CN1870859B - 两面露出型可挠性电路板的制造方法 - Google Patents

两面露出型可挠性电路板的制造方法 Download PDF

Info

Publication number
CN1870859B
CN1870859B CN2006100819121A CN200610081912A CN1870859B CN 1870859 B CN1870859 B CN 1870859B CN 2006100819121 A CN2006100819121 A CN 2006100819121A CN 200610081912 A CN200610081912 A CN 200610081912A CN 1870859 B CN1870859 B CN 1870859B
Authority
CN
China
Prior art keywords
wiring pattern
circuit board
flexible circuit
conductor layer
photosensitive polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006100819121A
Other languages
English (en)
Chinese (zh)
Other versions
CN1870859A (zh
Inventor
泉水伸幸
田中秀明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of CN1870859A publication Critical patent/CN1870859A/zh
Application granted granted Critical
Publication of CN1870859B publication Critical patent/CN1870859B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006100819121A 2005-05-02 2006-05-08 两面露出型可挠性电路板的制造方法 Expired - Fee Related CN1870859B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005134140 2005-05-02
JP2005134140A JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法
JP2005-134140 2005-05-02

Publications (2)

Publication Number Publication Date
CN1870859A CN1870859A (zh) 2006-11-29
CN1870859B true CN1870859B (zh) 2012-06-27

Family

ID=37444381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006100819121A Expired - Fee Related CN1870859B (zh) 2005-05-02 2006-05-08 两面露出型可挠性电路板的制造方法

Country Status (4)

Country Link
JP (1) JP2006310689A (pt)
KR (1) KR20060114647A (pt)
CN (1) CN1870859B (pt)
TW (1) TWI384915B (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (ja) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp フレキシブルプリント配線板及びその製造方法
US9161712B2 (en) * 2013-03-26 2015-10-20 Google Inc. Systems and methods for encapsulating electronics in a mountable device
TWI577251B (zh) * 2015-12-01 2017-04-01 同泰電子科技股份有限公司 軟硬複合線路板及其製作方法
KR102260416B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260413B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260412B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
JP3750140B2 (ja) * 1994-05-10 2006-03-01 日立化成工業株式会社 配線板の製造法
JP2869969B2 (ja) * 1995-04-28 1999-03-10 ソニーケミカル株式会社 フレキシブル回路基板の製造方法
JP3666955B2 (ja) * 1995-10-03 2005-06-29 日本メクトロン株式会社 可撓性回路基板の製造法
JPH10224013A (ja) * 1997-02-12 1998-08-21 Nippon Mektron Ltd 回路基板の製造法
JP3261064B2 (ja) * 1997-03-24 2002-02-25 日本メクトロン株式会社 半導体装置用可撓性回路基板の製造法
JPH1117331A (ja) * 1997-06-26 1999-01-22 Nippon Mektron Ltd 可撓性回路基板の製造法
JP3541697B2 (ja) * 1998-11-20 2004-07-14 ソニーケミカル株式会社 フレキシブル配線板の製造方法
JP2001313451A (ja) * 2000-04-28 2001-11-09 Nitto Denko Corp フレキシブル配線板の製造方法
JP4459406B2 (ja) * 2000-07-27 2010-04-28 ソニーケミカル&インフォメーションデバイス株式会社 フレキシブル配線板製造方法
JP4673507B2 (ja) * 2001-06-29 2011-04-20 オプトレックス株式会社 フレキシブル配線基板の位置合わせ方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法

Also Published As

Publication number Publication date
JP2006310689A (ja) 2006-11-09
KR20060114647A (ko) 2006-11-07
CN1870859A (zh) 2006-11-29
TW200640314A (en) 2006-11-16
TWI384915B (zh) 2013-02-01

Similar Documents

Publication Publication Date Title
CN1870859B (zh) 两面露出型可挠性电路板的制造方法
US4664962A (en) Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor
KR101022873B1 (ko) 인쇄회로기판의 제조방법
TWI326196B (en) Capacitor-embedded pcb having blind via hole and method of manufacturing the same
US20080062657A1 (en) Multi-layed printed circuit board having integrated circuit embedded therein
TW200412205A (en) Double-sided printed circuit board without via holes and method of fabricating the same
JPH0590756A (ja) リジツドフレキ基板の製造方法
JPH04283992A (ja) プリント回路基板の製造方法
JP5392567B2 (ja) プリント回路基板の製造方法およびそれによって製造されたプリント回路基板
KR20010051541A (ko) 범프 부착 배선회로기판의 제조방법 및 범프 형성방법
JP2002111174A (ja) 配線回路基板の製造方法
JP3427011B2 (ja) 可撓性多層回路基板の製造法
KR20140135667A (ko) 수직 도전성 유닛 및 그 제조 방법
CN102223764A (zh) 软性电路板的制作方法
JP3624423B2 (ja) プリント配線板およびその製造方法
JP2002111231A (ja) 多層プリント配線板
KR20110052326A (ko) 리지드-플렉시블 기판의 제조방법
JP2799411B2 (ja) プリント導電シート
EP1520446B1 (en) Method for forming acoustically active element in a multi-layer circuit-board structure and a multi-layer circuit-board structure
CN114430609B (zh) 一种电池保护板、加工方法及电子设备
KR20000050723A (ko) 다층 피씨비의 제조방법
JP2003188535A (ja) 両面フレキシブル配線板およびその製造方法
JP2724351B2 (ja) 電波遮蔽プリント配線板の製造法
KR101480557B1 (ko) 인쇄회로기판 및 그 제조방법
JPH07123178B2 (ja) フレキシブル配線基板およびその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120627

Termination date: 20180508