CN1795291A - 在导电基材上形成金属氧化物涂层的方法,由此得到的活化阴极及其在碱金属氯化物水溶液电解中的应用 - Google Patents
在导电基材上形成金属氧化物涂层的方法,由此得到的活化阴极及其在碱金属氯化物水溶液电解中的应用 Download PDFInfo
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/14—Alkali metal compounds
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
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- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Chemically Coating (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
Abstract
Description
在1.6kA/m2的E阴极(V/ECS) | 与铁载体相比的电压增加(V) | |
第一次极化 | -1.34 | 0.06 |
第二次极化 | -1.25 | 0.15 |
第三次极化 | -1.24 | 0.16 |
在1.6kA/m2的E阴极(V/ECS) | 与铁载体相比的电压增加(V) | |
第一次极化 | -1.34 | 0.06 |
第二次极化 | -1.24 | 0.16 |
第三次极化 | -1.23 | 0.17 |
在1.6kA/m2的E阴极(V/ECS) | 与铁载体相比的电压增加(V) | |
第一次极化 | -1.24 | 0.16 |
第二次极化 | -1.18 | 0.22 |
第三次极化 | -1.17 | 0.23 |
在1.6kA/m2的E阴极(V/ECS) | 与铁载体相比的电压增加(V) | |
第一次极化 | -1.28 | 0.12 |
第二次极化 | -1.20 | 0.20 |
第三次极化 | -1.18 | 0.22 |
铁载体 | 镍载体 | |
第一层 | 14.1g/m2 | 6.2g/m2 |
第二层 | 25.8g/m2 | 12.4g/m2 |
第三层 | 18.5g/m2 | |
第四层 | 21.2g/m2 | |
涂层颜色 | 褐色 | 黑色 |
铁载体阴极 | 在1.6kA/m2的E阴极(V/ECS) | 与裸露铁阴极相比的电压增加(V) |
第一次极化 | -1.35 | 0.05 |
第二次极化 | -1.40 | 0 |
铁载体阴极 | 在1.6kA/m2的E阴极(V/ECS) | 与裸露铁阴极相比的电压增加(V) |
第一次极化 | -1.3 | 0.10 |
第二次极化 | -1.17 | 0.23 |
第三次极化 | -1.15 | 0.25 |
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0303867A FR2852973B1 (fr) | 2003-03-28 | 2003-03-28 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. |
FR03/03867 | 2003-03-28 | ||
PCT/FR2004/000746 WO2004087992A2 (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins. |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1795291A true CN1795291A (zh) | 2006-06-28 |
CN1795291B CN1795291B (zh) | 2011-08-31 |
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Application Number | Title | Priority Date | Filing Date |
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CN2004800147636A Expired - Fee Related CN1795291B (zh) | 2003-03-28 | 2004-03-25 | 在导电基材上形成金属氧化物涂层的方法,由此得到的活化阴极及其在碱金属氯化物水溶液电解中的应用 |
Country Status (16)
Country | Link |
---|---|
US (1) | US7790233B2 (zh) |
EP (1) | EP1608795B1 (zh) |
JP (1) | JP4532471B2 (zh) |
KR (1) | KR101111369B1 (zh) |
CN (1) | CN1795291B (zh) |
AT (1) | ATE330043T1 (zh) |
BR (1) | BRPI0408905A (zh) |
CA (1) | CA2520584C (zh) |
DE (1) | DE602004001230T2 (zh) |
ES (1) | ES2270380T3 (zh) |
FR (1) | FR2852973B1 (zh) |
MX (1) | MXPA05010353A (zh) |
PL (1) | PL1608795T3 (zh) |
UA (1) | UA80610C2 (zh) |
WO (1) | WO2004087992A2 (zh) |
ZA (1) | ZA200507825B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505127A (zh) * | 2011-12-29 | 2012-06-20 | 文广 | 贵金属改性钛阳极材料的制备方法 |
CN106521433A (zh) * | 2015-09-09 | 2017-03-22 | 宁波江丰电子材料股份有限公司 | 环件结构及其加工方法 |
CN114616358A (zh) * | 2019-10-30 | 2022-06-10 | 德诺拉工业有限公司 | 用于电化学析氢的电极 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006283143A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Printing Co Ltd | 金属酸化物膜の製造方法 |
GB0714021D0 (en) * | 2007-07-18 | 2007-08-29 | Green Metals Ltd | Improvements in anode materials |
US8022004B2 (en) * | 2008-05-24 | 2011-09-20 | Freeport-Mcmoran Corporation | Multi-coated electrode and method of making |
CN102482337A (zh) * | 2009-05-26 | 2012-05-30 | 新加坡科技研究局 | 吡咯啉-5-羧酸还原酶1的突变蛋白 |
WO2015137193A1 (ja) * | 2014-03-12 | 2015-09-17 | Jsr株式会社 | 半導体デバイス製造用組成物および該半導体デバイス製造用組成物を用いたパターン形成方法 |
Family Cites Families (12)
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US3850668A (en) | 1972-06-05 | 1974-11-26 | Johnson Matthey Co Ltd | Impregnation of graphite with ruthenium compounds |
US4300992A (en) | 1975-05-12 | 1981-11-17 | Hodogaya Chemical Co., Ltd. | Activated cathode |
US4100049A (en) * | 1977-07-11 | 1978-07-11 | Diamond Shamrock Corporation | Coated cathode for electrolysis cells |
FR2583781A1 (fr) * | 1985-06-24 | 1986-12-26 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
FR2596776B1 (fr) * | 1986-04-03 | 1988-06-03 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
JPH0766816B2 (ja) * | 1989-01-13 | 1995-07-19 | 東洋インキ製造株式会社 | ガス拡散型複合電極の製造方法 |
JP4047382B2 (ja) * | 1995-08-04 | 2008-02-13 | マイクロコーティング テクノロジーズ | 超臨界付近および超臨界の流体溶液の溶射を用いた化学蒸着および粉体形成 |
US5864051A (en) * | 1997-11-10 | 1999-01-26 | Uop | Selective oxidation catalyst process for preparing the catalyst and process using the catalyst |
JP3383838B2 (ja) * | 1999-02-25 | 2003-03-10 | 独立行政法人産業技術総合研究所 | 金属酸化物の製造方法及び微細パターンの形成方法 |
FR2797646B1 (fr) * | 1999-08-20 | 2002-07-05 | Atofina | Cathode utilisable pour l'electrolyse de solutions aqueuses |
US7258899B1 (en) * | 2001-12-13 | 2007-08-21 | Amt Holdings, Inc. | Process for preparing metal coatings from liquid solutions utilizing cold plasma |
US20040077494A1 (en) * | 2002-10-22 | 2004-04-22 | Labarge William J. | Method for depositing particles onto a catalytic support |
-
2003
- 2003-03-28 FR FR0303867A patent/FR2852973B1/fr not_active Expired - Fee Related
-
2004
- 2004-03-25 PL PL04742353T patent/PL1608795T3/pl unknown
- 2004-03-25 US US10/550,646 patent/US7790233B2/en not_active Expired - Fee Related
- 2004-03-25 MX MXPA05010353A patent/MXPA05010353A/es active IP Right Grant
- 2004-03-25 CN CN2004800147636A patent/CN1795291B/zh not_active Expired - Fee Related
- 2004-03-25 DE DE602004001230T patent/DE602004001230T2/de not_active Expired - Lifetime
- 2004-03-25 UA UAA200510604A patent/UA80610C2/uk unknown
- 2004-03-25 JP JP2006505751A patent/JP4532471B2/ja not_active Expired - Fee Related
- 2004-03-25 KR KR1020057018365A patent/KR101111369B1/ko not_active IP Right Cessation
- 2004-03-25 ES ES04742353T patent/ES2270380T3/es not_active Expired - Lifetime
- 2004-03-25 AT AT04742353T patent/ATE330043T1/de not_active IP Right Cessation
- 2004-03-25 BR BRPI0408905-7A patent/BRPI0408905A/pt not_active Application Discontinuation
- 2004-03-25 CA CA2520584A patent/CA2520584C/fr not_active Expired - Fee Related
- 2004-03-25 EP EP04742353A patent/EP1608795B1/fr not_active Expired - Lifetime
- 2004-03-25 WO PCT/FR2004/000746 patent/WO2004087992A2/fr active Application Filing
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2005
- 2005-09-27 ZA ZA200507825A patent/ZA200507825B/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505127A (zh) * | 2011-12-29 | 2012-06-20 | 文广 | 贵金属改性钛阳极材料的制备方法 |
CN106521433A (zh) * | 2015-09-09 | 2017-03-22 | 宁波江丰电子材料股份有限公司 | 环件结构及其加工方法 |
CN114616358A (zh) * | 2019-10-30 | 2022-06-10 | 德诺拉工业有限公司 | 用于电化学析氢的电极 |
Also Published As
Publication number | Publication date |
---|---|
FR2852973B1 (fr) | 2006-05-26 |
ZA200507825B (en) | 2007-01-31 |
ATE330043T1 (de) | 2006-07-15 |
ES2270380T3 (es) | 2007-04-01 |
DE602004001230T2 (de) | 2007-04-19 |
DE602004001230D1 (de) | 2006-07-27 |
EP1608795A2 (fr) | 2005-12-28 |
BRPI0408905A (pt) | 2006-03-28 |
JP2006521469A (ja) | 2006-09-21 |
KR20050114265A (ko) | 2005-12-05 |
CN1795291B (zh) | 2011-08-31 |
FR2852973A1 (fr) | 2004-10-01 |
CA2520584A1 (fr) | 2004-10-14 |
JP4532471B2 (ja) | 2010-08-25 |
UA80610C2 (en) | 2007-10-10 |
WO2004087992A3 (fr) | 2005-02-17 |
US7790233B2 (en) | 2010-09-07 |
PL1608795T3 (pl) | 2006-11-30 |
US20060263614A1 (en) | 2006-11-23 |
KR101111369B1 (ko) | 2012-04-09 |
CA2520584C (fr) | 2011-08-23 |
WO2004087992A2 (fr) | 2004-10-14 |
EP1608795B1 (fr) | 2006-06-14 |
MXPA05010353A (es) | 2005-12-14 |
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