CN1899750B - 焊料金属、助焊剂和焊膏 - Google Patents

焊料金属、助焊剂和焊膏 Download PDF

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Publication number
CN1899750B
CN1899750B CN2006101154040A CN200610115404A CN1899750B CN 1899750 B CN1899750 B CN 1899750B CN 2006101154040 A CN2006101154040 A CN 2006101154040A CN 200610115404 A CN200610115404 A CN 200610115404A CN 1899750 B CN1899750 B CN 1899750B
Authority
CN
China
Prior art keywords
scaling powder
soldering paste
quality
solder
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101154040A
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English (en)
Chinese (zh)
Other versions
CN1899750A (zh
Inventor
庄司孝志
西冈绫子
黑住忠利
涩谷义纪
网田仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN1899750A publication Critical patent/CN1899750A/zh
Application granted granted Critical
Publication of CN1899750B publication Critical patent/CN1899750B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2006101154040A 2002-01-30 2003-01-30 焊料金属、助焊剂和焊膏 Expired - Fee Related CN1899750B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002020925A JP4042418B2 (ja) 2002-01-30 2002-01-30 ハンダ付けフラックス
JP020925/2002 2002-01-30

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB038014068A Division CN1298492C (zh) 2002-01-30 2003-01-30 焊料金属、助焊剂和焊膏

Publications (2)

Publication Number Publication Date
CN1899750A CN1899750A (zh) 2007-01-24
CN1899750B true CN1899750B (zh) 2010-06-16

Family

ID=27744291

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2006101154040A Expired - Fee Related CN1899750B (zh) 2002-01-30 2003-01-30 焊料金属、助焊剂和焊膏
CNB038014068A Expired - Fee Related CN1298492C (zh) 2002-01-30 2003-01-30 焊料金属、助焊剂和焊膏

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB038014068A Expired - Fee Related CN1298492C (zh) 2002-01-30 2003-01-30 焊料金属、助焊剂和焊膏

Country Status (3)

Country Link
JP (1) JP4042418B2 (ja)
CN (2) CN1899750B (ja)
TW (1) TWI265838B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576286B2 (ja) * 2004-05-10 2010-11-04 昭和電工株式会社 電子回路基板の製造方法および電子部品の実装方法
CN100494436C (zh) * 2005-08-02 2009-06-03 马莒生 一种低熔点无铅焊料合金
CN100352595C (zh) * 2005-08-04 2007-12-05 上海交通大学 Sn－Zn－Bi－Cr合金无铅焊料
CN100445017C (zh) * 2005-12-28 2008-12-24 梁树华 无铅焊锡膏及其制备方法
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
CN102366861A (zh) * 2011-06-27 2012-03-07 吴江市精工铝字制造厂 一种铝合金焊接用助焊剂
CN102528329B (zh) * 2011-12-30 2013-09-18 深圳市上煌实业有限公司 一种无卤无铅焊锡膏及制备方法
JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
CN102794582B (zh) * 2012-08-15 2015-01-14 北京工业大学 一种与高熔点钎料配套使用的助焊剂及其配制方法
CN103170779A (zh) * 2013-04-10 2013-06-26 安徽华东光电技术研究所 提高焊接合格率的方法及释放包裹在焊膏中的空气的方法
JP5816947B1 (ja) * 2015-02-05 2015-11-18 株式会社弘輝 フラックス用活性剤、フラックス及びはんだ
CN105499830A (zh) * 2016-03-04 2016-04-20 保定爱廸新能源股份有限公司 光伏焊带用Sn-Zn系无铅多元合金及其制备方法
CN106216883B (zh) * 2016-07-19 2018-02-13 徐州工程学院 一种用于Cu‑Mg‑Sn‑Fe复合纳米材料激光助焊剂及其制备方法
JP6322881B1 (ja) 2017-12-21 2018-05-16 千住金属工業株式会社 フラックス及びフラックス用樹脂組成物
CN108048774B (zh) * 2017-12-31 2020-07-10 天长市飞龙金属制品有限公司 一种金属表面热浸镀方法
JP7011823B2 (ja) * 2018-05-14 2022-02-10 株式会社弘輝 フラックス及びはんだ材料
JP7160022B2 (ja) * 2018-12-26 2022-10-25 荒川化学工業株式会社 フローソルダリング用フラックス、はんだ付け方法
JP7032686B1 (ja) 2021-10-12 2022-03-09 千住金属工業株式会社 フラックス及びソルダペースト

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1110205A (zh) * 1994-04-06 1995-10-18 化学工业部晨光化工研究院成都分院 无卤素非松香型低固含量免清洗助焊剂
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232963B2 (ja) * 1994-10-11 2001-11-26 株式会社日立製作所 有機基板接続用鉛レスはんだ及びそれを用いた実装品
CN1139607A (zh) * 1995-06-30 1997-01-08 三星电机株式会社 具有优越力学性质的无铅焊料
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP4138965B2 (ja) * 1998-10-01 2008-08-27 三井金属鉱業株式会社 無鉛ハンダ粉及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1110205A (zh) * 1994-04-06 1995-10-18 化学工业部晨光化工研究院成都分院 无卤素非松香型低固含量免清洗助焊剂
US20010042779A1 (en) * 2000-02-08 2001-11-22 Hitoshi Amita Solder paste

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-226488A 1994.08.16

Also Published As

Publication number Publication date
CN1298492C (zh) 2007-02-07
JP4042418B2 (ja) 2008-02-06
JP2003225796A (ja) 2003-08-12
CN1899750A (zh) 2007-01-24
TW200304859A (en) 2003-10-16
TWI265838B (en) 2006-11-11
CN1578713A (zh) 2005-02-09

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100616

Termination date: 20120130