CN1870859B - 两面露出型可挠性电路板的制造方法 - Google Patents

两面露出型可挠性电路板的制造方法 Download PDF

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Publication number
CN1870859B
CN1870859B CN2006100819121A CN200610081912A CN1870859B CN 1870859 B CN1870859 B CN 1870859B CN 2006100819121 A CN2006100819121 A CN 2006100819121A CN 200610081912 A CN200610081912 A CN 200610081912A CN 1870859 B CN1870859 B CN 1870859B
Authority
CN
China
Prior art keywords
wiring pattern
circuit board
flexible circuit
conductor layer
photosensitive polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100819121A
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English (en)
Chinese (zh)
Other versions
CN1870859A (zh
Inventor
泉水伸幸
田中秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of CN1870859A publication Critical patent/CN1870859A/zh
Application granted granted Critical
Publication of CN1870859B publication Critical patent/CN1870859B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006100819121A 2005-05-02 2006-05-08 两面露出型可挠性电路板的制造方法 Expired - Fee Related CN1870859B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005134140 2005-05-02
JP2005134140A JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法
JP2005-134140 2005-05-02

Publications (2)

Publication Number Publication Date
CN1870859A CN1870859A (zh) 2006-11-29
CN1870859B true CN1870859B (zh) 2012-06-27

Family

ID=37444381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100819121A Expired - Fee Related CN1870859B (zh) 2005-05-02 2006-05-08 两面露出型可挠性电路板的制造方法

Country Status (4)

Country Link
JP (1) JP2006310689A (pt)
KR (1) KR20060114647A (pt)
CN (1) CN1870859B (pt)
TW (1) TWI384915B (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (ja) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp フレキシブルプリント配線板及びその製造方法
US9161712B2 (en) * 2013-03-26 2015-10-20 Google Inc. Systems and methods for encapsulating electronics in a mountable device
TWI577251B (zh) * 2015-12-01 2017-04-01 同泰電子科技股份有限公司 軟硬複合線路板及其製作方法
KR102260416B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260413B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260412B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
JP3750140B2 (ja) * 1994-05-10 2006-03-01 日立化成工業株式会社 配線板の製造法
JP2869969B2 (ja) * 1995-04-28 1999-03-10 ソニーケミカル株式会社 フレキシブル回路基板の製造方法
JP3666955B2 (ja) * 1995-10-03 2005-06-29 日本メクトロン株式会社 可撓性回路基板の製造法
JPH10224013A (ja) * 1997-02-12 1998-08-21 Nippon Mektron Ltd 回路基板の製造法
JP3261064B2 (ja) * 1997-03-24 2002-02-25 日本メクトロン株式会社 半導体装置用可撓性回路基板の製造法
JPH1117331A (ja) * 1997-06-26 1999-01-22 Nippon Mektron Ltd 可撓性回路基板の製造法
JP3541697B2 (ja) * 1998-11-20 2004-07-14 ソニーケミカル株式会社 フレキシブル配線板の製造方法
JP2001313451A (ja) * 2000-04-28 2001-11-09 Nitto Denko Corp フレキシブル配線板の製造方法
JP4459406B2 (ja) * 2000-07-27 2010-04-28 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板製造方法
JP4673507B2 (ja) * 2001-06-29 2011-04-20 オプトレックス株式会社 フレキシブル配線基板の位置合わせ方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法

Also Published As

Publication number Publication date
JP2006310689A (ja) 2006-11-09
KR20060114647A (ko) 2006-11-07
CN1870859A (zh) 2006-11-29
TW200640314A (en) 2006-11-16
TWI384915B (zh) 2013-02-01

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120627

Termination date: 20180508