CN1906269A - 荧光体及使用该荧光体的发出电灯色光的电灯色光发光二极管灯 - Google Patents
荧光体及使用该荧光体的发出电灯色光的电灯色光发光二极管灯 Download PDFInfo
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- CN1906269A CN1906269A CNA2005800014431A CN200580001443A CN1906269A CN 1906269 A CN1906269 A CN 1906269A CN A2005800014431 A CNA2005800014431 A CN A2005800014431A CN 200580001443 A CN200580001443 A CN 200580001443A CN 1906269 A CN1906269 A CN 1906269A
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- light
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- sialon
- emitting diode
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
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- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP2004206509 | 2004-07-13 | ||
JP206509/2004 | 2004-07-13 | ||
JP235945/2004 | 2004-08-13 | ||
JP2004235945 | 2004-08-13 | ||
PCT/JP2005/012809 WO2006006582A1 (ja) | 2004-07-13 | 2005-07-12 | 蛍光体及びその蛍光体を用いた電球色光を発する電球色光発光ダイオードランプ |
Publications (2)
Publication Number | Publication Date |
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CN1906269A true CN1906269A (zh) | 2007-01-31 |
CN1906269B CN1906269B (zh) | 2011-04-20 |
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CN2005800014431A Active CN1906269B (zh) | 2004-07-13 | 2005-07-12 | 荧光体及使用该荧光体的发出电灯色光的电灯色光发光二极管灯 |
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US (1) | US8508119B2 (zh) |
EP (1) | EP1780255B1 (zh) |
JP (1) | JP4045300B2 (zh) |
KR (2) | KR20070103087A (zh) |
CN (1) | CN1906269B (zh) |
TW (1) | TWI266795B (zh) |
WO (1) | WO2006006582A1 (zh) |
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WO2008116351A1 (fr) * | 2007-03-26 | 2008-10-02 | He Shan Lide Electronic Enterprise Company Ltd. | Procédé de synthétisation d'une lumière à température de couleur inférieure et dispositif d'éclairage |
CN105143399A (zh) * | 2013-03-21 | 2015-12-09 | 宇部兴产株式会社 | 氧氮化物荧光体粉末及其制造方法 |
CN109020558A (zh) * | 2018-09-07 | 2018-12-18 | 安徽理工大学 | 一种大功率暖白光固态照明用SiAlON荧光透明陶瓷及其制备方法 |
CN113388400A (zh) * | 2021-06-03 | 2021-09-14 | 西安鸿宇光电技术有限公司 | 一种黄绿色力致发光材料及其制备方法和应用 |
CN116018388A (zh) * | 2020-09-10 | 2023-04-25 | 电化株式会社 | 铕活化β型塞隆荧光体和发光装置 |
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CN100549128C (zh) * | 2004-03-22 | 2009-10-14 | 株式会社藤仓 | 氧氮化物荧光体及发光器件 |
KR100772047B1 (ko) * | 2004-08-30 | 2007-10-31 | 가부시키가이샤후지쿠라 | 산질화물 형광체 및 발광 장치 |
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JP4733535B2 (ja) * | 2006-02-24 | 2011-07-27 | パナソニック株式会社 | 酸窒化物蛍光体、酸窒化物蛍光体の製造方法、半導体発光装置、発光装置、光源、照明装置、及び画像表示装置 |
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JP5322053B2 (ja) * | 2007-01-12 | 2013-10-23 | 独立行政法人物質・材料研究機構 | 蛍光体、その製造方法および発光器具 |
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JP2003179269A (ja) | 2001-01-24 | 2003-06-27 | Nichia Chem Ind Ltd | 光半導体素子 |
JP3726131B2 (ja) | 2002-05-23 | 2005-12-14 | 独立行政法人物質・材料研究機構 | サイアロン系蛍光体 |
JP3668770B2 (ja) | 2001-06-07 | 2005-07-06 | 独立行政法人物質・材料研究機構 | 希土類元素を付活させた酸窒化物蛍光体 |
US6632379B2 (en) | 2001-06-07 | 2003-10-14 | National Institute For Materials Science | Oxynitride phosphor activated by a rare earth element, and sialon type phosphor |
DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
DE10147040A1 (de) * | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
JP4207489B2 (ja) | 2002-08-06 | 2009-01-14 | 株式会社豊田中央研究所 | α−サイアロン蛍光体 |
JP4072632B2 (ja) * | 2002-11-29 | 2008-04-09 | 豊田合成株式会社 | 発光装置及び発光方法 |
US7074346B2 (en) * | 2003-02-06 | 2006-07-11 | Ube Industries, Ltd. | Sialon-based oxynitride phosphor, process for its production, and use thereof |
JP4052136B2 (ja) | 2003-02-06 | 2008-02-27 | 宇部興産株式会社 | サイアロン系酸窒化物蛍光体およびその製造方法 |
CN100549128C (zh) | 2004-03-22 | 2009-10-14 | 株式会社藤仓 | 氧氮化物荧光体及发光器件 |
JP4581120B2 (ja) | 2004-04-26 | 2010-11-17 | 独立行政法人物質・材料研究機構 | 酸窒化物粉末およびその製造方法 |
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- 2005-07-12 JP JP2006525554A patent/JP4045300B2/ja active Active
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008116351A1 (fr) * | 2007-03-26 | 2008-10-02 | He Shan Lide Electronic Enterprise Company Ltd. | Procédé de synthétisation d'une lumière à température de couleur inférieure et dispositif d'éclairage |
CN105143399A (zh) * | 2013-03-21 | 2015-12-09 | 宇部兴产株式会社 | 氧氮化物荧光体粉末及其制造方法 |
CN105143399B (zh) * | 2013-03-21 | 2017-02-15 | 宇部兴产株式会社 | 氧氮化物荧光体粉末及其制造方法 |
CN109020558A (zh) * | 2018-09-07 | 2018-12-18 | 安徽理工大学 | 一种大功率暖白光固态照明用SiAlON荧光透明陶瓷及其制备方法 |
CN109020558B (zh) * | 2018-09-07 | 2021-11-12 | 安徽理工大学 | 一种大功率暖白光固态照明用SiAlON荧光透明陶瓷及其制备方法 |
CN116018388A (zh) * | 2020-09-10 | 2023-04-25 | 电化株式会社 | 铕活化β型塞隆荧光体和发光装置 |
CN113388400A (zh) * | 2021-06-03 | 2021-09-14 | 西安鸿宇光电技术有限公司 | 一种黄绿色力致发光材料及其制备方法和应用 |
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WO2006006582A1 (ja) | 2006-01-19 |
EP1780255A4 (en) | 2008-12-24 |
KR20070103087A (ko) | 2007-10-22 |
US20060061263A1 (en) | 2006-03-23 |
KR20060086387A (ko) | 2006-07-31 |
JPWO2006006582A1 (ja) | 2008-04-24 |
KR100841676B1 (ko) | 2008-06-26 |
EP1780255A1 (en) | 2007-05-02 |
US8508119B2 (en) | 2013-08-13 |
TW200613519A (en) | 2006-05-01 |
CN1906269B (zh) | 2011-04-20 |
EP1780255B1 (en) | 2012-04-18 |
TWI266795B (en) | 2006-11-21 |
JP4045300B2 (ja) | 2008-02-13 |
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