CN1820889A - 非低共熔无铅焊料组合物 - Google Patents
非低共熔无铅焊料组合物 Download PDFInfo
- Publication number
- CN1820889A CN1820889A CNA2006100080478A CN200610008047A CN1820889A CN 1820889 A CN1820889 A CN 1820889A CN A2006100080478 A CNA2006100080478 A CN A2006100080478A CN 200610008047 A CN200610008047 A CN 200610008047A CN 1820889 A CN1820889 A CN 1820889A
- Authority
- CN
- China
- Prior art keywords
- weight
- composition
- free solder
- low eutectic
- non low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 119
- 239000000203 mixture Substances 0.000 title claims description 73
- 230000005496 eutectics Effects 0.000 title claims description 69
- 229910007637 SnAg Inorganic materials 0.000 claims description 19
- 229910000765 intermetallic Inorganic materials 0.000 claims description 12
- 230000004927 fusion Effects 0.000 claims description 10
- 229910008433 SnCU Inorganic materials 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 51
- 239000000956 alloy Substances 0.000 abstract description 51
- 229910052718 tin Inorganic materials 0.000 abstract description 16
- 229910052709 silver Inorganic materials 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 23
- 238000010992 reflux Methods 0.000 description 18
- 239000007791 liquid phase Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 6
- 235000011837 pasties Nutrition 0.000 description 6
- 239000007790 solid phase Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005272 metallurgy Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/181—Encapsulation
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/314,498 US6854636B2 (en) | 2002-12-06 | 2002-12-06 | Structure and method for lead free solder electronic package interconnections |
US10/314,498 | 2002-12-06 |
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CNB2003101182117A Division CN100484686C (zh) | 2002-12-06 | 2003-12-05 | 无铅焊料分层结构的产生方法 |
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KR (1) | KR100546976B1 (zh) |
CN (2) | CN100484686C (zh) |
TW (1) | TWI238502B (zh) |
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CN101972901A (zh) * | 2010-10-25 | 2011-02-16 | 北京科技大学 | 一种钎焊铝碳化硅复合材料的中温钎料及制备和钎焊方法 |
CN102328157A (zh) * | 2011-09-09 | 2012-01-25 | 合肥工业大学 | 一种制备SnAgCu无铅焊料的方法 |
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US6750133B2 (en) * | 2002-10-24 | 2004-06-15 | Intel Corporation | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
US6854636B2 (en) * | 2002-12-06 | 2005-02-15 | International Business Machines Corporation | Structure and method for lead free solder electronic package interconnections |
-
2002
- 2002-12-06 US US10/314,498 patent/US6854636B2/en not_active Expired - Fee Related
-
2003
- 2003-10-31 TW TW092130394A patent/TWI238502B/zh not_active IP Right Cessation
- 2003-11-13 KR KR1020030080140A patent/KR100546976B1/ko active IP Right Grant
- 2003-11-19 JP JP2003389972A patent/JP4114597B2/ja not_active Expired - Fee Related
- 2003-12-05 CN CNB2003101182117A patent/CN100484686C/zh not_active Expired - Fee Related
- 2003-12-05 CN CN2006100080478A patent/CN1820889B/zh not_active Expired - Fee Related
-
2004
- 2004-11-18 US US10/991,581 patent/US20050106059A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101972901A (zh) * | 2010-10-25 | 2011-02-16 | 北京科技大学 | 一种钎焊铝碳化硅复合材料的中温钎料及制备和钎焊方法 |
CN101972901B (zh) * | 2010-10-25 | 2012-06-06 | 北京科技大学 | 一种钎焊铝碳化硅复合材料的中温钎料及制备和钎焊方法 |
CN102328157A (zh) * | 2011-09-09 | 2012-01-25 | 合肥工业大学 | 一种制备SnAgCu无铅焊料的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4114597B2 (ja) | 2008-07-09 |
US6854636B2 (en) | 2005-02-15 |
CN1820889B (zh) | 2010-06-16 |
TWI238502B (en) | 2005-08-21 |
KR20040049787A (ko) | 2004-06-12 |
US20050106059A1 (en) | 2005-05-19 |
TW200419749A (en) | 2004-10-01 |
CN1506188A (zh) | 2004-06-23 |
JP2004188497A (ja) | 2004-07-08 |
US20040108367A1 (en) | 2004-06-10 |
KR100546976B1 (ko) | 2006-01-31 |
CN100484686C (zh) | 2009-05-06 |
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