔中，并使所述电子元件的具有铝电极的下表面粘贴在所述胶带上。
如图3d所示，本步骤中将电子元件400置于通孔503中，其中，电子元件400的具有铝电极401的下表面接触并粘贴在胶带504上，进行临时固定。铝电极401可以是多个独立的铝电极。
114、在所述电子元件侧面与所述通孔侧面的缝隙中填充绝缘介质。
通孔503略大于电子元件400，电子元件400的侧面与通孔503的侧面之间形成缝隙。如图3e所示，本步骤中，在该缝隙中填充绝缘介质505，一方面利用该绝缘介质505将电子元件固定在芯层中，另一方面利用该绝缘介质505将芯层的上、下表面以及电子元件400的上、下表面隔开。本实施例中，所述绝缘介质505优选采用感光树脂。可以在通孔503中，包括所述的缝隙和电子元件400的具有非铝电极402的上表面，全部印刷上感光树脂，然后再利用其感光特性，通过曝光显影工艺将非铝电极402表面的感光树脂去除。
115、在所述电子元件的具有非铝电极的上表面填充导电介质，使所述电子元件的非铝电极与所述第一电路图形电连接。
如图3f所示，本步骤中，为了使电子元件400的非铝电极402与芯层上形成的第一电路图形电连接，在通孔503中电子元件400的上表面填充导电介质506，使非铝电极402通过该导电介质506与第一电路图形502实现电连接。
如图3g所示，在填充导电介质506之后，还可以包括一个研磨整平步骤，将导电介质506研磨至与所述第一电路图形表面平齐。
116、去除胶带。
图3h是去除胶带504后的示意图。可以通过手工方法去除胶带，也已通过化学方法或者照紫外光等方法去除胶带。保证去除胶带后，铝电极401表面没有残胶，未被胶带污染。
120、对所述铝电极进行锌化处理，并在锌化处理后的铝电极表面镀镍。
为了防止后续工艺流程中对电子元件400的铝电极401造成损坏，本步骤中先在铝电极401的表面进行锌化处理，如图3i所示；然后再进行镀镍处理，如图3j所示，从而在铝电极401表面形成一个锌镍保护层403。
其中，所说的锌化处理包括：将铝电极采用约3wt％～5wt％的NaOH溶液常温浸泡约10～30秒，然后在20wt％～50wt％的硝酸溶液进行常温浸泡10-30秒，确保铝电极表面的氧化物清除后，将铝电极浸泡在含500g/L的NaOH和100g/LZnO的溶液中，常温浸泡10～30秒，在铝电极表面形成一层含锌金属层。其中，wt％是指重量百分比。
所说的镀镍处理是在锌化处理后的锌化层表面化学镀镍，包括：将锌化处理后的铝电极用去离子水清洗后，立即放入化学镀镍溶液中镀镍10～30分钟，镀镍溶液主要是NiSO4和NaH2PO2组成，镀液温度约70～90摄氏度，最后在锌表面镀上一层厚度7微米以上的Ni-P金属层。化学镀镍得到的镀层的主要成分是镍，但也不限制有其它微量元素例如磷等，其中磷的含量可以在4wt％-10wt％之间，其中，wt％指重量百分比。
由于镍金属层的化学稳定性较好，在铝电极401表面形成锌镍保护层403之后，就可以按照常规的工艺流程进行后续加工了，锌镍保护层403保护下的铝电极401将不会再被激光或蚀刻等工艺中的各种化学溶液损坏。举例来说，后续的步骤可以包括：
131、在所述芯层的第二面压合绝缘介质层；
如图3k所示，在芯层的第二面即铝电极401所在的一面压合绝缘介质层507。该绝缘介质层507可以是半固化片树脂。
132、在所述绝缘介质层上制作连接所述锌化和镀镍处理后的铝电极的金属化盲孔；
如图3l所示，本步骤中，在绝缘介质层507上对应于所述铝电极401的位置开设盲孔508，盲孔508的底部抵达所述铝电极401。可以采用激光钻孔方式加工该盲孔508。
如图3m所示，然后对该盲孔508进行金属化，即，通过化学沉铜、电镀铜等工艺在盲孔508的内壁形成一层金属镀层，使该盲孔508成为金属化盲孔。
133、在所述绝缘介质层上制作第二电路图形，所述第二电路图形通过所述金属化盲孔与所述电子元件的铝电极电连接。
最后，可以采用常规的电路板图形制作工艺在该绝缘介质层507表面制作第二电路图形，该第二电路图形可以通过金属化盲孔508与电子元件400的经过了锌化和镀镍处理后的铝电极401进行电连接。其中，制作第二电路图形时，可以采用在表面化学镀铜、图形电镀铜、蚀刻等工艺完成图形制作。
至此，内部埋入电子元件的双面电路板制作完成，如需增加其他电路层，可以采用常规的电路板工艺在该具有埋入电子元件的双面两面进行增层。
综上，本发明实施例提供了一种电子元件埋入式电路板的制造方法，采用对埋入电路板的电子元件的铝电极进行锌化处理和镀镍处理的技术方案，由锌化和镀镍处理后的得到的锌镍保护层对铝电极进行保护，使铝电极在电路板制造流程中包括激光钻孔和蚀刻等工艺中，不会被激光和各种酸性或碱性的化学溶液损坏。对其非铝电极部分，可以采用导电性物质填充方式实现该部分电极与外部电路的连接。
请参考图3m，本发明实施例还提供一种电子元件埋入式电路板，包括：
开设有通孔503的芯层和埋入所述通孔503中的电子元件400；
所述电子元件400的一面具有铝电极401，所述铝电极401表面具有锌化和镀镍处理后得到的锌镍保护层403。
进一步的，所述芯层的远离所述铝电极401的第一面形成有第一电路图形，所述第一电路图形与所述电子元件400的非铝电极402电连接；
所述铝电极401所在的芯层的第二面压合有绝缘介质层507，所述绝缘介质层507上形成有第二电路图形，所述第二电路图形通过所述绝缘介质层507上设置的金属化盲孔508与所述铝电极401电连接。
再进一步的，所述电子元件400侧面与所述通孔503侧面的缝隙中填充有绝缘介质505。该绝缘介质505优选为感光树脂。
所述通孔503中电子元件400的非铝电极402的上表面填充有导电介质506，所述电子元件的非铝电极402通过所述导电介质506与第一电路图形电连接。
本发明实施例提供的电子元件埋入式电路板，其铝电极表面具有由锌化和镀镍处理后的得到的锌镍保护层，可以防止激光钻孔的破坏和各种酸性或碱性的化学溶液腐蚀。
以上对本发明实施例所提供的电子元件埋入式电路板及其制造方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想，不应理解为对本发明的限制，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。

Claims (9)

1.一种电子元件埋入式电路板的制造方法，其特征在于，包括：
将电子元件埋入电路板的芯层开设的通孔中，所述电子元件的一面具有铝电极；
对所述铝电极进行锌化处理，并在锌化处理后的铝电极表面镀镍；
其中，所述将电子元件埋入电路板芯层开设的通孔中包括：
在电路板的芯层开设通孔，所述芯层的第一面形成有第一电路图形；
在所述芯层的第二面贴胶带；
将电子元件置于所述通孔中，并使所述电子元件的具有铝电极的下表面粘贴在所述胶带上；
在所述电子元件的侧面与所述通孔的侧面的缝隙中填充绝缘介质；
在所述电子元件的具有非铝电极的上表面填充导电介质，使所述电子元件的非铝电极与所述第一电路图形电连接；
去除胶带。
2.根据权利要求1所述的方法，其特征在于，在所述电子元件的侧面与所述通孔的侧面的缝隙中填充绝缘介质包括：
在埋入电子元件的所述通孔内填充感光树脂；
通过曝光显影将所述电子元件的非铝电极表面的感光树脂去除。
3.根据权利要求1所述的方法，其特征在于，所述在所述电子元件的具有非铝电极的上表面填充导电介质之后还包括：
将所述导电介质研磨至与所述第一电路图形表面平齐。
4.根据权利要求1所述的方法，其特征在于：
所述胶带为紫外光UV胶带。
5.根据权利要求1至4中任一项所述的方法，其特征在于，所述在锌化处理后的铝电极表面镀镍之后还包括：
在所述芯层的第二面压合绝缘介质层；
在所述绝缘介质层上制作连接所述锌化和镀镍处理后的铝电极的金属化盲孔；
在所述绝缘介质层上制作第二电路图形，所述第二电路图形通过所述金属化盲孔与所述电子元件的铝电极电连接。
6.一种电子元件埋入式电路板，其特征在于，包括：
开设有通孔的芯层和埋入所述通孔中的电子元件；
所述电子元件的一面具有铝电极，所述铝电极表面具有锌化和镀镍处理后得到的锌镍保护层；
所述芯层的远离所述铝电极的第一面形成有第一电路图形，所述第一电路图形与所述电子元件的非铝电极电连接；
所述铝电极所在的芯层的第二面压合有绝缘介质层，所述绝缘介质层上形成有第二电路图形，所述第二电路图形通过所述绝缘介质层上设置的金属化盲孔与所述铝电极电连接。
7.根据权利要求6所述的电子元件埋入式电路板，其特征在于：
所述电子元件的侧面与所述通孔的侧面的缝隙中填充有绝缘介质。
8.根据权利要求7所述的电子元件埋入式电路板，其特征在于：
所述通孔中电子元件的非铝电极的上表面填充有导电介质，所述电子元件的非铝电极通过所述导电介质与所述第一电路图形电连接。
9.根据权利要求7所述的电子元件埋入式电路板，其特征在于：
所述绝缘介质为感光树脂。
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