CN1905144A - 用于封装图像传感器的方法和封装的图像传感器 - Google Patents

用于封装图像传感器的方法和封装的图像传感器 Download PDF

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CN1905144A
CN1905144A CNA2006100928909A CN200610092890A CN1905144A CN 1905144 A CN1905144 A CN 1905144A CN A2006100928909 A CNA2006100928909 A CN A2006100928909A CN 200610092890 A CN200610092890 A CN 200610092890A CN 1905144 A CN1905144 A CN 1905144A
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imageing sensor
metal coupling
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CN100590821C (zh
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C·W·谭
P·J·索
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Micron Technology Inc
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Abstract

通过将图像传感器贴附至基板、在图像传感器或者透明盖板上形成金属凸块来封装图像传感器，金属凸块形成围绕图像传感器的有源区的周围的图案。然后在金属凸块处将透明盖板粘结至图像传感器。使用，例如，常规引线接合方法在图像传感器和基板之间形成电连接。电连接密封在起保护作用的环氧树脂的内部。在一个实施例中，将多个图像传感器一起封装在同一基板上并通过例如切片将其分成单独封装的图像传感器。

Description

用于封装图像传感器的方法和封装的图像传感器
技术领域
本发明涉及封装方法，尤其涉及封装图像传感器的方法，并涉及封装的图像传感器。
背景技术
为了在图像传感器和电路板之间提供电连接，必须封装用于数字成像的图像传感器。图像传感器对在封装和使用期间存在的灰尘和微粒敏感。因此，图像传感器封装一般包括在图像传感器的有源区上方紧固的透明盖。用于将透明盖板固定在图像传感器上的常规方法包括将透明盖板直接地粘接到图像传感器和使用具有晶体隔离物的透明盖板，所述晶体隔离物使用基板上液晶(LCOS)工序在透明盖板上形成的。尽管这些技术很好用，但它们需要多个工序和/或在集成电路(IC)封装工艺中一般不使用的设备。
发明内容
通过将图像传感器贴附至基板、在图像传感器或者透明盖板上形成金属凸块来封装图像传感器，金属凸块形成围绕图像传感器的有源区的周围的图案。然后在金属凸块处将透明盖板粘结至图像传感器。使用例如常规引线接合方法在图像传感器和基板之间形成电连接。电连接密封在起保护作用的环氧树脂的内部。在一个实施例中，将多个图像传感器一起封装在同一基板上，并通过例如切片(sawing)将其分成单独封装的图像传感器。因为封装技术使用常规封装技术例如管芯连接、引线接合、粘合剂分配和固化，不需要单独的、专门的封装设备。
从以下结合附图的详细说明将使本发明的其他的方面和优点变得明显，并通过举例法说明本发明的原理。
附图说明
图1A和1B分别描述图像传感器的顶视和侧视图。
图2A-2H描述根据本发明的实施例用于封装图像传感器的方法的步骤，其中在贴附透明盖板之前在图像传感器上形成金属凸块并贴附进行引线接合。
图3描述具有围绕有源区的周围形成的金属凸块的示范性图案的图像传感器的顶视图。
图4A描述“标准(normal)”接合技术，其中在图像传感器处使用球压接合(ball bond)并在基板处使用针脚式接合(stitch bond)。
图4B描述“反向(reverse)”接合技术，其中在图像传感器处使用针脚式接合，在基板处使用球压接合。
图4C描述球压接合上球压针脚(ball stitch on ball bonding)技术，其中在图像传感器和基板处都使用球压接合。
图5描述一图像传感器的顶视图，其具有以围绕图像传感器的有源区的连续痕迹的方式在金属凸块处围绕有源区的周围分配的粘合剂。
图6A-6H描述根据本发明的实施例用于封装图像传感器的方法的步骤，其中在贴附透明盖板之后完成引线接合。
图7A-7H描述根据本发明的实施例用于封装图像传感器的方法的步骤，其中金属凸块形成在透明盖板上，而非图像传感器上。
图8描述具有围绕所述周围形成的金属凸块的示范性图案的透明盖板的顶视图。
图9描述用于封装图像传感器的方法的工艺流程图。
图10描述用于封装图像传感器的方法的工艺流程图。
整个说明书，使用相同的参考数字表示相同的元件。
具体实施方式
通过将图像传感器贴附至基板、在图像传感器或者透明盖板上形成金属凸块来封装图像传感器，其中金属凸块形成围绕图像传感器的有源区的周围的图案。然后在金属凸块处将透明盖板粘结至图像传感器。使用，例如，常规引线接合技术在图像传感器和基板之间形成电连接。电连接密封在起保护作用的环氧树脂的内部。在一个实施例中，将多个图像传感器一起封装在同一基板上并通过，例如，切片(swaing)将其分成单独封装的图像传感器。
图1A和1B分别描述图像传感器100的顶视和侧视图。该图像传感器包括响应于光来俘获图像信息的有源区102(即，光敏区域)。该图像传感器可以是，例如，互补金属氧化物半导体(CMOS)或者电荷耦合器件(CCD)型图像传感器。该图像传感器包括用于将图像传感器电连接至例如有机印刷电路板(PCB)、陶瓷面板、或者金属引线框的基板的焊盘(bond pad)104。
下面参照图2A-7H描述封装工艺的各种备选实施例。图2A-2H描述根据本发明的实施例用于封装图像传感器的方法的步骤，其中在贴附透明盖板之前将金属凸块形成在图像传感器上并执行引线接合。参照图2A，将如上面图1A和1B所述的图像传感器100贴附于基板106。该基板是，例如，有机PCB、陶瓷面板、或者金属引线框。如图2A所述，超过一个的图像传感器贴附于同一基板。将多个IC贴附至同一基板被广泛地用于1C封装工艺以提高效率。
在将图像传感器100贴附于基板106之后，如图2B所述，在图像传感器上形成金属凸块110。在一个实施例中，金属凸块具有均一的高度并形成围绕图像传感器的有源区的周边的图案。图3描述具有围绕有源区102的周围形成的金属凸块110的示范性图案的图像传感器100的顶视图。在图3的实施例中，在图像传感器的焊盘(图1A)上形成金属凸块。可使用引线接合设备由金形成金属凸块。在一个备选实施例中，也可以采用相同的工序在基板上形成金属凸块。
一旦金属凸块110形成在图像传感器100和基板106上，如图2C所示，就在图像传感器和基板之间产生电连接。在图2C的实施例中，通过焊接在图像传感器和基板上的金属凸块110之间的接合引线(wire bond)114形成电连接。可以在引线接合期间在基板上形成金属凸块112。例如，使用球上球压针脚(ball stitch on ball，BSOB)技术完成引线接合，当然可以使用其他的引线接合技术。参照图4A-4C，描述用于在图像传感器和基板之间形成电连接的引线接合技术的实例。图4A描述“标准”焊接技术，其中在图像传感器处使用球压接合120，在基板处使用针脚式接合122。图4B描述“反向”焊接技术，其中在图像传感器处使用针脚式接合124和在基板处使用球压接合126。图4C描述BSOB技术，其中在图像传感器和基板处均使用球压接合128和130。虽然描述了一些引线接合技术，但可以使用其他方法在图像传感器和基板之间产生电连接。
一旦完成了引线接合，下一步是将透明盖板粘结至每个图像传感器。参照图2D，将粘合剂132分配在图像传感器100上。在图2D的实施例中，在金属凸块110的位置围绕图像传感器的有源区102的周围分配粘合剂。在一个实施例中，分配粘合剂以便粘合剂的连续痕迹围绕图像传感器的有源区。图5描述了图像传感器的顶视图，其中粘合剂132在金属凸块的位置围绕图像传感器的有源区以围绕有源区的连续痕迹的方式分配。
一旦围绕图像传感器100的有源区102的周围分配粘合剂132，就放置透明盖板与粘合剂和金属凸块110接触。图2E描述放置成与粘合剂132和金属凸块110接触的透明盖板134。如图2E所述，金属凸块用作透明盖板的支撑和隔离物。也就是说，金属凸块为待安装其上的透明盖板提供支撑结构，同时也在透明盖板和图像传感器之间设置距离。由于均一高度的金属凸块，透明盖板齐平地放置在金属凸块顶上。在透明盖板放置成与粘合剂和金属凸块接触之后，使粘合剂固化以将透明盖板连接至图像传感器。可以例如，在室温下、在升高的温度下、或者通过施加UV光来使粘合剂固化。一旦使粘合剂固化，每个图像传感器的有源区就密封在由图像传感器、金属凸块、透明盖板、和粘合剂形成的空腔136内。
一旦粘合剂132固化，如图2F所示，通过将环氧树脂138施加在图像传感器之间的间隙中来保护图像传感器100和基板106之间的电连接114。一旦施加，环氧树脂就固化成密封接合引线114的固体。尽管描述了环氧树脂，但可以使用其他材料来填充图像传感器之间的间隙。
一旦使图像传感器100之间的间隙中的环氧树脂138固化，如图2G所示，焊球140就附着于基板106。在图2G的实施例中，将焊球贴附在基板的底侧以便图像传感器封装可以物理地和电学地连接至其他系统。
一旦焊球140贴附于基板106，就将图像传感器封装分离成或者“单个化”成单独封装的图像传感器。图2H描述在彼此分离成三个独立封装的图像传感器142之后的图2G的三个图像传感器100。在一个实施例，通过在器件之间进行切片使独立封装的图像传感器单个化。
在图2A至2H的实施例中，在贴附透明盖板134之前进行引线接合。图6A-6H描述根据本发明的实施例用于封装图像传感器的方法的步骤，其中在贴附透明盖板之后完成引线接合。参照图6A，将如上面图1A和1B所述的图像传感器100粘附于基板106。
在将图像传感器100贴附于基板106之后，如图6B所示，在图像传感器上形成金属凸块110。在图6B的实施例中，金属凸块具有均一的高度并形成围绕图像传感器的有源区102的周围的图案。图3描述了一图像传感器100的顶视图，其具有围绕图像传感器的有源区102的周围形成的金属凸块110的示范性图案。在参照图6A-6H描述的示例性方法中，金属凸块没有形成在图像传感器的焊盘上。特别地，使图像传感器的焊盘暴露，以便接合引线的一端可以连接到焊盘。
一旦金属凸块110形成在图像传感器和基板上，下一步是将透明盖板粘结至每个图像传感器100。参照图6C，在图像传感器上分配粘合剂132。在图6C的实施例中，在金属凸块处围绕图像传感器的有源区的周围分配粘合剂。在一个实施例中，分配粘合剂，以便如图5所示粘合剂的连续痕迹围绕图像传感器的有源区102。
一旦围绕图像传感器的有源区的周围分配粘合剂，就放置透明盖板与粘附剂132和金属凸块110接触。图6D描述放置成与粘合剂和金属凸块接触的透明盖板134。如图6D所述，金属凸块110用作透明盖板的支架和隔离物。也就是说，金属凸块提供放置透明盖板的支撑结构，同时也在透明盖板和图像传感器之间设置距离。由于均一高度的金属凸块，透明盖板齐平地放置在金属凸块顶上。在放置与粘合剂132和金属凸块接触的透明盖板之后，使粘合剂固化。可以例如，在室温下、在升高的温度下、或者通过施加UV光来使粘合剂固化。一旦粘合剂固化，每个图像传感器的有源区就封装在由图像传感器、金属凸块、透明盖板、和粘合剂形成的空腔136的内部。
一旦透明盖板134贴附于图像传感器100，如图6E所示，就在图像传感器和基板106之间产生电连接。在图6E的实施例中，通过焊接在基板和图像传感器之间的接合导线114形成电连接。使用例如参照图4A的如上所述的标准接合完成该引线接合，当然可以使用其他的引线接合技术。作为选择，可以使用其他技术以在图像传感器和基板之间产生电连接。
一旦完成引线接合，如图6F所述，通过将环氧树脂138施加在图像传感器之间的间隙中来保护图像传感器100和基板106之间的电连接114。一旦施加，环氧树脂就固化成固体，从而密封导电连接。
一旦使图像传感器100之间的间隙中的环氧树脂138固化，如图6G所示，就使焊球140附着于基板106。在图6G的实施例中，焊球贴附在基板的底侧以便图像传感器封装可以与其他系统物理地和电学地连接。
一旦焊球140附着于基板106，就将图像传感器封装分离成或者“单个化”成单独封装的图像传感器。图6H描述在彼此分离成三个独立封装的图像传感器144之后，图6G的三个图像传感器。在一个实施例，通过在器件之间进行切片使独立封装的图像传感器单个化。
在图2A至2H和图6A至6H的实施例中，在图像传感器100上形成金属凸块110。图7A-7H描述了根据本发明的实施例用于封装图像传感器的方法的步骤，其中金属凸块形成在透明盖板134上，而非图像传感器上。参照图7A，将如上面图1A和1B所述的图像传感器100贴附于基板106。
从参照图7A所述的步骤分离，在透明盖板134上形成金属凸块110。图7B描述在其上形成了金属凸块的三个透明盖板。例如，使用引线接合设备在透明盖板上形成金属凸块。在一个实施例中，金属凸块具有均一的高度并形成围绕对应的图像传感器100的有源区102的周围的图案。图8描述具有围绕所述周围形成的金属凸块110的示例性图案的透明盖板134的顶视图。在该实例中，金属凸块配置成使图像传感器上的焊盘暴露。在一个实施例中，可以在封装过程中彼此连接透明盖板。
一旦图像传感器100贴附于基板106并且金属凸块110形成在透明盖板134上，下一步是将透明盖板粘结至图像传感器。参照图7C，在图像传感器上分配粘合剂。在图7C的实施例中，按照对应于形成在透明盖板上的金属凸块的图案、围绕每个图像传感器的有源区的周围分配粘合剂132。在一个实施例中，与图5所示的相似，分配粘合剂以便粘合剂的连续痕迹围绕图像传感器的有源区，只是没有金属凸块。在一个替换实施例中，在金属凸块位置处的透明盖板上分配粘合剂，而不是在图像传感器处。
一旦围绕图像传感器100的有源区102的圆周分配粘合剂132，如图7B所示的透明盖板134的金属凸块110就与粘合剂和图像传感器接触放置。图7D描述与粘合剂和图像传感器接触放置的透明盖板的金属凸块110。如图7D所述，金属凸块用作透明盖板的支撑和隔离物。也就是说，金属凸块为透明盖板提供结构支撑，同时也在透明盖板和图像传感器之间设置距离。由于均一高度的金属凸块，透明盖板齐平地放置在金属凸块顶上。在透明盖板的金属凸块与粘合剂和图像传感器接触放置之后，使粘合剂固化。可以例如，在室温下、在升高的温度下、或者通过施加UV光来使粘合剂固化。一旦粘合剂固化，每个图像传感器的有源区102就密封在由图像传感器、金属凸块、透明盖板、和粘合剂形成的空腔136的内部。
一旦透明盖板134贴附于图像传感器100，如图7E所示，在图像传感器和基板106之间产生电连接。在图7E的实施例中，通过焊接在基板和图像传感器之间的接合引线114形成电连接。例如使用参照图4A所述的标准接合完成引线接合，当然可以使用其他的引线接合技术。可以使用其他技术以在图像传感器和基板之间产生电连接。
一旦完成引线接合，如图7F所示，通过将环氧树脂138施加在图像传感器之间的间隙中来保护图像传感器100和基板106之间的电连接114。一旦施加，在图像传感器之间的间隙中的环氧树脂固化成固体。
一旦图像传感器之间的间隙中的环氧树脂138固化，如图7G所示，就将焊球140贴附于基板。在图7G的实施例中，焊球贴附在基板的底侧以便图像传感器封装可以与其他系统物理地和电学地连接。
一旦焊球140附着于基板106，就将图像传感器封装分离成或者″单个化″成单独封装的图像传感器146。图7H描述在彼此分离成三个单独封装图像传感器146之后，图7G的三个图像传感器。在一个实施例，通过在器件之间进行切片使独立封装的图像传感器单个化。
使用上述封装技术，通过以常规割锯路径宽度切片，可实现所述单个化。常规割锯路径宽度使每个基板能够保持一定数目的图像传感器。
图9描述用于封装图像传感器的方法的工艺流程图。在块200处，将图像传感器贴附于基板，其中图像传感器具有有源区。在块202处，在图像传感器或者透明盖板之一上形成金属凸块，其中以围绕图像传感器的有源区的周围的图案的方式形成金属凸块。在块204处，在金属凸块处将透明盖板粘结到图像传感器。
图10描述用于封装图像传感器的方法的工艺流程图。在块210处，将图像传感器贴附于基板，其中图像传感器具有有源区。在块212处，围绕图像传感器的有源区在图像传感器上形成金属凸块。在块214处，在金属凸块上分配粘合剂。在块216处，透明盖板放置成与粘合剂接触并在图像传感器的有源区的上方。在块218处，固化粘合剂以将透明盖板固定到图像传感器。
尽管已经描述和说明了本发明的具体的实施例，但本发明不局限于描述和说明的具体形式或者部件的布置。通过所附的权利要求和等效物来限定本
发明的范围。

Claims (20)

1.一种用于封装图像传感器的方法，该方法包括：
将图像传感器贴附于基板，其中图像传感器具有有源区；
在图像传感器或者透明盖板中的一个上形成金属凸块，其中金属凸块形成围绕图像传感器的有源区的周围的图案；以及
在金属凸块处将透明盖板粘结至图像传感器。
2.权利要求1的方法，其中金属凸块具有均一高度。
3.权利要求1的方法，其中金属凸块是金。
4.权利要求1的方法，其中使用引线键合设备形成金属凸块。
5.权利要求1的方法，其中在金属凸块处将透明盖板粘结至图像传感器包括：围绕图像传感器的有源区的周围分配粘合剂。
6.权利要求1的方法，其中在金属凸块处将透明盖板粘结至图像传感器包括：围绕图像传感器的有源区的周围分配粘合剂，使得图像传感器的有源区密封在由图像传感器、金属凸块、透明盖板、和粘合剂形成的腔中。
7.权利要求1的方法，还包括在图像传感器和基板之间形成电连接。
8.权利要求7的方法，其中在将透明盖板粘结到图像传感器之前形成电连接。
9.权利要求7的方法，其中在将透明盖板粘结到图像传感器之后，形成电连接。
10.权利要求7的方法，还包括在电连接的上方分配环氧树脂以密封电连接。
11.权利要求10的方法，还包括从贴附于同一基板的图像传感器阵列分离图像传感器。
12.一种用于封装图像传感器的方法，该方法包括：
将图像传感器贴附于基板，其中图像传感器具有有源区；
围绕着图像传感器的有源区在图像传感器上形成金属凸块；
在金属凸块上分配粘合剂；
与粘合剂接触并在图像传感器的有源区上方放置透明盖板；以及
固化粘合剂以使透明盖板固定到图像传感器。
13.权利要求12的方法，其中围绕图像传感器的有源区的周围分配粘合剂。
14.权利要求12的方法，其中围绕图像传感器的有源区的周围分配粘合剂，使得图像传感器的有源区密封在由图像传感器、金属凸块、透明盖板、和粘合剂形成的腔中。
15.一种封装的图像传感器，包括：
基板；
贴附于基板的图像传感器，其中图像传感器具有有源区；
图像传感器和基板之间的电连接；
足够大以覆盖图像传感器的有源区的透明盖板；
以围绕图像传感器的有源区的周边的图案的形式在图像传感器和透明盖板之间的金属凸块；以及
以对应于金属凸块的图案的形式围绕有源区的周围在图像传感器和透明盖板之间的粘合剂，其中该粘合剂连接透明盖板和图像传感器。
16.权利要求15的封装的图像传感器，其中图像传感器、透明盖板、金属凸块、和粘合剂密封图像传感器的有源区。
17.权利要求16的封装的图像传感器，还包括形成在电连接上方以密封电连接的环氧树脂。
18.权利要求15的封装的图像传感器，其中在图像传感器上形成金属凸块。
19.权利要求15的封装的图像传感器，其中在图像传感器的焊盘上形成金属凸块。
20.权利要求15的封装的图像传感器，其中在透明盖板上形成金属凸块。
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