CN1862241B - 耳式医用温度计 - Google Patents
耳式医用温度计 Download PDFInfo
- Publication number
- CN1862241B CN1862241B CN2006100678509A CN200610067850A CN1862241B CN 1862241 B CN1862241 B CN 1862241B CN 2006100678509 A CN2006100678509 A CN 2006100678509A CN 200610067850 A CN200610067850 A CN 200610067850A CN 1862241 B CN1862241 B CN 1862241B
- Authority
- CN
- China
- Prior art keywords
- thermistor
- thermal insulation
- ear
- insulation part
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009413 insulation Methods 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 7
- 210000003041 ligament Anatomy 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 6
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 2
- 238000012937 correction Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000001131 transforming effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 210000003454 tympanic membrane Anatomy 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/046—Materials; Selection of thermal materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/049—Casings for tympanic thermometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
Abstract
一种耳式医用温度计20的探测器包括由树脂材料制成的第一热绝缘部件210和通过传统结合机构连接到所述第一热绝缘部件210的远端上由树脂材料制成的第二高热绝缘部件220。该第二高热绝缘部件220向前成锥形并且在远端上提供有凹表面221。保护盖230包围第一热绝缘部件210和第二高热绝缘部件220。热敏电阻细引线240嵌入第一热绝缘部件210和第二高热绝缘部件220内,使得线240的转动端部241桥接在第二高热绝缘部件220的凹表面221上,以在该凹表面221上暴露。超快反应热敏电阻250基本上安装在热敏电阻细引线240的转动端部241的中心上。
Description
背景技术
本发明总体上涉及以非接触方式测量要被测量对象的温度的温度计,并且尤其涉及通过将探测器的端部插入耳中测量耳鼓温度的医用温度计。
为了解释方便,下面将参照图8和9描述典型的传统耳式医用温度计。图8是传统耳式医用温度计的示意框图,说明了操作原理。图9是在典型的传统耳式医用温度计中探测器的端部的纵向截面图。如图8和9所示,典型的传统耳式医用温度计的探测器10使用温差电堆11。一般,温差电堆通过在温差电堆上的冷结点和热结点之间的温度差值产生电位差值(塞贝克效应)。为了使用温差电堆作为用于测量温度的探测器,有必要使得室温(环境温度)的补偿有效,与热电偶的情况一样。从而,传统耳式医用温度计已经使用热敏电阻12。
当被测量物体的温度等于在温差电堆11上的冷结点中的温度时,来自探测器10的输出为零(零点)。另一方面,当被测量物体的温度高于在温差电堆11上的冷结点中的温度时,来自探测器10的输出变得很非线性。
在探测器10测量身体温度的情况下,来自探测器10的输出是很微弱的水平。因此,有必要信号放大器13将来自探测器10的输出放大到信号处理能够应用的水平。而且,线性化电路14a有必要线性化非线性输出。另一方面,由于来自热敏电阻12的输出是非线性的,线性化电路14b必须线性化来自热敏电阻12的输出。
在环境温度的稳定条件下,在热敏电阻12中的温度等于在温差电堆11上的冷结点中的温度。来自探测器10的输出的线性化信号指示在热敏电阻12中的温度和在被测量物体之间的差值。因此,在通过发射率修正装置15修正将探测器10的输出线性化的信号,并且通过加 算装置16使得室温的补偿或被修正信号和来自热敏电阻12的线性化信号的冷结点温度的补偿生效之后,通过温度转换装置17来修正环境温度,能够获得被测量物体的温度。这将在显示器18上显示。
由于温差电堆具有个体差异的不稳定敏感性,即使存在某种温度差值,输出电压也是不稳定的。从而,有必要使用温差电堆单独使得探测器的敏感性调节(修正操作)生效。尽管用于温差电堆的红外吸收膜(在图9中与红外吸收膜和热结点整体形成的部分116)通过吸收红外线而增加温度,温差电堆的封装也辐射红外线到红外吸收膜上。在公共使用的方法中,认为该封装与温差电堆中的热沉(热吸收段)的温度相同。然而,当该封装由于外部因素经受温度的突然变化时,将会引起在封装的头部和温差电堆的热沉之间的温度差并且探测器将瞬变地输出不稳定的电压。
因此,为了将均匀和平缓变化的温度施加到探测器10上,如图9所示,温差电堆110放置在由具有良好导热性(例如铝)的金属制成的支架111中,并且该支架111由盖114覆盖,以便由用作绝热材料的空气层112和树脂113封闭温差电堆110。在温差电堆110的前侧上提供有金属管115以便减小来自被测量物体(人体)的热辐射的影响。该金属管115镀有金以尽可能减少发射率并用作导波器。尽管半导体、热敏电阻等等通常用作补偿冷结点温度的传感器,但是考虑到低成本生产和高精度,已经通常使用热敏电阻。
在温差电堆上的冷结点和热敏电阻之间的热耦合较弱的情况下,引起温度差值并且不能够进行精确的测量。热敏电阻(未示出)与温差电堆一起安装在封装中,以增强在电堆冷结点的热沉和热敏电阻之间的热耦合。即使任意热敏电阻均具有相同标准,B常数(阻抗温度特征,也即,用于指示从任意两点处的温度获得的阻抗值的变化的常数)也是不稳定的,因此难于在宽范围的环境温度内维持精度。例如,在34到42℃的范围内电子医用温度计中的热敏电阻测量体温的情况下,热敏电阻的精度会保持在8℃的范围内。然而,在温差电堆中的环境温度范围设定到处于5到40℃的范围内时,热敏电阻的精度必须 维持在35℃(40-5=35)的范围内。
在环境温度增加的过程中,在图9中示出的探测器10的结构引起在温差电堆110和探测器10的远端之间的温度差。由于在探测器10远端的温度高于温差电堆110的温度,该探测器10将产生正误差。在环境温度降低的过程中,探测器10引起在温差电堆110和探测器10的远端之间的温度差。由于在探测器10远端的温度低于温差电堆110的温度,该探测器10将产生负误差。为了减少这种误差,盖114封闭温差电堆110以降低温度变化的影响。然而,考虑到被测量物体,金属支架111的外尺寸受到限制。通过计算每个与温差电堆封装中的热敏电阻相关的时间内的变化率,抵抗由环境温度变化引起的误差的相反措施进行对探测器的输出的修正,由此减少误差。
本发明的第一方面在于提供一种耳式医用温度计,其能够在短时间段内消除由环境温度变化引起的影响并且不产生由于环境温度变化引起的误差。
热敏电阻用于补偿在红外医用温度计中使用的温差电堆上的冷结点的温度。尽管在有限范围的温度内易于调节热敏电阻的特征,正像在电子医用温度计中使用的热敏电阻的情况一样,但将会难于在热敏电阻用在医用温度计中的情况下在宽范围的温度内调节这些特征。因此,本发明的第二目的在于提供能够确保在宽范围的环境温度中的精度的耳式医用温度计。
由于温差电堆具有很大的个体差别,温差电堆需要修正操作以保持精度。温差电堆的修正操作将在生产中带来高成本。因此,本发明的第三目的在于提供一种耳式医用温度计,与温差电堆系统相比,其能够不需要修正操作或者获得极大简化的修正。
当传统耳式医用温度计在较低温度环境中测量体温时,温度计的探测器将冷却外耳道。尽管在第一次测量的精度将会相当好,但是在不花费太多时间的第二次或更多次之后的测量显示很可能降低。因此,考虑到环境温度的影响,在传统耳式医用温度计中的测量值将会不稳定。因此本发明的第四目的在于提供能够消除由环境温度的影响引起 的不稳定指示的耳式医用温度计。
发明内容
根据本发明包含探测器的耳式医用温度计,该探测器包括:由树脂材料制成的第一热绝缘部件;连接到第一热绝缘部件的远端上由树脂材料制成的第二高热绝缘部件;包围第一热绝缘部件和第二高热绝缘部件的保护盖;嵌入第一热绝缘部件和第二高热绝缘部件内的热敏电阻细引线;以及基本安装在热敏电阻细引线的转动端部的中心上的超快反应热敏电阻。第二高热绝缘部件用作在测量体温的过程中探测器不吸收外耳道中的热量。
优选地,第二高热绝缘部件向前成锥形并且在远端上提供有凹表面。热敏电阻细引线的转动端部桥接在第二高热绝缘部件的凹表面上以在该凹表面上暴露。第二高热绝缘部件的凹表面优选以镜面抛光方式加工。该凹表面具有反射红外线到热敏电阻上的作用。
超快反应热敏电阻的热量时间常数优选是1秒或更低,以便缩短测量时间段。
优选在温度测量线路中的电源线路的输出侧处提供具有多个终端的模拟开关,以便修正在温度测量线路中的误差。
根据本发明,热敏电阻能够保持精度的温度范围仅仅是要被测量的体温范围并且不必在要被测量的环境温度的整个范围内维持热敏电阻的精度,这与使用温差电堆的传统耳式医用温度计的情况一样。因此,本发明的探测器不受环境温度变化(在短时间段内温度的变化)的影响,也即不存在所谓的探测器“烘烤”现象。在本发明的耳式医用温度计中的温度测量线路能够比使用温差电堆的传统温度测量线路进一步简化。在大量生产的基础上能够方便本发明耳式医用温度计的装配工作,并且由于探测器很小尺寸,因此不限制医用温度计主体的外部构造。
附图说明
相信具有新颖性的本发明的特征和本发明的元件特征特别是在附加的权利要求中进行阐述。附图仅仅出于说明的目的并且未成比例绘 制。然而本发明自身在结构和操作方法两方面都可以参照后面与附图相结合的详细描述进行最佳地理解,附图为:
图1是根据本发明的耳式医用温度计中的探测器的端部的纵向截面视图;
图2是沿图1中线II-II截取的探测器端部的前正视图;
图3是类似于图1的截面图,示出图1所示的探测器端部的替换例;
图4是示意性说明图,其中根据本发明的耳式医用温度计的探测器端部插入耳中;
图5是示出热敏电阻的热量时间常数的图表;
图6是示出由根据本发明的耳式医用温度计所测量的身体温度结果的图表;
图7是在根据本发明的耳式医用温度计中温度测量线路的框图;
图8是传统耳式医用温度计的示意性框图,示出温度计的操作原理;以及
图9是在传统耳式医用温度计中探测器的端部的纵向截面视图。
具体实施方式
在描述本发明的优选实施例中,这里将对附图中的图1到7进行参照,其中相同的数字指示本发明的相同的特征。本发明的特征在附图中不必成比例示出。
现在参照图1到7,下面将要解释根据本发明的耳式医用温度计的实施例。图1和2示出在根据本发明的耳式医用温度计的探测器20的结构。在探测器20中,由树脂材料制成的第二高热绝缘部件220通过传统的结合机构(例如焊接、胶粘、按压配合、螺丝结合等等)连接到第一热绝缘部件210上。第二高热绝缘部件220从结合到第一热绝缘部件210上的部分起向端表面221向前成锥形。保护盖230覆盖第一热绝缘部件210和第二高热绝缘部件220。热敏电阻细引线240嵌入第一热绝缘部件210和第二高热绝缘部件220,使得线240的转动端部241桥接在第二高热绝缘部件220的表面221上,该第二高热 绝缘部件220暴露在表面221以上。超快反应热敏电阻250基本上安装在热敏电阻细引线240的转动端部241的中心。尽管在传统耳式医用温度计中使用的热敏电阻12(参见图8)具有1mm的直径和2到3mm的长度,但是在本发明耳式医用温度计中使用的热敏电阻250例如是具有0.3mm侧部的立方体。
优选的,如图3所示,第二高热绝缘部件220的表面221形成为凹形构造,以便增强到热敏电阻250上的红外线的反射效果。通过以镜面抛光方式加工凹形表面221,能够进一步增强反射效率。
图4示出当探测器20插入外耳道时本发明的耳式医用温度计中的探测器20的测量位置。探测器20的端部优选形成为如下构造:其中探测器20的中间位置紧密接触外耳道1的进口并且在探测器20的远端和耳鼓2之间的空间变得尽可能小。
确定热敏电阻250的温度的因素包括:由红外线的直接辐射引起的在热敏电阻细引线240和热敏电阻250中的温度增加,在外耳道中的空气的直接热传导,以及由插入外耳道内的探测器20引起的直接热传导。有必要当探测器20插入外耳道1内时探测器20的远端不影响在外耳道1中的温度。从而,第二高热绝缘部件220和保护盖230用于减小这种影响。
图5是限定热量时间常数的说明图。热量时间常数意味着如下的一段时间:当保持在任意温度T1的热敏电阻250突然插入处于周围温度T2的环境时,热敏电阻250从温度T1变化到目标温度T2。一般,热量时间常数是到达在温度T1和T2之间的温度差ΔT(ΔT=T2-T1)的63.2%的时间段X。本发明中使用的热敏电阻250是在空气中具有1秒或更低(优选0.1秒或更低)的热量时间常数的超快反应热敏电阻。
图6是说明当图1或2所示的探测器20测量身体温度时热敏电阻中温度变化的图表。在图6中,纵轴指示温度(℃)而横轴指示过去的时间(秒)。同时,安装在探测器20上的热敏电阻的热量时间常数是1(一)秒和用于测量温度的一段时间是在10(十)秒以内。为了在短时间段内测量温度,优选在空气中热敏电阻250的热量时间常数 是大约0.1秒。从而,这能够缩短测量时间1到2秒。
由于已经一般使用在传统电子医用温度计中的V-F转换系统尽管具有高精确度但花费大量时间用于测量,因此不可能通过使用V-F转换系统来利用探测器20的高反应速度。因此,本发明的耳式医用温度计采用温度测量线路系统,例如图7所示的系统。该温度测量线路系统使用包含AD转换器31和控制信号处理器32的微控制器单元(MCU)30。包含AD转换器的MCU已经变得广泛可见,并且特别是包含在十位以内的AD转换器的MCU易于得到和低价格。“Vref”指示用于AD转换器31的参考电源电压和AD转换数值的全标度数值。在MCU中获得的AD转换器的情况下,Vref通常设定为等于MCU的电源电压。在电源线路40中的参考电源电压Vref的并联电压V1、V2和V3由下面的等式(1)、(2)和(3)表示。R1、R2、R3、R4、Rref和Rth分别指示在电源线路40中的电阻。P1、P2和P3指示在模拟开关50中的相应终端。
P1:V1=R2/(R1+R2)×Vref (1)
P2:V2=R3/(R3+R4)×Vref (2)
P3:V3=Rth/(Rth+Rref)×Vref (3)
这里,V2>V3>V1。
误差因素包括在操作放大器(OP)60中的偏置误差和在操作放大器60中的增益误差(GE)。包含在MCU中的十位AD转换器使用连续的比较系统并且显著遭受诸如AD偏置误差之类的误差。当切换在模拟开关50中相应的终端P1、P2和P3时,AD转换数值分别由A1、A2和A3指示。当N指示在操作放大器60中的放大程度时,V1、V2 和V3的相应AD转换数值由下面的等式(4)、(5)、(6)和(7)表达。
A1=V1+N×GE×OP偏置误差+AD偏置误差(4)
A2=(OP偏置误差+V2-V1)×N×GE+AD偏置误差(5)
A3=(OP偏置误差+V3-V1)×N×GE+AD偏置误差(6)
A2-A1=(V2-V1)×N×GE (7)
由于V1、V2和N已知,GE能够通过下面的等式(8)获得。
GE=(A2-A1)/N(V2-V1)(8)
如果读取在模拟开关50中的相应终端P1和P2的AD转换数值的操作由线路修正循环指定,该循环将会是A3-A1=(V3-V1)×N×GE。由于GE由线路修正循环获得,能够消除操作放大器(OP)60的增益误差(GE)。在测量温度时,MCU30能够使得终端P1和P2的修正循环有效,然后测量终端P3,消除来自测量数值的误差因素,并且从储存在MCU中的表格获得热敏电阻温度。这将作为身体温度显示在显示器70上。
本发明的耳式医用温度计能够应用于动物以及人。
在2005年3月14日申请的日本专利申请No.2005-071350的包括说明书、权利要求、附图和摘要在内的全部公开内容全部在此进行结合作为参考。
虽然已经结合具体的优选实施例特别描述了本发明,但是显然在前面的描述的启示下,许多替换例、修改例和变体将会对本领域熟练技术人员来说变得明显。因此预期附加的权利要求将包括落入本发明实质范围和精神内的任何这种替换例、修改例和变体。
Claims (6)
1.一种包含探测器的耳式医用温度计,该探测器包括:由树脂材料制成的第一热绝缘部件;连接到所述第一热绝缘部件的远端上由树脂材料制成的第二高热绝缘部件;包围所述第一热绝缘部件和第二高热绝缘部件的保护盖;嵌入所述第一热绝缘部件和第二高热绝缘部件内的热敏电阻细引线;以及安装在所述热敏电阻细引线的转动端部的中心上的超快反应热敏电阻。
2.如权利要求1所述的耳式医用温度计,其中所述第二高热绝缘部件向前成锥形并且在远端上提供有凹表面,并且其中所述热敏电阻细引线的转动端部桥接在所述第二高热绝缘部件的所述凹表面上,以在所述凹表面上暴露。
3.如权利要求2所述的耳式医用温度计,其中所述第二高热绝缘部件的所述凹表面以镜面抛光方式加工。
4.如权利要求1所述的耳式医用温度计,其中所述超快反应热敏电阻的热量时间常数是1秒或更低。
5.如权利要求1所述的耳式医用温度计,其中所述超快反应热敏电阻的热量时间常数是0.1秒或更低。
6.如权利要求1所述的耳式医用温度计,其中在温度测量线路中的电源线路的输出侧处提供具有多个终端的模拟开关。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005071350 | 2005-03-14 | ||
JP2005071350A JP4214124B2 (ja) | 2005-03-14 | 2005-03-14 | 耳式体温計 |
JP2005-071350 | 2005-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1862241A CN1862241A (zh) | 2006-11-15 |
CN1862241B true CN1862241B (zh) | 2013-03-27 |
Family
ID=36649073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100678509A Active CN1862241B (zh) | 2005-03-14 | 2006-03-14 | 耳式医用温度计 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7410290B2 (zh) |
EP (1) | EP1703267B1 (zh) |
JP (1) | JP4214124B2 (zh) |
CN (1) | CN1862241B (zh) |
AT (1) | ATE421680T1 (zh) |
DE (1) | DE602006004905D1 (zh) |
ES (1) | ES2319223T3 (zh) |
HK (1) | HK1096148A1 (zh) |
Families Citing this family (301)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007002369B3 (de) * | 2007-01-17 | 2008-05-15 | Drägerwerk AG & Co. KGaA | Doppeltemperatursensor |
ES2414294T3 (es) | 2007-06-12 | 2013-07-18 | Bio Echo Net Inc | Termómetro auricular y el dispositivo de medición corporal utilizado para el mismo |
US8303173B2 (en) * | 2007-10-29 | 2012-11-06 | Smiths Medical Asd, Inc. | Dual potting temperature probe |
JP5564165B2 (ja) * | 2008-04-21 | 2014-07-30 | 株式会社バイオエコーネット | 耳式連続体温測定装置 |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8186876B2 (en) * | 2009-04-20 | 2012-05-29 | Welch Allyn, Inc. | Calibrated assembly for IR thermometer apparatus |
US8136985B2 (en) * | 2009-05-05 | 2012-03-20 | Welch Allyn, Inc. | IR thermometer thermal isolation tip assembly |
US9297705B2 (en) | 2009-05-06 | 2016-03-29 | Asm America, Inc. | Smart temperature measuring device |
US8382370B2 (en) * | 2009-05-06 | 2013-02-26 | Asm America, Inc. | Thermocouple assembly with guarded thermocouple junction |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US8899828B2 (en) * | 2012-03-22 | 2014-12-02 | Texas Instruments Incorporated | Heat sensor correction |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
CN102961124B (zh) * | 2012-11-05 | 2015-04-15 | 东莞市嵘丰医疗器械有限公司 | 一种热敏额温枪和额温测定方法及热敏额温枪运行方法 |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
KR102263121B1 (ko) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 및 그 제조 방법 |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
GB2554632B (en) * | 2016-05-24 | 2021-02-24 | Inova Design Solution Ltd | Portable physiology monitor |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
CN107543614A (zh) * | 2016-06-24 | 2018-01-05 | 上海新微技术研发中心有限公司 | 热电堆传感器 |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
KR102354490B1 (ko) | 2016-07-27 | 2022-01-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102613349B1 (ko) | 2016-08-25 | 2023-12-14 | 에이에스엠 아이피 홀딩 비.브이. | 배기 장치 및 이를 이용한 기판 가공 장치와 박막 제조 방법 |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
KR20180068582A (ko) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
KR20180070971A (ko) | 2016-12-19 | 2018-06-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
KR102457289B1 (ko) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (ko) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치 |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US11213252B2 (en) | 2017-10-20 | 2022-01-04 | Starkey Laboratories, Inc. | Devices and sensing methods for measuring temperature from an ear |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10529219B2 (en) | 2017-11-10 | 2020-01-07 | Ecolab Usa Inc. | Hand hygiene compliance monitoring |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
KR102443047B1 (ko) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 방법 및 그에 의해 제조된 장치 |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
JP7214724B2 (ja) | 2017-11-27 | 2023-01-30 | エーエスエム アイピー ホールディング ビー.ブイ. | バッチ炉で利用されるウェハカセットを収納するための収納装置 |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
TW202325889A (zh) | 2018-01-19 | 2023-07-01 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
CN111699278B (zh) | 2018-02-14 | 2023-05-16 | Asm Ip私人控股有限公司 | 通过循环沉积工艺在衬底上沉积含钌膜的方法 |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
KR102501472B1 (ko) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
TW202344708A (zh) | 2018-05-08 | 2023-11-16 | 荷蘭商Asm Ip私人控股有限公司 | 藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構 |
TW202349473A (zh) | 2018-05-11 | 2023-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構 |
KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
KR20210027265A (ko) | 2018-06-27 | 2021-03-10 | 에이에스엠 아이피 홀딩 비.브이. | 금속 함유 재료를 형성하기 위한 주기적 증착 방법 및 금속 함유 재료를 포함하는 막 및 구조체 |
CN112292478A (zh) | 2018-06-27 | 2021-01-29 | Asm Ip私人控股有限公司 | 用于形成含金属的材料的循环沉积方法及包含含金属的材料的膜和结构 |
KR20200002519A (ko) | 2018-06-29 | 2020-01-08 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR20200030162A (ko) | 2018-09-11 | 2020-03-20 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344A (zh) | 2018-10-01 | 2020-04-07 | Asm Ip控股有限公司 | 衬底保持设备、包含所述设备的系统及其使用方法 |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (ko) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
TW202037745A (zh) | 2018-12-14 | 2020-10-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成裝置結構之方法、其所形成之結構及施行其之系統 |
TWI819180B (zh) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
KR20200091543A (ko) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
KR102638425B1 (ko) | 2019-02-20 | 2024-02-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 내에 형성된 오목부를 충진하기 위한 방법 및 장치 |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
TW202104632A (zh) | 2019-02-20 | 2021-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用來填充形成於基材表面內之凹部的循環沉積方法及設備 |
TW202100794A (zh) | 2019-02-22 | 2021-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基材處理設備及處理基材之方法 |
KR20200108243A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
KR20200108248A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOCN 층을 포함한 구조체 및 이의 형성 방법 |
KR20200108242A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
JP2020167398A (ja) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | ドアオープナーおよびドアオープナーが提供される基材処理装置 |
KR20200116855A (ko) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
KR20200123380A (ko) | 2019-04-19 | 2020-10-29 | 에이에스엠 아이피 홀딩 비.브이. | 층 형성 방법 및 장치 |
KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
KR20200130118A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
KR20200130121A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
KR20200130652A (ko) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
JP2020188255A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141002A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법 |
KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (ko) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
JP2021015791A (ja) | 2019-07-09 | 2021-02-12 | エーエスエム アイピー ホールディング ビー.ブイ. | 同軸導波管を用いたプラズマ装置、基板処理方法 |
CN112216646A (zh) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
KR20210010307A (ko) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210010816A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 라디칼 보조 점화 플라즈마 시스템 및 방법 |
KR20210010820A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
CN112242296A (zh) | 2019-07-19 | 2021-01-19 | Asm Ip私人控股有限公司 | 形成拓扑受控的无定形碳聚合物膜的方法 |
TW202113936A (zh) | 2019-07-29 | 2021-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於利用n型摻雜物及/或替代摻雜物選擇性沉積以達成高摻雜物併入之方法 |
CN112309899A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112309900A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
KR20210018759A (ko) | 2019-08-05 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | 화학물질 공급원 용기를 위한 액체 레벨 센서 |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
JP2021031769A (ja) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
KR20210024420A (ko) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (ko) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
KR20210029663A (ko) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
JP7031646B2 (ja) * | 2019-09-24 | 2022-03-08 | カシオ計算機株式会社 | 検出装置及び検出装置の製造方法 |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
TW202129060A (zh) | 2019-10-08 | 2021-08-01 | 荷蘭商Asm Ip控股公司 | 基板處理裝置、及基板處理方法 |
TW202115273A (zh) | 2019-10-10 | 2021-04-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成光阻底層之方法及包括光阻底層之結構 |
KR20210045930A (ko) | 2019-10-16 | 2021-04-27 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 산화물의 토폴로지-선택적 막의 형성 방법 |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (ko) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (ko) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (ko) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
CN112951697A (zh) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112885692A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885693A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
JP2021090042A (ja) | 2019-12-02 | 2021-06-10 | エーエスエム アイピー ホールディング ビー.ブイ. | 基板処理装置、基板処理方法 |
KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN112992667A (zh) | 2019-12-17 | 2021-06-18 | Asm Ip私人控股有限公司 | 形成氮化钒层的方法和包括氮化钒层的结构 |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
KR20210095050A (ko) | 2020-01-20 | 2021-07-30 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
TW202130846A (zh) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成包括釩或銦層的結構之方法 |
KR20210100010A (ko) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | 대형 물품의 투과율 측정을 위한 방법 및 장치 |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
TW202146715A (zh) | 2020-02-17 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於生長磷摻雜矽層之方法及其系統 |
KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
KR20210116249A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법 |
CN113394086A (zh) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | 用于制造具有目标拓扑轮廓的层结构的方法 |
KR20210124042A (ko) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
TW202146689A (zh) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | 阻障層形成方法及半導體裝置的製造方法 |
TW202145344A (zh) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
KR20210132576A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 나이트라이드 함유 층을 형성하는 방법 및 이를 포함하는 구조 |
TW202146831A (zh) | 2020-04-24 | 2021-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法 |
KR20210134226A (ko) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
KR20210141379A (ko) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
KR20210143653A (ko) | 2020-05-19 | 2021-11-29 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210145078A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
TW202201602A (zh) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202218133A (zh) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
TW202217953A (zh) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
KR20220010438A (ko) | 2020-07-17 | 2022-01-25 | 에이에스엠 아이피 홀딩 비.브이. | 포토리소그래피에 사용하기 위한 구조체 및 방법 |
TW202204662A (zh) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
US11725280B2 (en) | 2020-08-26 | 2023-08-15 | Asm Ip Holding B.V. | Method for forming metal silicon oxide and metal silicon oxynitride layers |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
TW202229613A (zh) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 於階梯式結構上沉積材料的方法 |
TW202217037A (zh) | 2020-10-22 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 沉積釩金屬的方法、結構、裝置及沉積總成 |
TW202223136A (zh) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於在基板上形成層之方法、及半導體處理系統 |
TW202235675A (zh) | 2020-11-30 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 注入器、及基板處理設備 |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
TW202231903A (zh) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成 |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2925572A (en) * | 1955-07-26 | 1960-02-16 | King Seeley Corp | Temperature measuring probe |
US3581570A (en) * | 1967-09-05 | 1971-06-01 | Garrett Corp | Thermal radiation sensor |
US3626757A (en) * | 1967-10-24 | 1971-12-14 | Theodor H Benzinger | Ear thermometer |
JPS58190734A (ja) * | 1982-04-30 | 1983-11-07 | Matsushita Electric Works Ltd | 電子式体温計のプロ−ブ |
NZ206715A (en) * | 1983-12-22 | 1988-10-28 | Fisher & Paykel | Forming a thermistor temperature probe |
SE455736B (sv) * | 1984-03-15 | 1988-08-01 | Sarastro Ab | Forfaringssett och anordning for mikrofotometrering och efterfoljande bildsammanstellning |
JPS61111428A (ja) * | 1984-11-06 | 1986-05-29 | Terumo Corp | 電子体温計 |
FR2573871B1 (fr) * | 1984-11-23 | 1987-01-30 | Electricite De France | Procede et dispositif de detection de changement de phase |
EP0184600B1 (en) * | 1984-12-10 | 1990-03-14 | Prutec Limited | Method for optically ascertaining parameters of species in a liquid analyte |
USRE34789E (en) * | 1985-04-17 | 1994-11-15 | Thermoscan Inc. | Infrared electronic thermometer and method for measuring temperature |
US4922092A (en) * | 1986-11-26 | 1990-05-01 | Image Research Limited | High sensitivity optical imaging apparatus |
US4854730A (en) * | 1987-08-13 | 1989-08-08 | Jacob Fraden | Radiation thermometer and method for measuring temperature |
US4965725B1 (en) * | 1988-04-08 | 1996-05-07 | Neuromedical Systems Inc | Neural network based automated cytological specimen classification system and method |
US4959301A (en) * | 1988-04-22 | 1990-09-25 | Massachusetts Institute Of Technology | Process for rapidly enumerating viable entities |
US4934831A (en) * | 1989-03-20 | 1990-06-19 | Claud S. Gordon Company | Temperature sensing device |
JPH06105182B2 (ja) | 1990-01-26 | 1994-12-21 | 株式会社半導体エネルギー研究所 | 赤外検出器 |
US5162990A (en) * | 1990-06-15 | 1992-11-10 | The United States Of America As Represented By The United States Navy | System and method for quantifying macrophage phagocytosis by computer image analysis |
US5235522A (en) * | 1990-10-10 | 1993-08-10 | Cell Analysis Systems, Inc. | Method and apparatus for automated analysis of biological specimens |
US5784162A (en) * | 1993-08-18 | 1998-07-21 | Applied Spectral Imaging Ltd. | Spectral bio-imaging methods for biological research, medical diagnostics and therapy |
US5991028A (en) * | 1991-02-22 | 1999-11-23 | Applied Spectral Imaging Ltd. | Spectral bio-imaging methods for cell classification |
US5790710A (en) * | 1991-07-12 | 1998-08-04 | Jeffrey H. Price | Autofocus system for scanning microscopy |
US5548661A (en) * | 1991-07-12 | 1996-08-20 | Price; Jeffrey H. | Operator independent image cytometer |
US5326691A (en) * | 1991-11-21 | 1994-07-05 | John Hozier | Micro-libraries and methods of making and manipulating them methods for generating and analyzing micro-libraries |
US5655028A (en) * | 1991-12-30 | 1997-08-05 | University Of Iowa Research Foundation | Dynamic image analysis system |
US5355215A (en) * | 1992-09-30 | 1994-10-11 | Environmental Research Institute Of Michigan | Method and apparatus for quantitative fluorescence measurements |
US5733721A (en) * | 1992-11-20 | 1998-03-31 | The Board Of Regents Of The University Of Oklahoma | Cell analysis method using quantitative fluorescence image analysis |
JP3085830B2 (ja) | 1993-04-23 | 2000-09-11 | シャープ株式会社 | 輻射熱センサ |
US5776748A (en) * | 1993-10-04 | 1998-07-07 | President And Fellows Of Harvard College | Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor |
JPH08320A (ja) | 1994-06-21 | 1996-01-09 | Art Design Center:Kk | 装飾体接続具 |
US5932872A (en) * | 1994-07-01 | 1999-08-03 | Jeffrey H. Price | Autofocus system for scanning microscopy having a volume image formation |
US5790692A (en) * | 1994-09-07 | 1998-08-04 | Jeffrey H. Price | Method and means of least squares designed filters for image segmentation in scanning cytometry |
US5725308A (en) * | 1994-12-23 | 1998-03-10 | Rtd Technology, Inc. | Quick registering thermometer |
US5902732A (en) * | 1995-10-04 | 1999-05-11 | Cytoscan Sciences Llc | Drug screening process measuring changes in cell volume |
DE19604201A1 (de) * | 1996-02-06 | 1997-08-07 | Braun Ag | Schutzkappe |
US5893095A (en) * | 1996-03-29 | 1999-04-06 | Virage, Inc. | Similarity engine for content-based retrieval of images |
US5989835A (en) * | 1997-02-27 | 1999-11-23 | Cellomics, Inc. | System for cell-based screening |
US6103479A (en) * | 1996-05-30 | 2000-08-15 | Cellomics, Inc. | Miniaturized cell array methods and apparatus for cell-based screening |
US5804436A (en) * | 1996-08-02 | 1998-09-08 | Axiom Biotechnologies, Inc. | Apparatus and method for real-time measurement of cellular response |
US6008010A (en) * | 1996-11-01 | 1999-12-28 | University Of Pittsburgh | Method and apparatus for holding cells |
JP4663824B2 (ja) * | 1996-12-31 | 2011-04-06 | ハイ スループット ジェノミクス インコーポレイテッド | 多重化分子分析装置および方法 |
US5995143A (en) * | 1997-02-07 | 1999-11-30 | Q3Dm, Llc | Analog circuit for an autofocus microscope system |
AU8846498A (en) * | 1997-08-07 | 1999-03-01 | Imaging Research, Inc. | A digital imaging system for assays in well plates, gels and blots |
US5962250A (en) * | 1997-10-28 | 1999-10-05 | Glaxo Group Limited | Split multi-well plate and methods |
JP3309957B2 (ja) | 1997-11-26 | 2002-07-29 | 横河電機株式会社 | 赤外線検出素子 |
US6146830A (en) * | 1998-09-23 | 2000-11-14 | Rosetta Inpharmatics, Inc. | Method for determining the presence of a number of primary targets of a drug |
US6222093B1 (en) * | 1998-12-28 | 2001-04-24 | Rosetta Inpharmatics, Inc. | Methods for determining therapeutic index from gene expression profiles |
US7151847B2 (en) * | 2001-02-20 | 2006-12-19 | Cytokinetics, Inc. | Image analysis of the golgi complex |
ATE235046T1 (de) * | 2000-12-05 | 2003-04-15 | Italcoppie S R L | Dichte temperatursonde sowie ein verfahren zu ihrer herstellung |
US6599694B2 (en) * | 2000-12-18 | 2003-07-29 | Cytokinetics, Inc. | Method of characterizing potential therapeutics by determining cell-cell interactions |
US6956961B2 (en) * | 2001-02-20 | 2005-10-18 | Cytokinetics, Inc. | Extracting shape information contained in cell images |
US6886978B2 (en) * | 2001-06-18 | 2005-05-03 | Omron Corporation | Electronic clinical thermometer |
JP4298509B2 (ja) * | 2001-11-20 | 2009-07-22 | シチズンホールディングス株式会社 | 温度計 |
US6918696B2 (en) * | 2003-01-15 | 2005-07-19 | Denso Corporation | Temperature sensor and method for manufacturing the same |
TW593993B (en) * | 2003-11-03 | 2004-06-21 | Oriental System Technology Inc | Electrical thermometer |
JP4620400B2 (ja) * | 2004-07-16 | 2011-01-26 | 日本特殊陶業株式会社 | 温度センサ、温度センサの製造方法 |
TW200615520A (en) * | 2004-11-09 | 2006-05-16 | Norm Pacific Automat Corp | Infrared thermometer |
JP4751174B2 (ja) * | 2005-10-21 | 2011-08-17 | 株式会社バイオエコーネット | 耳式体温計 |
-
2005
- 2005-03-14 JP JP2005071350A patent/JP4214124B2/ja active Active
-
2006
- 2006-03-07 ES ES06004624T patent/ES2319223T3/es active Active
- 2006-03-07 EP EP06004624A patent/EP1703267B1/en active Active
- 2006-03-07 DE DE602006004905T patent/DE602006004905D1/de active Active
- 2006-03-07 AT AT06004624T patent/ATE421680T1/de not_active IP Right Cessation
- 2006-03-13 US US11/375,554 patent/US7410290B2/en active Active
- 2006-03-14 CN CN2006100678509A patent/CN1862241B/zh active Active
-
2007
- 2007-03-27 HK HK07103247.8A patent/HK1096148A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US7410290B2 (en) | 2008-08-12 |
ATE421680T1 (de) | 2009-02-15 |
EP1703267B1 (en) | 2009-01-21 |
ES2319223T3 (es) | 2009-05-05 |
EP1703267A1 (en) | 2006-09-20 |
DE602006004905D1 (de) | 2009-03-12 |
JP2006250883A (ja) | 2006-09-21 |
HK1096148A1 (en) | 2007-05-25 |
JP4214124B2 (ja) | 2009-01-28 |
US20060239329A1 (en) | 2006-10-26 |
CN1862241A (zh) | 2006-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1862241B (zh) | 耳式医用温度计 | |
EP0337724B1 (en) | Radiation clinical thermometer | |
CN100535619C (zh) | 耳式医用温度计 | |
USRE34507E (en) | Radiation clinical thermometer | |
US5232284A (en) | Radiation clinical thermometer | |
WO1999015866A1 (fr) | Thermometre de mesure du rayonnement et procede de reglage | |
KR100539205B1 (ko) | 방사 체온계용의 탐침 팁 | |
JP2828258B2 (ja) | 放射体温計 | |
JPH06142063A (ja) | 放射体温計 | |
JP4510526B2 (ja) | 赤外線体温計 | |
JP3134746U (ja) | 耳式体温計 | |
JP2003156395A (ja) | 赤外線温度センサー | |
JP4621363B2 (ja) | 赤外線体温計 | |
JP2813331B2 (ja) | 放射温度計 | |
JP5039618B2 (ja) | 耳式体温計 | |
JPH10290790A (ja) | 放射体温計 | |
JP2000254103A (ja) | 放射温度計 | |
JP3176798B2 (ja) | 輻射熱センサ | |
JPH0375531A (ja) | 赤外線センサを用いた体温計 | |
EP0968405A1 (en) | An application specific integrated circuit for use with an ir thermometer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1096148 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1096148 Country of ref document: HK |