CN1834175A - 用于半导体封装用环氧树脂模塑配混料的底层涂料组合物和半导体器件 - Google Patents
用于半导体封装用环氧树脂模塑配混料的底层涂料组合物和半导体器件 Download PDFInfo
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- CN1834175A CN1834175A CNA2006100597624A CN200610059762A CN1834175A CN 1834175 A CN1834175 A CN 1834175A CN A2006100597624 A CNA2006100597624 A CN A2006100597624A CN 200610059762 A CN200610059762 A CN 200610059762A CN 1834175 A CN1834175 A CN 1834175A
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Abstract
一种底层涂料组合物,该组合物包含含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂、环氧树脂、固化促进剂和有机溶剂,并形成固化的涂层,该涂层通过短暂的低温加热具有耐热性和防水性,有助于环氧树脂模塑配混料与半导体部件的粘合。
Description
技术领域
本发明内容是关于一种底层涂料组合物,该组合物对半导体封装环氧树脂模塑配混料与一种衬底或半导体芯片之间的粘合起辅助作用,本发明还有关使用该底层涂料的环氧树脂封装的半导体器件。
背景技术
众所周知,为改进以金属或塑料制成的模塑部件的表面特性,通常在模塑部件的表面需形成有机硅化合物的固化涂层。但是,除了某些金属与具有有限化学结构的有机硅化合物的结合外,其它金属和有机硅化合物存在非常差的粘合效果的问题。
人们需要一种能够改进上述二者粘合效果的粘合促进剂和底层涂料组合物。示例性的组合物包括:
·如JP-B 54-28430所示的基于聚亚烷基亚胺和含环氧键的三烷氧基硅烷的底层涂料组合物;
·如JP-B 48-41697所示的包含通过聚酯或聚醚多羟基化合物与烷氧
基硅烷和聚异氰酸酯的酯交换获得的化合物的组合物;
·如JP-A 52-138565公开的基于甲基丙烯酸甲酯的组合物;
·如JP-A 54-81378公开的基于环氧烷基三烷氧基硅烷的底层涂料组合物;
·如与USP 4,246,038相对应的JP-A 54-155229公开的包含某些硅烷和酸酐的底层涂料组合物;和
·如JP-A 55-99930公开的底层涂料组合物,该组合物包含带有两个或多个硅烷和羟甲基蜜胺烷基醚的共水解产物。
遗憾的是,所有这些组合物在对物体的粘合性、耐热水性和抗热性方面都不能达到令人完全满意的效果。
将半导体部件如晶体管、二极管、集成电路和大规模集成电路封装的通常做法是使用树脂材料如环氧树脂。以树脂材料密封的半导体部件经常因树脂材料中带来的水和离子杂质而降低质量。一种解决这个问题的建议方法是在以树脂材料封装之前,将半导体部件涂以聚酰亚胺树脂保护层,该树脂具有很好的抗热性、电性能和机械性能。总的来说,聚酰亚胺树脂可对物体赋予极好的,如抗热性等性能。由于聚酰亚胺树脂在溶剂中不溶解(除了一些高沸点有机溶剂),通常的做法是将作为其前体的、聚酰胺酸形态的聚酰亚胺在有机溶剂中溶解,溶解后的溶液涂覆到半导体部件上,然后进行热固化(酰亚胺化),形成固化涂层。
但是,在以这种方法形成聚酰亚胺树脂涂层时,将聚酰胺酸转换成聚酰亚胺的热处理需要至少300℃的高温和较长的加热时间。该方法涉及的高温、长时间加热从工艺上和节能角度来说都是有缺陷的。另一方面,如果加热不足,聚酰胺酸会残留在所得树脂的结构中。残留的聚酰胺酸会降低聚酰亚胺树脂的抗潮湿、抗腐蚀和其它特性。特别是当树脂材料在半导体部件上作为绝缘保护涂层时,会使树脂性能降低和缩短半导体部件的使用寿命,引起严重的问题。因此,这些问题都期望得到解决。
在目前的半导体技术领域,组件在体积和厚度上都变小,表面固定技术成为组件-衬底(component-on-substrate)固定技术的主流。在这种情况下,现有技术环氧树脂组合物变得难以保持稳定性。此外,焊剂最近已被无铅焊剂取代,将焊剂回流温度提高到高达260℃。组件如果在吸湿后焊接,会出现裂缝,或即使没有裂缝,也会大量丧失防潮性。从这个出发点来看,需要一种高质量的抗热底层涂料组合物。
JP-A 5-009254和JP-A 6-116517公开了硅氧烷改性聚酰胺-酰亚胺树脂。这些树脂对铜箔的粘合强度不够,依然存在诸多问题,包括较低的玻璃化温度(Tg)和固化膜的低抗热性。
本发明的公开
本发明的目的是提供一种底层涂料组合物,该组合物能够充分粘合各种金属和塑料,经过短暂的低温加热固化,形成具有抗热性、防水性及改进了其他性能的固化涂层,因此有助于半导体封装环氧树脂模塑配混料的粘合;和一种半导体器件,该器件借助固化状态的底层涂料组合物以环氧树脂来封装。
发明人发现,作为基本树脂,包含含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂(该树脂通式(1)如下所示)的底层涂料组合物最好与环氧树脂结合使用进行粘合,非常有助于环氧树脂模塑配混料与半导体器件的粘合,并具有很好的抗热性和防水性;借助底层涂料组合物以环氧树脂封装的半导体器件性能十分可靠,因为在吸湿后的回流焊接步骤中即没有裂缝,也没有发生分层现象。
据此,本发明提供一种用于粘合半导体部件封装用环氧树脂模塑配混料的底层涂料组合物,包含含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂(该树脂通式(1))和作为主要成分的有机溶剂。
此处X是三价有机基,Y是二价有机基,Z是一种下式的基团:
R1是C1-C3烷基,R2是C1-C3烷基或烷氧基,a是0-4的整数,p是1-100的整数,q是1-100的整数。
优选的是,使用的有机溶剂的量是基于底层涂料组合物总重计为70-99.9%。一个优选的实施方案是包含(A)带有通式(1)的含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂,(B)在一个分子中至少有两个环氧基的环氧树脂,(C)固化促进剂,和(D)有机溶剂的底层涂料组合物。
本发明还考虑到一种半导体器件,该器件借助固化状态的底层涂料组合物以环氧树脂模塑配混料封装。还提供了半导体器件的封装方法,包括以下步骤:
·将底层涂料组合物涂覆在半导体部件的表面,
·将底层涂料组合物固化,和
·将环氧树脂模塑配混料在固化的底层涂料层的外表面上成型。
本发明的益处
本发明的底层涂料组合物对半导体封装用环氧树脂模塑配混料和要封装的半导体部件具有非常好的粘合性,该组分以短暂的低温加热固化,形成具有抗热性、防水性及其他改进性能的固化膜。因此有助于半导体封装用环氧树脂模塑配混料与半导体部件的粘合。
附图说明
图1是本发明一个实施方案中以树脂封装的半导体器件的剖视图。
具体实施方式
在本发明中,用于粘合半导体封装用环氧树脂模塑配混料的底层涂料组合物,包含作为基本成分的具有通式(1)的含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂。一个优选的实施方案是包含以下物质的底层涂料组合物:(A)具有通式(1)的含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂,(B)在一个分子中至少有两个环氧基的环氧树脂,(C)固化促进剂,和(D)有机溶剂。
A)含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂
成分(A)是含有烷氧基甲硅烷基聚酰胺-酰亚胺树脂,具有通式(1)。
其中X是三价有机基,Y是二价有机基,Z是下式的基团:
R1是C1-C3烷基,R2是C1-C3烷基或烷氧基,a是0-4的整数,p是1-100的整数,q是1-100的整数。
含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂通过羧基和/或酸酐基为端基的聚酰胺-酰亚胺树脂与含环氧基团的烷氧基甲硅烷化合物的反应得到。
此处可使用的聚酰胺-酰亚胺树脂在它们的分子结构中有酰胺基和酰亚胺基,可例如采用传统方法通过三羧酸与二胺的反应得到。通式(1)中的X衍生自三羧酸,Y衍生自二胺。
适合的三羧酸包括苯三酸和苯三酸酐。在这些情况下,X具有下式。
适用的二胺包括各种含芳环的二胺,例如,对苯二胺,间苯二胺,4,4′-二氨基二苯甲烷,
4,4′-二氨二苯基醚,2,2’-双(4-氨基苯基)丙烷,
4,4’-二氨基苯基砜,4,4’-二氨基苯基硫醚,
1,4-双(3-氨基苯氧基)苯,
1,4-双(4-氨基苯氧基)苯,
1,4-双(对氨基苯基磺酰基)苯,
1,4-双(间氨基苯基磺酰)苯,
1,4-双(对氨基苯基硫醚)苯,
1,4-双(间氨基苯基硫醚)苯,
2,2-双[4-(4-氨基苯氧基)苯基]丙烷,
2,2-双[3-甲基-4-(4-氨基苯氧基)苯基]丙烷,
2,2-双[3-氯代-4-(4-氨基苯氧基)苯基]丙烷,
1,1-双[4-(4-氨基苯氧基)苯基]乙烷,
1,1-双[3-甲基-4-(4-氨基苯氧基)苯基]乙烷,
1,1-双[3-氯-4-(4-氨基苯氧基)苯基]乙烷,
1,1-双[3,5-二甲基-4-(4-氨基苯氧基)苯基]乙烷,
双[4-(4-氨基苯氧基)苯基]甲烷,
双[3-甲基-4-(4-氨基苯氧基)苯基]甲烷,
双[3-氯-4-(4-氨基苯氧基)苯基]甲烷,
双[3,5-二甲基-4-(4-氨基苯氧基)苯基]甲烷,
双[4-(4-氨基苯氧基)苯基]砜,和
2,2-双[4-(4-氨基苯氧基)苯基]全氟丙烷。
其中,优选的是对苯二胺,间苯二胺,4,4′-二氨基二苯甲烷,4,4′-二氨基二苯基醚,1,4-双(3-氨基苯氧基)苯,1,4-双(4-氨基苯氧基)苯,2,2-双[4-(4-氨基苯氧基)苯基]丙烷,和2,2-双[3-甲基-4-(4-氨基苯氧基)苯基]丙烷。硅氧烷二胺也可用于衬底粘合和增加挠曲性。因此,Y与上述二胺相对应,消去了两个NH2。
二胺的说明性非限定实例如下。
这些二胺可单独使用,或两个或多个结合使用。
制备聚酰胺-酰亚胺树脂的方法包括酰基氯方法,异氰酸酯方法和直接聚合。聚酰胺-酰亚胺树脂可以用上述方法的任何一种制备,反应物的比例应该使羧基和/或酸酐基保留在分子链端。优选的氨基摩尔数与羧基和酸酐基的总摩尔数的比值为0.80-0.99,更优选的为0.85-0.99。
优选的聚酰胺-酰亚胺树脂应具有约5,000-100,000的重均分子量(Mw),这一分子量根据聚苯乙烯标准以凝胶渗透色谱法(GPC)测出。如果Mw低于5,000,固化涂层会缺乏韧性和挠曲性。Mw超过100,000的树脂具有高的粘度,会不良影响工作效率。
将以如此方法得到的聚酰胺-酰亚胺树脂与具有下式的含环氧基的烷氧基硅烷化合物反应:
更具体地说,通过含环氧基的烷氧基硅烷化合物中的环氧基相对于聚酰胺-酰亚胺树脂中的末端羧基和/或酸酐基的加成反应,可获得有通式(1)的、含烷氧基甲硅烷基的聚酰胺-酰亚胺树脂。
在式(1)中,X,Y,Z,R1,R2,a,p和q的定义如上所示。优选的是,p和q分别是2-100的整数,特别是3-80,a等于0,1,2或3。
羧基和酸酐基与环氧基的反应可以按传统方法进行。如果聚酰胺-酰亚胺树脂在分子链的两端具有保留的羧基,它可以以至少等摩尔量的环氧基与羧基反应。如果聚酰胺-酰亚胺树脂在分子链一端保留羧基,在另一端保留酸酐基,它可以以至少等摩尔量的环氧基与全部羧基和酸酐基反应。反应温度是30-130℃,反应时间为约1-10小时。如果需要,反应可在溶剂中进行,如N-甲基-2-吡咯烷酮,N,N-二甲基甲酰胺或N,N-二甲基乙酰胺。
适用的含烷氧基甲硅烷基的聚酰胺-酰亚胺树脂可从商业渠道获得,例如,Arakawa Chemical Industries,Ltd.的产品,商品名称为Compoceran H900-2,H901-2,和H901-2D。
B)环氧树脂
任何环氧树脂,只要一个分子中有至少两个环氧基,都可以用作本发明组合物的成分(B)。适合的环氧树脂包括,但不限于双酚类环氧树脂,如双酚F环氧树脂和双酚A环氧树脂;线型酚醛清漆类环氧树脂如酚醛线型酚醛清漆环氧树脂和甲酚线型酚醛清漆环氧树脂;三酚链烷烃类环氧树脂如三酚甲烷环氧树脂和三酚丙烷环氧树脂;脂环族环氧树脂,萘类环氧树脂,联苯类环氧树脂,酚醛芳烷基类环氧树脂,和联苯芳烷基类环氧树脂,单独使用或使用它们的混合物。优选的是结构式(2)的环氧树脂:
其中G是缩水甘油基,R是氢或一价的烃基,所有R基团中至少有一个是一价烃基,n是0或至少是1的整数。
R表示的一价烃基优选的是有1-6个碳原子、取代的或非取代的一价烃基,更优选的是有1-5个碳原子,如烷基和芳基。典型的实例包括甲基、乙基、丙基、丁基、叔丁基和苯基。
在式(2)中,n是0或至少是1的整数,优选的是0或1-10。式(2)的环氧树脂可以是具有不同n值的环氧树脂的混合物。为使固化产品具有较高的玻璃化温度,优选使用的是一种混合物,该混合物中n =0的环氧树脂量为70%按重量计,理想的是60%,其余环氧树脂的分子量分布为代表平均聚合度的n的平均值在1-3范围内。使用含有超过70%按重量计n=0环氧树脂的环氧树脂混合物可导致较低玻璃化温度。
以下是具有式(2)的环氧树脂的实例。
此处,t-Bu是叔丁基,OG是下式的环氧丙氧基:
在本发明组合物中有另一种环氧树脂可以和具有式(2)的环氧树脂结合使用。可结合使用的其它环氧树脂的实例包括双酚A类型环氧树脂,线型酚醛清漆类环氧树脂,环脂族环氧树脂,缩水甘油基类环氧树脂,和下式的环氧树脂,可单独使用或其任意结合使用。
溴化环氧树脂可用作阻燃剂。溴化环氧树脂实例如下。
这些环氧树脂可单独使用,也可两种或多种混合使用。环氧树脂适合的使用量一般为:每100重量份含有烷氧基甲硅烷基的聚酰胺-酰亚胺使用至多150重量份(即,0-150重量份)环氧树脂,优选为1-150重量份,更优选为2-100重量份。低于1pbw(重量份)的环氧树脂不能提供具有对衬底的粘合强度的固化涂层,而环氧树脂多于150pbw,会降低固化涂层的耐热性。
优选的式(2)环氧树脂为1-100%重量,更优选为全部环氧树脂的5-100%重量。
C)固化促进剂
对作为本发明组合物中成分(C)的固化促进剂没有特别的限定,虽然就含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂与环氧树脂的反应性而言优选使用胺类催化剂。适合的胺类催化剂为咪唑衍生物,包括2-甲基咪唑,2-乙基-4-甲基咪唑,1-氰乙基-2-甲基咪唑,和2-苯基-4,5-二羟基甲基咪唑,它们可单独或混合使用。最优选的是具有以下所示结构式(3)的咪唑化合物。使用此种结构的咪唑化合物可增强固化产品的耐热性、防潮性和粘合性。
其中Ph是苯环(或苯基)。
其它有用的催化剂是磷基催化剂,包括三苯基膦,三苯基硼酸三苯基鏻,和四苯基硼酸四苯基鏻,以及以下所示的化合物。
其中,R3-R10选自氢,卤原子(例如,氟、溴、碘),C1-C8烷基,链烯基,炔基,C1-C8烷氧基,三氟甲基,和苯基。所有的取代基可以是相同的或不同的。
固化促进剂的适合使用量为每100重量份含有烷氧基甲硅烷基的聚酰胺-酰亚胺和混合环氧树脂0.001-20重量份,优选的是0.01-10重量份。低于0.001重量份固化促进剂不能达到短暂固化,反之,固化促进剂超过20重量份则会对组合物的储存稳定性产生不利影响。
D)有机溶剂
本发明组合物中的成分(D)是有机溶剂,其中的上述成分至少部分可溶解,优选的是全部可溶解。适合的溶剂包括γ-丁内酯;酰胺溶剂如N-甲基吡咯烷酮,N,N-二甲基乙酰胺,N,N-二甲基甲酰胺和1,3-二甲基-2-咪唑啉酮;醚溶剂如四氢呋喃,1,4-二噁唍,茴香醚,二甘醇二甲醚,三甘醇二甲醚,和丙二醇一甲基醚乙酸酯(PGMEA);酮类溶剂如环戊酮和环己酮;和二甲基亚砜。这些溶剂可单独或两种或两种以上混合使用。芳族烃类溶剂如甲苯和二甲苯,醇类如甲醇,乙醇和丙醇可以结合使用,只要不损害溶解度即可。使用的溶剂适合量是基于本发明底层涂料组合物总重的70-99.9%重量,优选为75-99.5%重量。底层涂料组合物中的溶剂含量低于70%重量将不能有效使用如用于涂覆,溶剂含量超过99.9%的底层涂料组合物则不能有效地形成固化涂层。
本发明的底层涂料组合物在有机溶剂中溶解,涂覆到半导体部件和/或引线框架的一个或两个表面,加热固化,形成涂层。涂覆技术虽然没有限制,可以使用配量、浸渍、喷涂或旋转涂覆法。尽管固化条件没有严格限制,仍需在最高350℃,优选为最高330℃温度下加热30秒至5小时,形成固化涂层或底层涂层。为了有效地从系统清除底层涂料组合物中的溶剂,以有效地进行树脂反应,固化温度最好根据情况逐步提高。一旦形成固化涂层(底层涂层),在其上将半导体-封装环氧树脂模塑配混料成型,环氧树脂模塑配混料与衬底(例如,无机衬底如镍、银、铜、硅或二氧化硅)之间的粘合得以增强。得到的半导体器件或组件具有极高的可靠性,在吸湿后的回流焊接步骤中,没有产生环氧树脂模塑配混料的断裂,也没有产生环氧树脂模塑配混料与衬底的分层现象(如以上示例)。
需封装的半导体器件包括,但不限于,二极管、晶体管、可控硅整流器、集成电路、大规模集成电路、超大规模集成电路等。
环氧树脂模塑配混料
半导体器件封装用环氧树脂模塑配混料可以是已知的任何一种模塑配混料,甚至是商业材料。例如,可使用KMC系列环氧模塑配混料(Shin-Etsu Chemical Co.,Ltd.)。
用于半导体封装的环氧树脂模塑配混料通常是可固化环氧树脂组合物,包含(a)环氧树脂,(b)固化剂,和(c)无机填料作为基本成分。
环氧树脂(a)就其分子结构、分子量等没有特别限定,只要一个分子中有至少两个环氧基。适合的环氧树脂的说明性实例包括双酚类环氧树脂、线型酚醛清漆类环氧树脂、三酚链烷烃类环氧树脂、酚醛芳烷基类环氧树脂,联苯基芳烷基类环氧树脂,芪类环氧树脂,含萘环环氧树脂、联苯类环氧树脂和环戊二烯类环氧树脂。这些环氧树脂可单独使用,也可两种或两种以上结合使用。
对固化剂(b)的分子结构式、分子量等没有特别限定,只要它具有至少两个官能团,这两个官能团应能够与环氧树脂的环氧基(例如,酚羟基、氨基或酸酐基,在酸酐基中包含至少一个酸酐基即可)反应。适合的固化剂是酚类树脂,包括线型酚醛清漆类酚醛树脂、亚二甲苯基改性的线型酚醛清漆树脂、双酚类酚醛树脂、联苯基类酚醛树脂,可熔酚醛树脂类酚醛树脂、酚芳烷基树脂、联苯基芳烷基树脂、三酚甲烷树脂、三酚链烷树脂及其聚合物,以及含萘环酚醛树脂和二环戊二烯改性的酚醛树脂。还包括酸酐如甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、六氢邻苯二甲酸酐和甲基-Himic酸酐(5-降冰片烯-2,3-二羧酸酸酐),和氨基固化剂。优选使用可靠性高、吸湿度低的酚醛树脂。这些固化剂可单独使用,或两种或两种以上结合使用。
只要对环氧树脂固化有效,对配混的固化剂(b)的用量没有特别限定。当酚醛树脂作为固化剂使用时,其用量优选为使固化剂(b)中的酚醛羟基与环氧树脂(a)中的环氧基摩尔比为0.5-2.0,尤其为0.8-1.5。
无机填料(c)的实例包括晶体二氧化硅、球形的或碎片形的无定形二氧化硅、氧化铝和氮化硅,以球形或碎片形态的无定形二氧化硅为优选,因为它具有低线膨胀系数和高流动性。优选的无机填料的平均颗粒尺寸为1.0-30微米,更优选的为5.0-25微米。
无机填料(c)的适合用量为每100重量份计的环氧树脂(a)与固化剂(b)结合用量使用250-1000重量份,优选为350-900重量份。如果填料低于250重量份,固化状态的组分的线膨胀系数会增加,会吸收更多的水。填料超过1000重量份的组合物,其流动性会太低,不能成型。
最典型的封装技术是转移模塑成型技术。理想的环氧树脂组合物在150-180℃温度下模塑成型30-180秒,在150-180℃温度下后固化约2-16小时。
实施例
以下是实施例和比较实施例用以进一步说明本发明,但不限制本发明。
实施例中使用的成分说明如下。
基本树脂
树脂A:含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂(CompoceranH900-2,Arakawa Chemical Industries,Ltd.)
树脂B:含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂(Compoceran H901-2,Arakawa Chemical Industries,Ltd.)
树脂C:聚酰胺-酰亚胺树脂
树脂D:聚酰胺酸树脂
环氧树脂
(1)
软化点:85℃
环氧当量:214
(n=0 59wt%,n=1 24wt%,n=2 8wt%,其它8wt%)
(2)
软化点:79℃
树脂当量:165
(n=0 54wt%,n=1 31wt%,n=2 9wt%,其它6wt%)
(3)双酚A类环氧树脂,
Japan Epoxy Resin Co.,Ltd.的Epikote 1001
软化点:64℃
环氧当量:450
(4)酚醛线型酚醛清漆类环氧树脂,
Nippon Kayaku Co.,Ltd.的EOCN-1020-55
软化点:54℃
环氧当量:195
催化剂
2PHZ:2-甲基-4,5-二羟基甲基咪唑
有机溶剂
N-甲基-2-吡咯烷酮
环己酮
甲氧基苯
实施例1-6和比较实施例1-3
根据表1的配方将基本树脂与环氧树脂、催化剂和有机溶剂配混,制备九份底层涂料组合物。底层涂料组合物按表1所示以浸渍法涂到衬底上,在200℃温度下固化30分钟,随后,环氧树脂模塑配混料(Shin-Etsu Chemical Co.,Ltd.的KMC 3580CA)在175℃温度和70kg/cm2条件下模塑成型,获得模塑制品。底层涂料组合物分别涂覆到半导体部件上,在200℃温度下固化30分钟,随后,环氧树脂模塑配混料(Shin-Etsu Chemical Co.,Ltd.的KMC 3580CA)在175℃温度和70kg/cm2条件下模塑成型,获得模塑组件(见图1)。这些模塑样品以以下测试方法进行检验,结果见表1。
在图1中,底层涂料组合物固化涂层6介于硅芯片1和冲模垫2之间。硅芯片1通过粘合金属丝4与引线框架3连接。组装件以固化态环氧树脂模塑配混料(或封装剂)5所封装。
(1)吸湿后的粘合
如表1所示,底层涂料在测试件(镍、银、铜或硅)上涂覆并固化,随后,环氧树脂模塑配混料在175℃和70kg/cm2条件下模制成型90秒钟,在180℃下后固化4小时,形成底面积10mm2,高3mm的圆柱形部件。这一样品保持在121℃/100%相对湿度(RH)的气氛中吸湿24小时,之后在260℃的热板上,使用推拉计测量模制部件与测试件之间的剥离强度。
(2)热循环后的抗裂性
体积9.0mm×4.5mm×0.5mm的硅芯片附着在一个14-针的集成电路板(ICflame)(42合金)上,之后涂以如表1所示的底层涂料组合物,并固化。然后将环氧树脂模塑配混料在175℃温度下模制90秒钟成型,在180℃温度下后固化4小时。得到的组件在-50℃/30分钟和180℃/30分钟之间接受热循环试验。在1000次循环后,确定环氧树脂的破裂百分率。
(3)吸湿后的焊接抗裂性
使用60-针的QFP(尺寸20mm×14mm,冲模垫下的树脂厚度0.7mm,冲模垫尺寸10mm×8mm)。在冲模垫的背面涂以底层涂料组合物并固化(见图1),环氧树脂模塑配混料以175℃温度模制90秒钟成型,以180℃温度下后固化4小时。该组件保持在温度85℃/85%相对湿度(RH)的气氛中吸湿168小时,之后浸入260℃的焊剂浴中10秒。确定每10个组件的破裂组件数。
表1
配万 | 成分(pbw) | 实施例 | 比较实施例 | ||||||||
1 | 2 | 3 | 4 | 5 | 6 | 1 | 2 | 3 | |||
树脂A | 100 | 100 | - | 100 | 100 | - | - | - | - | ||
树脂B | - | - | 100 | - | - | 100 | - | - | - | ||
树脂C | - | - | - | - | - | - | 100 | 100 | - | ||
树脂D | - | - | - | - | - | - | - | - | 100 | ||
环氧树脂(1) | 10 | - | 10 | - | 5 | - | - | 10 | - | ||
环氧树脂(2) | - | 8 | - | - | - | - | - | - | - | ||
环氧树脂(3) | - | - | - | - | 5 | - | - | - | - | ||
环氧树脂(4) | - | - | - | - | - | 10 | - | - | - | ||
2PHZ | 1 | 1 | 1 | - | 1 | 1 | - | 1 | - | ||
N-甲基-2-吡咯烷酮 | 400 | 400 | 400 | 400 | 400 | 400 | 400 | 400 | 400 | ||
环己酮 | 300 | 300 | 300 | 300 | 300 | 400 | 300 | 300 | 300 | ||
甲氧基苯 | 300 | 270 | 300 | 200 | 300 | 300 | 200 | 300 | 200 | ||
测试结果 | 吸湿后的剥离强度(MPa) | 镍 | 5 | 5 | 4.8 | 2.8 | 4.5 | 2.8 | 1.3 | 1.8 | 1.3 |
银 | 5.1 | 5.1 | 5 | 2.5 | 3.8 | 2.8 | 0.8 | 1.5 | 0.5 | ||
铜 | 4.9 | 4.7 | 4.8 | 2.4 | 4.5 | 2.6 | 0.9 | 1.4 | 0.7 | ||
硅 | 5.5 | 5.2 | 5.3 | 2.5 | 4 | 3 | 1.5 | 1.5 | 1.4 | ||
半导体组件 | 热循环抗裂性(%废品) | 0 | 0 | 0 | 10 | 0 | 5 | 80 | 80 | 100 | |
吸湿后焊接抗裂性 | 0/10 | 0/10 | 0/10 | 1/10 | 0/10 | 1/10 | 10/10 | 9/10 | 10/10 |
Claims (6)
2.权利要求1的底层涂料组合物,其中有机溶剂的使用量基于底层涂料组合物总重计为70-99.9%。
3.权利要求1的底层涂料组合物,包含
(A)具有通式(1)的含有烷氧基甲硅烷基的聚酰胺-酰亚胺树脂,
(B)在一个分子中有至少两个环氧基的环氧树脂,
(C)固化促进剂,和
(D)有机溶剂。
4.权利要求3的底层涂料组合物,其中环氧树脂具有通式(2):
其中G是缩水甘油基,R是氢或一价烃基,所有R基中至少一个是一价烃基,n是0或至少是1的整数。
5.一种借助固化状态的权利要求1的底层涂料组合物而以环氧树脂模塑配混料封装的半导体器件。
6.一种封装半导体器件的方法,步骤如下:
·将权利要求1的底层涂料组合物涂覆到半导体部件的表面,
·将该底层涂料组合物固化,和
·将环氧树脂模塑配混料模制到固化的底层涂层的外表面。
Applications Claiming Priority (3)
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CN103228754A (zh) * | 2010-09-22 | 2013-07-31 | 大赛路·赢创有限公司 | 薄膜状密封剂和密封方法 |
CN108912968A (zh) * | 2018-08-20 | 2018-11-30 | 无锡创彩光学材料有限公司 | 一种仿木复合漆及其制备方法 |
CN114539872A (zh) * | 2022-02-07 | 2022-05-27 | 广州市联中电子科技有限公司 | 一种钽电容专用防腐耐湿热涂料及其制备方法与应用 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103228754A (zh) * | 2010-09-22 | 2013-07-31 | 大赛路·赢创有限公司 | 薄膜状密封剂和密封方法 |
CN108912968A (zh) * | 2018-08-20 | 2018-11-30 | 无锡创彩光学材料有限公司 | 一种仿木复合漆及其制备方法 |
CN114539872A (zh) * | 2022-02-07 | 2022-05-27 | 广州市联中电子科技有限公司 | 一种钽电容专用防腐耐湿热涂料及其制备方法与应用 |
CN114539872B (zh) * | 2022-02-07 | 2022-11-01 | 广州市联中电子科技有限公司 | 一种钽电容专用防腐耐湿热涂料及其制备方法与应用 |
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TWI391459B (zh) | 2013-04-01 |
US7714080B2 (en) | 2010-05-11 |
CN1834175B (zh) | 2011-05-04 |
JP2006241414A (ja) | 2006-09-14 |
KR20060097607A (ko) | 2006-09-14 |
US20060199923A1 (en) | 2006-09-07 |
KR101373883B1 (ko) | 2014-03-12 |
JP4609645B2 (ja) | 2011-01-12 |
TW200636038A (en) | 2006-10-16 |
KR20130038317A (ko) | 2013-04-17 |
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