CN1870859B - 两面露出型可挠性电路板的制造方法 - Google Patents
两面露出型可挠性电路板的制造方法 Download PDFInfo
- Publication number
- CN1870859B CN1870859B CN2006100819121A CN200610081912A CN1870859B CN 1870859 B CN1870859 B CN 1870859B CN 2006100819121 A CN2006100819121 A CN 2006100819121A CN 200610081912 A CN200610081912 A CN 200610081912A CN 1870859 B CN1870859 B CN 1870859B
- Authority
- CN
- China
- Prior art keywords
- wiring pattern
- circuit board
- flexible circuit
- conductor layer
- photosensitive polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005134140 | 2005-05-02 | ||
JP2005134140A JP2006310689A (ja) | 2005-05-02 | 2005-05-02 | ダブルアクセス型可撓性回路基板の製造方法 |
JP2005-134140 | 2005-05-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1870859A CN1870859A (zh) | 2006-11-29 |
CN1870859B true CN1870859B (zh) | 2012-06-27 |
Family
ID=37444381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100819121A Expired - Fee Related CN1870859B (zh) | 2005-05-02 | 2006-05-08 | 两面露出型可挠性电路板的制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006310689A (pt) |
KR (1) | KR20060114647A (pt) |
CN (1) | CN1870859B (pt) |
TW (1) | TWI384915B (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008288422A (ja) * | 2007-05-18 | 2008-11-27 | Kinsus Interconnect Technology Corp | フレキシブルプリント配線板及びその製造方法 |
US9161712B2 (en) * | 2013-03-26 | 2015-10-20 | Google Inc. | Systems and methods for encapsulating electronics in a mountable device |
TWI577251B (zh) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | 軟硬複合線路板及其製作方法 |
KR102260416B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
KR102260413B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
KR102260412B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
JP2002156758A (ja) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | 感光性ポリイミドを用いた高密度フレキシブル基板の製法 |
JP2002246732A (ja) * | 2001-02-16 | 2002-08-30 | Nitto Denko Corp | 配線回路基板の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04206677A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Chem Co Ltd | ダブルアクセスフレキシブル印刷配線板の製造方法 |
JP3750140B2 (ja) * | 1994-05-10 | 2006-03-01 | 日立化成工業株式会社 | 配線板の製造法 |
JP2869969B2 (ja) * | 1995-04-28 | 1999-03-10 | ソニーケミカル株式会社 | フレキシブル回路基板の製造方法 |
JP3666955B2 (ja) * | 1995-10-03 | 2005-06-29 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
JPH10224013A (ja) * | 1997-02-12 | 1998-08-21 | Nippon Mektron Ltd | 回路基板の製造法 |
JP3261064B2 (ja) * | 1997-03-24 | 2002-02-25 | 日本メクトロン株式会社 | 半導体装置用可撓性回路基板の製造法 |
JPH1117331A (ja) * | 1997-06-26 | 1999-01-22 | Nippon Mektron Ltd | 可撓性回路基板の製造法 |
JP3541697B2 (ja) * | 1998-11-20 | 2004-07-14 | ソニーケミカル株式会社 | フレキシブル配線板の製造方法 |
JP2001313451A (ja) * | 2000-04-28 | 2001-11-09 | Nitto Denko Corp | フレキシブル配線板の製造方法 |
JP4459406B2 (ja) * | 2000-07-27 | 2010-04-28 | ソニーケミカル&インフォメーションデバイス株式会社 | フレキシブル配線板製造方法 |
JP4673507B2 (ja) * | 2001-06-29 | 2011-04-20 | オプトレックス株式会社 | フレキシブル配線基板の位置合わせ方法 |
-
2005
- 2005-05-02 JP JP2005134140A patent/JP2006310689A/ja active Pending
-
2006
- 2006-05-01 KR KR1020060039241A patent/KR20060114647A/ko not_active Application Discontinuation
- 2006-05-01 TW TW095115470A patent/TWI384915B/zh not_active IP Right Cessation
- 2006-05-08 CN CN2006100819121A patent/CN1870859B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
JP2002156758A (ja) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | 感光性ポリイミドを用いた高密度フレキシブル基板の製法 |
JP2002246732A (ja) * | 2001-02-16 | 2002-08-30 | Nitto Denko Corp | 配線回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006310689A (ja) | 2006-11-09 |
KR20060114647A (ko) | 2006-11-07 |
CN1870859A (zh) | 2006-11-29 |
TW200640314A (en) | 2006-11-16 |
TWI384915B (zh) | 2013-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20180508 |