JPS5599930A - Surface modification - Google Patents
Surface modificationInfo
- Publication number
- JPS5599930A JPS5599930A JP671779A JP671779A JPS5599930A JP S5599930 A JPS5599930 A JP S5599930A JP 671779 A JP671779 A JP 671779A JP 671779 A JP671779 A JP 671779A JP S5599930 A JPS5599930 A JP S5599930A
- Authority
- JP
- Japan
- Prior art keywords
- partial
- sio
- formula
- alkyl group
- hydrolyzate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Paints Or Removers (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To improve the surface hardness, abrasion resistance, gloss and antistatic or anti-fogging properties of a substrate having a resin surface, by hardening a composition consisting mainly of a partial hydrolyzate of a specific silicon compound and a melamine derivative.
CONSTITUTION: A composition comprising (A) 100pts.wt. of a partial CO-hydrolyzate (a mixture of partial hydrolyzates) of (a) tetraalkoxy-silicon of formula I (R1 is 1W4C alkyl group) and (b) an organosilicon compound of formula II (n is an integer 1W3; R2 is 1W6C hydrocarbon group; R3 is 1W4C alkyl group), (B) 10W 500pts.wt. of an alkyletherified methylolmelamine and a monomer or oligomer having two or more functional groups at a gram equiv. ratio of 1:0.5W1.5, and (C) 0.01W10wt% based on the melamine derivative in (B) of nitrocellulose. The weight ratio of (a) to (b) is 5/95W95/5 calculated as SiO2 and Rn 2SiOm (m=2- 0.5n), respectively.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP671779A JPS5599930A (en) | 1979-01-23 | 1979-01-23 | Surface modification |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP671779A JPS5599930A (en) | 1979-01-23 | 1979-01-23 | Surface modification |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5599930A true JPS5599930A (en) | 1980-07-30 |
JPS624059B2 JPS624059B2 (en) | 1987-01-28 |
Family
ID=11646009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP671779A Granted JPS5599930A (en) | 1979-01-23 | 1979-01-23 | Surface modification |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5599930A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11335625A (en) * | 1998-05-25 | 1999-12-07 | Matsushita Electric Works Ltd | Coating resin composition and coated product using the same |
WO2002051897A3 (en) * | 2000-12-22 | 2002-09-12 | Basf Corp | Coating system containing modified crosslinkers |
JP2008501825A (en) * | 2004-06-01 | 2008-01-24 | ダウ コーニング コーポレーション | Material composition for nano and microlithography |
US7714080B2 (en) | 2005-03-07 | 2010-05-11 | Shin-Etsu Chemical Co., Ltd. | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880175A (en) * | 1972-01-31 | 1973-10-26 | ||
JPS50132076A (en) * | 1974-04-08 | 1975-10-18 |
-
1979
- 1979-01-23 JP JP671779A patent/JPS5599930A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880175A (en) * | 1972-01-31 | 1973-10-26 | ||
JPS50132076A (en) * | 1974-04-08 | 1975-10-18 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11335625A (en) * | 1998-05-25 | 1999-12-07 | Matsushita Electric Works Ltd | Coating resin composition and coated product using the same |
WO2002051897A3 (en) * | 2000-12-22 | 2002-09-12 | Basf Corp | Coating system containing modified crosslinkers |
JP2008501825A (en) * | 2004-06-01 | 2008-01-24 | ダウ コーニング コーポレーション | Material composition for nano and microlithography |
US7714080B2 (en) | 2005-03-07 | 2010-05-11 | Shin-Etsu Chemical Co., Ltd. | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS624059B2 (en) | 1987-01-28 |
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