CN1929161A - 电可重写非易失存储元件及其制造方法 - Google Patents
电可重写非易失存储元件及其制造方法 Download PDFInfo
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- CN1929161A CN1929161A CN200610151788.1A CN200610151788A CN1929161A CN 1929161 A CN1929161 A CN 1929161A CN 200610151788 A CN200610151788 A CN 200610151788A CN 1929161 A CN1929161 A CN 1929161A
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- recording layer
- volatile memory
- memory element
- dielectric film
- top electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/066—Shaping switching materials by filling of openings, e.g. damascene method
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8418—Electrodes adapted for focusing electric field or current, e.g. tip-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/52—Structure characterized by the electrode material, shape, etc.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005259934 | 2005-09-07 | ||
JP2005259934A JP2007073779A (ja) | 2005-09-07 | 2005-09-07 | 不揮発性メモリ素子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1929161A true CN1929161A (zh) | 2007-03-14 |
CN100492696C CN100492696C (zh) | 2009-05-27 |
Family
ID=37859036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610151788.1A Expired - Fee Related CN100492696C (zh) | 2005-09-07 | 2006-09-07 | 电可重写非易失存储元件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070063180A1 (zh) |
JP (1) | JP2007073779A (zh) |
KR (1) | KR100818498B1 (zh) |
CN (1) | CN100492696C (zh) |
DE (1) | DE102006041849A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101971382A (zh) * | 2008-01-16 | 2011-02-09 | Nxp股份有限公司 | 包括相变材料层的多层结构及其制造方法 |
Families Citing this family (111)
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KR100801084B1 (ko) * | 2007-01-08 | 2008-02-05 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 장치 및 그 제조 방법 |
TW200832771A (en) * | 2007-01-25 | 2008-08-01 | Ind Tech Res Inst | Phase change memory device and method of fabricating the same |
JP4792007B2 (ja) | 2007-06-12 | 2011-10-12 | 株式会社東芝 | 情報記録再生装置 |
JP4792009B2 (ja) * | 2007-06-12 | 2011-10-12 | 株式会社東芝 | 情報記録再生装置 |
JP4792010B2 (ja) * | 2007-06-12 | 2011-10-12 | 株式会社東芝 | 情報記録再生装置 |
JP4792006B2 (ja) * | 2007-06-12 | 2011-10-12 | 株式会社東芝 | 情報記録再生装置 |
KR100911473B1 (ko) * | 2007-06-18 | 2009-08-11 | 삼성전자주식회사 | 상변화 메모리 유닛, 이의 제조 방법, 이를 포함하는상변화 메모리 장치 및 그 제조 방법 |
JP5634002B2 (ja) | 2007-07-25 | 2014-12-03 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 相変化型不揮発性メモリ及び半導体装置 |
US20090045386A1 (en) * | 2007-08-14 | 2009-02-19 | Industrial Technology Research Institute | Phase-change memory element |
US8365040B2 (en) | 2007-09-20 | 2013-01-29 | Densbits Technologies Ltd. | Systems and methods for handling immediate data errors in flash memory |
US8650352B2 (en) * | 2007-09-20 | 2014-02-11 | Densbits Technologies Ltd. | Systems and methods for determining logical values of coupled flash memory cells |
JP5579362B2 (ja) | 2007-10-19 | 2014-08-27 | ピーエスフォー ルクスコ エスエイアールエル | 縦型相変化メモリ装置の製造方法 |
US8694715B2 (en) | 2007-10-22 | 2014-04-08 | Densbits Technologies Ltd. | Methods for adaptively programming flash memory devices and flash memory systems incorporating same |
US8443242B2 (en) | 2007-10-25 | 2013-05-14 | Densbits Technologies Ltd. | Systems and methods for multiple coding rates in flash devices |
JP5557421B2 (ja) | 2007-11-26 | 2014-07-23 | ピーエスフォー ルクスコ エスエイアールエル | 相変化型不揮発メモリ、その製造方法および半導体装置 |
WO2009072102A2 (en) * | 2007-12-05 | 2009-06-11 | Densbits Technologies Ltd. | System and methods employing mock thresholds to generate actual reading thresholds in flash memory devices |
WO2009072105A2 (en) * | 2007-12-05 | 2009-06-11 | Densbits Technologies Ltd. | A low power chien-search based bch/rs decoding system for flash memory, mobile communications devices and other applications |
US8335977B2 (en) | 2007-12-05 | 2012-12-18 | Densbits Technologies Ltd. | Flash memory apparatus and methods using a plurality of decoding stages including optional use of concatenated BCH codes and/or designation of “first below” cells |
US8276051B2 (en) | 2007-12-12 | 2012-09-25 | Densbits Technologies Ltd. | Chien-search system employing a clock-gating scheme to save power for error correction decoder and other applications |
WO2009074978A2 (en) | 2007-12-12 | 2009-06-18 | Densbits Technologies Ltd. | Systems and methods for error correction and decoding on multi-level physical media |
US8327246B2 (en) | 2007-12-18 | 2012-12-04 | Densbits Technologies Ltd. | Apparatus for coding at a plurality of rates in multi-level flash memory systems, and methods useful in conjunction therewith |
JPWO2009098734A1 (ja) * | 2008-02-06 | 2011-05-26 | 株式会社東芝 | 情報記録再生装置 |
US7935564B2 (en) | 2008-02-25 | 2011-05-03 | International Business Machines Corporation | Self-converging bottom electrode ring |
US7709325B2 (en) * | 2008-03-06 | 2010-05-04 | International Business Machines Corporation | Method of forming ring electrode |
WO2009118720A2 (en) * | 2008-03-25 | 2009-10-01 | Densbits Technologies Ltd. | Apparatus and methods for hardware-efficient unbiased rounding |
JPWO2009122569A1 (ja) | 2008-04-01 | 2011-07-28 | 株式会社東芝 | 情報記録再生装置 |
EP2260520B1 (en) * | 2008-04-01 | 2015-02-25 | Nxp B.V. | Vertical phase change memory cell |
US7821068B2 (en) * | 2008-08-18 | 2010-10-26 | Xerox Corporation | Device and process involving pinhole undercut area |
US8332725B2 (en) | 2008-08-20 | 2012-12-11 | Densbits Technologies Ltd. | Reprogramming non volatile memory portions |
US7897954B2 (en) | 2008-10-10 | 2011-03-01 | Macronix International Co., Ltd. | Dielectric-sandwiched pillar memory device |
KR101046228B1 (ko) * | 2008-12-26 | 2011-07-04 | 주식회사 하이닉스반도체 | 상변화 메모리 소자 및 그 제조방법 |
JP2010183017A (ja) * | 2009-02-09 | 2010-08-19 | National Institute Of Advanced Industrial Science & Technology | 固体メモリ |
KR101598378B1 (ko) | 2009-03-04 | 2016-02-29 | 삼성전자주식회사 | 메모리 소자의 형성 방법 |
US8819385B2 (en) | 2009-04-06 | 2014-08-26 | Densbits Technologies Ltd. | Device and method for managing a flash memory |
US8458574B2 (en) * | 2009-04-06 | 2013-06-04 | Densbits Technologies Ltd. | Compact chien-search based decoding apparatus and method |
US8566510B2 (en) | 2009-05-12 | 2013-10-22 | Densbits Technologies Ltd. | Systems and method for flash memory management |
JP2010287744A (ja) | 2009-06-11 | 2010-12-24 | Elpida Memory Inc | 固体メモリ、データ処理システム及びデータ処理装置 |
US8995197B1 (en) | 2009-08-26 | 2015-03-31 | Densbits Technologies Ltd. | System and methods for dynamic erase and program control for flash memory device memories |
US8305812B2 (en) * | 2009-08-26 | 2012-11-06 | Densbits Technologies Ltd. | Flash memory module and method for programming a page of flash memory cells |
US8868821B2 (en) | 2009-08-26 | 2014-10-21 | Densbits Technologies Ltd. | Systems and methods for pre-equalization and code design for a flash memory |
US9330767B1 (en) | 2009-08-26 | 2016-05-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Flash memory module and method for programming a page of flash memory cells |
US8730729B2 (en) | 2009-10-15 | 2014-05-20 | Densbits Technologies Ltd. | Systems and methods for averaging error rates in non-volatile devices and storage systems |
US8724387B2 (en) | 2009-10-22 | 2014-05-13 | Densbits Technologies Ltd. | Method, system, and computer readable medium for reading and programming flash memory cells using multiple bias voltages |
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US9037777B2 (en) * | 2009-12-22 | 2015-05-19 | Densbits Technologies Ltd. | Device, system, and method for reducing program/read disturb in flash arrays |
US8607124B2 (en) * | 2009-12-24 | 2013-12-10 | Densbits Technologies Ltd. | System and method for setting a flash memory cell read threshold |
US8700970B2 (en) * | 2010-02-28 | 2014-04-15 | Densbits Technologies Ltd. | System and method for multi-dimensional decoding |
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2005
- 2005-09-07 JP JP2005259934A patent/JP2007073779A/ja active Pending
-
2006
- 2006-09-06 KR KR1020060085657A patent/KR100818498B1/ko not_active IP Right Cessation
- 2006-09-06 DE DE102006041849A patent/DE102006041849A1/de not_active Ceased
- 2006-09-07 CN CN200610151788.1A patent/CN100492696C/zh not_active Expired - Fee Related
- 2006-09-07 US US11/516,510 patent/US20070063180A1/en not_active Abandoned
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CN101971382A (zh) * | 2008-01-16 | 2011-02-09 | Nxp股份有限公司 | 包括相变材料层的多层结构及其制造方法 |
CN101971382B (zh) * | 2008-01-16 | 2013-12-25 | Nxp股份有限公司 | 包括相变材料层的多层结构及其制造方法 |
Also Published As
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US20070063180A1 (en) | 2007-03-22 |
KR20070028250A (ko) | 2007-03-12 |
JP2007073779A (ja) | 2007-03-22 |
KR100818498B1 (ko) | 2008-03-31 |
CN100492696C (zh) | 2009-05-27 |
DE102006041849A1 (de) | 2007-04-12 |
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