CN1880200B - 使用非牛顿流体运输衬底的方法和装置 - Google Patents
使用非牛顿流体运输衬底的方法和装置 Download PDFInfo
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Abstract
使用非牛顿流体运输衬底的方法和装置提供了用于运输衬底的方法。在该方法中,提供非牛顿流体以及衬底在非牛顿流体中悬浮。非牛顿流体能支撑衬底。此后,向非牛顿流体施加足够的力以使得非牛顿流体流动,从而该流沿着流的方向移动衬底。也描述了使用非牛顿流体运输衬底的装置和系统。
Description
背景技术
可通过各种方法将衬底,诸如半导体晶片,从一个位置移动到另一个位置。例如,在半导体制造系统中一般使用机械滚子以在系统内移动衬底。具体地,可将衬底设置在滚子之间以使滚子的锥形表面带动衬底的边缘。为了移动衬底,滚子旋转以朝旋转的方向推衬底。滚子和其它机械设备的问题在于与滚子连带的机构复杂。而且,滚子必须与衬底接触以移动衬底。这种接触可在衬底上施加相当大的应力,其可导致衬底退化。
水也被用来移动衬底。例如,可将衬底设置在水流中以在流动的方向移动衬底。使用水运输衬底的问题在于衬底会下沉且粘着底表面,从而阻碍衬底的运输。当衬底粘着表面时,衬底不能容易地移位。因为水不能支撑衬底,衬底下沉到底。因此,使用水运输衬底是不可靠的且衬底易于粘着在底部。
鉴于前述内容,需要提供简单且可靠的方法和装置来运输衬底。
发明内容
一般地说,本发明通过提供了用于运输衬底的方法、装置和系统满足这些需求。应该清楚本发明可以以多种方式应用,包括作为方法、系统或设备。下面描述本发明的几个创造性的实施方式。
根据本发明的第一方面,提供了带有导管形式空腔的腔室装置。配置导管来输送非牛顿流体以通过导管运输衬底。
根据本发明的第二方面,提供了用于运输衬底的系统。该系统包括具有在腔室的壁上的输入端、输出端和输入口的腔室。输入端限定了能够接收衬底的第一开口以及输出端限定了第二开口。输入口接近第一开口且被配置以使非牛顿流进入腔室。该系统另外包括连接到输入口的非牛顿流体供应器。配置非牛顿流体供应器以使非牛顿流体经过输入口进入腔室以使得非牛顿流体朝向第二开口流动,从而流能够从第一开口向第二开口移动衬底。
根据本发明的第三方面,提供了用于运输衬底的方法。在该方法中,提供非牛顿流体以及衬底在非牛顿流体中悬浮。因为非牛顿流体能支撑衬底,所以衬底能悬浮。此后,向非牛顿流体施加足够的力以使得非牛顿流体流动,从而该流能够沿着流动方向移动衬底。
根据本发明的第四方面,提供了用于运输衬底的方法。在该方法中,导管形式的腔室充满了非牛顿流体。腔室具有输入端和输出端。在输入端将衬底引入腔室以使衬底悬浮在非牛顿流体中。强行使另外的非牛顿流体经过腔室以使非牛顿流体流在衬底的表面上移动且非牛顿流体在输出端排出。
参考附图,通过举例说明本发明的原理,从下面的详细的说明将清楚本发明的优点和其它方面。
附图说明
参考附图,通过下面的详细的说明将容易清楚本发明,相同的参考数字代表相同的结构元件。
图1是根据本发明一个实施方式的用于运输衬底的方法的高水平概述的流程图。
图2A是根据本发明一个实施方式的沿着水平方向运输衬底的装置的简化透视图。
图2B是图2A中示出的装置的运输部分的截面、侧视图。
图3A是根据本发明一个实施方式的沿着垂直方向运输衬底的装置的简化透视图。
图3B是图3A中示出的装置的运输部分的截面、侧视图。
图4A-C是根据本发明一个实施方式的运输衬底的另一个装置的不同的视图。
图5是根据本发明一个实施方式的使用图4中示出的装置以运输衬底的半导体衬底清洗系统的框图。
具体实施方式
发明描述了用于运输衬底的方法、装置和系统。显然对于本领域的技术人员,虽然没有这些具体的细节部分或全部,也可以实现本发明。在其它的例子中,为了使本发明清楚,没有详细地描述公知的工艺操作。
在此描述的实施方式提供了使用非牛顿流体的用于运输衬底的方法、装置和系统。本质上,通过将衬底放置在非牛顿流体的流中来运输衬底。非牛顿流体的流沿着流的方向移动衬底。下面更详细地解释,在一个实施方式中,用于运输衬底的装置包括具有以导管形式的空腔的腔室。导管能输送非牛顿流体以经过导管运输衬底。
图1是根据本发明一个实施方式的用于运输衬底的方法的高水平概述的流程图。如在图1中所示,首先在操作110中提供非牛顿流体。非牛顿流体是粘性随着施加的切变应力改变的流体。非牛顿流体的例子是位于固体和液体极值之间的中间地带的软稠合物质。通过外部应力软稠合物质容易形变以及软稠合物质的例子包括乳胶、胶质、泡沫等。应该清楚乳胶不互溶的液体的混合物,例如,在水中的牙膏、低温淤渣、油等。胶质是分散在水中的聚合物,白明胶是胶质的例子。泡沫是限定在液体基体中的气泡,剃须膏是泡沫的例子。
在提供非牛顿流体之后,在操作112中衬底悬浮在非牛顿流体中。换句话说,衬底浸入在非牛顿流体中。非牛顿流体几乎能无限地支撑衬底,甚至没有流动,因为非牛顿流体的特征是屈服点低于非牛顿流体没有流动的点。衬底的重量足够小以使停留在非牛顿流体上的衬底不超出非牛顿流体的屈服点。因此,非牛顿流体能支撑衬底。
衬底是任何适合的基材,在一个范例实施方式中,衬底是半导体晶片,其是半导体材料的薄片,诸如晶体硅,其上通过扩散和沉积各种材料形成微电路。在另一个范例实施方式中,衬底是硬盘,其由带有磁介质涂层的圆的、刚性板构成。
仍参考图1,在衬底悬浮于非牛顿流体中之后,在操作114中向非牛顿流体施加足够的力以使非牛顿流体流动。下面将更详细地描述,因为衬底悬浮于非牛顿流体中,非牛顿流体的流向衬底施加了力且沿着流的方向移动衬底。结果,非牛顿流体的流可运输衬底。
图2A是根据本发明一个实施方式的沿着水平方向运输衬底的装置的简化透视图。装置214包括具有导管形式的空腔的腔室216。下面将更详细地描述,设置导管以输送非牛顿流体以能够经过导管运输衬底。图2A示出了空腔具有矩形形状。然而,应该清楚空腔可限定成任何适合的形状和尺寸来容纳和运输衬底。例如,在另外的实施方式中,空腔具有柱状形状。
图2B是图2A中示出的装置的运输部分的沿切平面线A-A的截面、侧视图。如图2B所述,装置214的腔室216充满非牛顿流体210。衬底212在非牛顿流体210内悬浮。由管道导管的定尺寸限定的腔室216的运输部分运输衬底212。例如图2B示出了部分密封的导管限定运输部分。特别地,当从侧面看,由顶平面表面230和其相对于顶平面表面定位的底平面表面232限定部分密封导管,以在顶平面和底平面之间密封衬底212。导管的高度240由顶平面表面230和底平面表面232之间的距离限定,可具有大于衬底212厚度的任何适合的尺寸。例如,如果衬底212的厚度为1毫米,那么高度240可为4毫米。
为了运输衬底212,向非牛顿流体210上施加足够的力以使非牛顿流体流动。可以通过任何适当的方法产生足够的力。例如,通过将另外的非牛顿流体210充入腔室可产生足够的力。非牛顿流体210的流可沿流的方向移动衬底212。图2B示出了从左到右的流的方向且基本上平行于衬底212的表面。非牛顿流体210的流在衬底212的表面上移动,且施加平行于衬底的表面的力来以流的速度或接近流的速度从左到右水平地移动衬底。
图3A是根据本发明一个实施方式的沿着垂直方向运输衬底的装置的简化透视图。装置302包括具有圆柱导管形式空腔的腔室303。配置导管来输送非牛顿流体以通过导管运输衬底。
图3B是图3A中示出的装置的运输部分的沿切平面线B-B的截面、侧视图。如图3B所述,装置302的腔室303充满非牛顿流体210。衬底212在非牛顿流体210内悬浮。由管道导管的定尺寸限定的腔室303的运输部分垂直地运输衬底212。当从侧面看,由左边垂直表面305和右边垂直表面304限定导管。左边垂直表面305相对于右边垂直表面304定位以密封在左边垂直表面和右边垂直表面之间的衬底212。在该实施方式中,定位衬底212基本上垂直于左边垂直表面305和右边垂直表面304。
为了垂直地运输衬底212,向非牛顿流体210上施加足够的力以使非牛顿流体流动。如图3B所示,非牛顿流体210从底到顶垂直流动。非牛顿流体210的流的方向基本上垂直于衬底212的表面。因此,流施加基本上垂直于衬底212表面的力以垂直向上的移动衬底。
图4A-C是根据本发明一个实施方式的运输衬底的装置的不同的视图。图4A是装置310的顶视图,图4B是装置310的侧视图,图4C是装置310的放大的侧视图。装置310包括腔室、输入口332、保持销312和板330。腔室具有矩形导管形式的空腔。腔室具有输入端316以及定位于与输入端相对的输出端317。由能够接收衬底212的第一开口限定了输入端316。由能够输出衬底212的第二开口限定了输出端317。另外包括接近输入端316的第一开口的板330,其用来封锁第一开口。
装置310也包括连接到腔室的壁的输入口332。配置输入口332以使(port)非牛顿流体流入腔室。如图4B的顶视图所示,在一个实施方式中,输入口332沿腔室的宽度延伸。然而,应该清楚输入口332可具有任何适合的形状和尺寸。非牛顿流体供应器(未示出)可连接到输入口332以使非牛顿流体经过输入口进入腔室。在图4B的实施方式中,装置310包括定位于接近输入端316的两个输入口332。侧视图示出了一个输入口332位于腔室的顶部以及另一个输入口位于腔室的底部。为了从顶部和底部产生非牛顿流体的相对流彼此相对设置输入口332。通过向衬底的相对表面上施加力,相对流有助于保持衬底212悬浮在腔室的中间。然而,根据流的预定方向,装置310可包括一个输入口或多于两个的输入口。另外,如下面更详细的描述,输入口332可位于接近输入端316,因为预期的流的方向是从输入端到输出端317。然而,应该清楚输入口332可位于腔室内任何适合的位置以产生不同的流特性。
仍参考图4A-C,在将衬底212引入装置310的腔室之前,非牛顿流体供应器使非牛顿流体经过输入口332进入腔室以用非牛顿流体充满腔室。在腔室充满非牛顿流体之后,经过在输入端316的第一开口将衬底212引入腔室。引入衬底212以使衬底在非牛顿流体中悬浮。换句话说,将衬底212放置在腔室中以使衬底不接触腔室的表面。非牛顿流体具有支撑衬底212的能力以使衬底悬浮在腔室中间。通过向衬底相对表面施加力,来自于输入口332的相对流也有助于保持衬底212悬浮在腔室中间。
在将衬底212引入腔室之后,接近输入端316的第一开口的板330关闭以封锁第一开口。因为,非牛顿流体不能经过输入端316的第一开口流出,从输入口332进入的非牛顿流体从输入端朝输出端317流动以在输出端的第二开口流出。非牛顿流体的流在衬底212的表面上移动且在流的方向上向衬底施加力。结果流朝输出端317移动衬底212。
装置310的实施方式可在腔室内包括一个或多个保持销312。保持销312可用于接收衬底212的边缘以阻止衬底移动。在图4A和4B的实施方式中,当非牛顿流体流经腔室时,保持销312接近输出端317以阻止衬底212经输出端的第二开口移动。当非牛顿流体流经导管时,保持销312能保持衬底212。为了移动衬底212,可配置保持销312来释放对衬底的保持以允许非牛顿流体流沿导管移动衬底以及从输出端317的第二开口移出。例如,在一个实施方式中,保持销312可为较低的以允许衬底212的移动。
图5是根据本发明一个实施方式的使用图4A-C中示出的装置以运输衬底的半导体衬底清洗系统的框图。衬底清洗系统502用于半导体器件制造工艺以从衬底去除粒子和微量的金属污染。如图5中所示,衬底清洗系统502包括输入台504、清洗台A510、清洗台B511、干燥台506、非牛顿流体供应器512、输出台508。衬底清洗系统502的实施方式可在清洗台A510和清洗台B511中合并在图4A-C中示出的装置以运输衬底。应当清楚清洗台A510和清洗台B511可以包括任何用来清洗衬底而配置的适当的清洗设备。例如,清洗台A510和清洗台B511可使用泡沫以清洗衬底。为了更多关于使用泡沫来清洗衬底的信息,可参考2005年6月15日申请的名为“Method and Apparatus for Cleaning aSubstrate Using Non-Newtonian Fluids”的U.S.专利申请No.11/153,957。
从将衬底放入输入台504开始清洗衬底的范例操作。非牛顿流体供应器512,其连接到清洗台A510和清洗台B511以提供非牛顿流体和足够的力以使非牛顿流体进入清洗台A510的腔室。在清洗台A510的腔室充满非牛顿流体之后,在输入腔室504中的滚子推动衬底进入清洗台A的腔室以停止在腔室内保持销所处位置。当衬底完全地插入清洗台A510,清洗台A的板关闭以封锁清洗台的开口。接着,使用适合的清洗方法,清洗台A510清洗衬底。在清洗衬底之后,保持销降为较低以使衬底随着非牛顿流体的流移出清洗台A510。
在清洗台A510清洗衬底之后,冲洗衬底以及为了第二次清洗将衬底引入清洗台B511。清洗台B511可使用与清洗台A510相同的清洗工艺或使用不同的清洗工艺。在清洗台B511清洗衬底之后,使用非牛顿流体的流将衬底运送出清洗台B,冲洗衬底以及在干燥台506干燥衬底。此后,滚子推动已清洗、已干燥的衬底到输出台508,在此衬底从衬底清洗系统502中输出。
总之,上述实施方式提供了用于运输衬底的方法、装置和系统。本质上,使用非牛顿流体流来从一个位置向另一个位置移动衬底。不同于水,非牛顿流体能支撑衬底。结果,当放置在非牛顿流体中时,衬底将不下沉且不粘着底部。而且,由于非牛顿流体能支撑衬底,在运输期间不用机械的机构与衬底接触。非牛顿流体不向衬底施加任何显著的应力。结果,不同于使用滚子,衬底上没有显著的应力,通过非牛顿流体可运输衬底。
尽管在此详细地描述了本发明的几个实施方式,应该清楚通过本领域技术人员,不离开本发明的精神和范围,以许多其它具体形式可实施本发明。因此,出现的范例和实施方式应该认为是说明性的不是限制性的,且本发明不限于在此提供的细节,而是在附加的权利要求的范围内可修改和实践。
Claims (16)
1.一种利用非牛顿流体运输衬底的装置,包括:
具有导管形的空腔的腔室,该腔室设置为输送非牛顿流体,从而在空腔中运输衬底;
在腔室的壁中的输入口,输入口设置为使非牛顿流体进入腔室;
其中腔室具有输入端和输出端,输入端限定了能够接收衬底的第一开口,输出端限定了能够输出衬底的第二开口;
腔室内的接近第二开口的保持销,保持销设置为接收衬底的边缘以阻止衬底经所述第二开口的移动,
其中,所述腔室具有顶壁和底壁,所述顶壁和底壁具有通过其中形成的彼此相对的所述输入口,来自彼此相对的所述输入口的相对流通过向衬底的相对表面上施加力以帮助保持衬底悬浮在腔室内。
2.根据权利要求1所述的装置,进一步包括:
接近第一开口设置为封锁第一开口的板。
3.根据权利要求1所述的装置,其中非牛顿流体限定为软稠合物质。
4.一种用于运输衬底的系统,包括:
在腔室的壁上具有输入端、输出端和输入口的腔室,输入端限定了能够接收衬底的第一开口,输出端限定了第二开口,输入口接近第一开口且被设置为使非牛顿流体进入腔室;以及
连接到输入口的非牛顿流体供应器,该非牛顿流体供应器使非牛顿流体经过输入口进入腔室以使得非牛顿流体的流朝向第二开口,流体能够从第一开口向第二开口移动衬底,
腔室内的接近第二开口的保持销,保持销配置为接收衬底的边缘,当非牛顿流体流经腔室时阻止衬底经所述第二开口的移动,
其中,所述腔室具有顶壁和底壁,所述顶壁和底壁具有通过其中形成的彼此相对的所述输入口,来自彼此相对的所述输入口的相对流通过向衬底的相对表面上施加力以帮助保持衬底悬浮在腔室内。
5.根据权利要求4所述的系统,其中腔室的运输部分由管道导管限定以运输衬底。
6.根据权利要求4所述的系统,其中腔室的运输部分由部分密封的导管限定。
7.根据权利要求6所述的系统,其中部分密封的导管包括:
第一平面表面;以及
相对于第一平面表面定位的第二平面表面以密封位于第一和第二平面表面之间的衬底。
8.根据权利要求4所述的系统,其中保持销可降低以能使衬底在第二开口移动。
9.根据权利要求4所述的系统,其中非牛顿流体流的方向基本上垂直于衬底表面。
10.根据权利要求4所述的系统,其中非牛顿流体流的方向基本上平行于衬底表面。
11.根据权利要求4所述的系统,其中非牛顿流体限定为一种或多种泡沫、乳胶、胶质。
12.一种用于运输衬底的方法,包括:
在腔室内提供非牛顿流体;
使衬底在非牛顿流体中悬浮,非牛顿流体能支撑衬底,且使相对流向衬底的相对表面上施加力以帮助保持衬底悬浮在腔室内;以及
向非牛顿流体施加足够的力以使得非牛顿流体流动,从而该非牛顿流体能够沿着流动方向移动衬底,
当使得非牛顿流体流经腔室时将衬底保持在腔室内。
13.根据权利要求12所述的方法,其中在非牛顿流体中悬浮衬底的操作方法包括,
将衬底浸入非牛顿流体中。
14.一种用于运输衬底的方法,包括操作方法:
使导管形式的腔室充满非牛顿流体,腔室具有输入端和输出端;
在输入端将衬底引入腔室以使衬底悬浮并保持在非牛顿流体中,且使相对流向衬底的相对表面上施加力以帮助保持衬底悬浮在腔室内;以及
强行使非牛顿流体经过腔室以使非牛顿流体流在衬底的表面上移动且非牛顿流体在输出端排出。
15.根据权利要求14的方法,其中当使得非牛顿流体流经腔室时,衬底保持在腔室内。
16.根据权利要求14的方法,进一步包括释放对衬底的保持以使非牛顿流体流沿腔室移动衬底并在输出端移出衬底。
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- 2006-06-14 TW TW095121224A patent/TWI322128B/zh not_active IP Right Cessation
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- 2006-06-14 JP JP2006164313A patent/JP5010856B2/ja not_active Expired - Fee Related
- 2006-06-15 KR KR1020060054064A patent/KR101111361B1/ko not_active IP Right Cessation
- 2006-06-15 CN CN2006101060838A patent/CN1880200B/zh not_active Expired - Fee Related
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2008
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US7591613B2 (en) | 2009-09-22 |
US7416370B2 (en) | 2008-08-26 |
JP2007053341A (ja) | 2007-03-01 |
CN1880200A (zh) | 2006-12-20 |
EP1734574A1 (en) | 2006-12-20 |
KR101111360B1 (ko) | 2012-02-24 |
KR101111361B1 (ko) | 2012-02-24 |
TWI322128B (en) | 2010-03-21 |
US20080267721A1 (en) | 2008-10-30 |
TW200738543A (en) | 2007-10-16 |
KR20110120853A (ko) | 2011-11-04 |
JP5010856B2 (ja) | 2012-08-29 |
MY142184A (en) | 2010-10-15 |
KR20060131680A (ko) | 2006-12-20 |
US20060285930A1 (en) | 2006-12-21 |
SG128607A1 (en) | 2007-01-30 |
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