PL1608795T3 - Sposób wytwarzania powłoki z tlenków metali na podłożu elektroprzewodzącym, katoda aktywowana będąca jego rezultatem i jej zastosowanie w elektolizie wodnych roztworów chlorków metali alkaicznych - Google Patents
Sposób wytwarzania powłoki z tlenków metali na podłożu elektroprzewodzącym, katoda aktywowana będąca jego rezultatem i jej zastosowanie w elektolizie wodnych roztworów chlorków metali alkaicznychInfo
- Publication number
- PL1608795T3 PL1608795T3 PL04742353T PL04742353T PL1608795T3 PL 1608795 T3 PL1608795 T3 PL 1608795T3 PL 04742353 T PL04742353 T PL 04742353T PL 04742353 T PL04742353 T PL 04742353T PL 1608795 T3 PL1608795 T3 PL 1608795T3
- Authority
- PL
- Poland
- Prior art keywords
- electrolysis
- coating
- formation
- metal
- aqueous solutions
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 229910044991 metal oxide Inorganic materials 0.000 title abstract 3
- 150000004706 metal oxides Chemical class 0.000 title abstract 3
- 239000007864 aqueous solution Substances 0.000 title abstract 2
- 230000015572 biosynthetic process Effects 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 title abstract 2
- 238000005868 electrolysis reaction Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 229910001510 metal chloride Inorganic materials 0.000 title 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 abstract 1
- 238000001354 calcination Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 230000000737 periodic effect Effects 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/14—Alkali metal compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Chemically Coating (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0303867A FR2852973B1 (fr) | 2003-03-28 | 2003-03-28 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. |
| EP04742353A EP1608795B1 (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins. |
| PCT/FR2004/000746 WO2004087992A2 (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1608795T3 true PL1608795T3 (pl) | 2006-11-30 |
Family
ID=32947259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL04742353T PL1608795T3 (pl) | 2003-03-28 | 2004-03-25 | Sposób wytwarzania powłoki z tlenków metali na podłożu elektroprzewodzącym, katoda aktywowana będąca jego rezultatem i jej zastosowanie w elektolizie wodnych roztworów chlorków metali alkaicznych |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US7790233B2 (pl) |
| EP (1) | EP1608795B1 (pl) |
| JP (1) | JP4532471B2 (pl) |
| KR (1) | KR101111369B1 (pl) |
| CN (1) | CN1795291B (pl) |
| AT (1) | ATE330043T1 (pl) |
| BR (1) | BRPI0408905A (pl) |
| CA (1) | CA2520584C (pl) |
| DE (1) | DE602004001230T2 (pl) |
| ES (1) | ES2270380T3 (pl) |
| FR (1) | FR2852973B1 (pl) |
| MX (1) | MXPA05010353A (pl) |
| PL (1) | PL1608795T3 (pl) |
| UA (1) | UA80610C2 (pl) |
| WO (1) | WO2004087992A2 (pl) |
| ZA (1) | ZA200507825B (pl) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006283143A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Printing Co Ltd | 金属酸化物膜の製造方法 |
| GB0714021D0 (en) * | 2007-07-18 | 2007-08-29 | Green Metals Ltd | Improvements in anode materials |
| US8022004B2 (en) * | 2008-05-24 | 2011-09-20 | Freeport-Mcmoran Corporation | Multi-coated electrode and method of making |
| US20120144511A1 (en) * | 2009-05-26 | 2012-06-07 | Agency For Science, Technology And Research | Muteins of the pyrroline-5-carboxylate reductase 1 |
| CN102505127A (zh) * | 2011-12-29 | 2012-06-20 | 文广 | 贵金属改性钛阳极材料的制备方法 |
| WO2015137193A1 (ja) * | 2014-03-12 | 2015-09-17 | Jsr株式会社 | 半導体デバイス製造用組成物および該半導体デバイス製造用組成物を用いたパターン形成方法 |
| CN106521433A (zh) * | 2015-09-09 | 2017-03-22 | 宁波江丰电子材料股份有限公司 | 环件结构及其加工方法 |
| IT201900020026A1 (it) * | 2019-10-30 | 2021-04-30 | Industrie De Nora Spa | Elettrodo per evoluzione elettrolitica di idrogeno |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3850668A (en) | 1972-06-05 | 1974-11-26 | Johnson Matthey Co Ltd | Impregnation of graphite with ruthenium compounds |
| US4300992A (en) | 1975-05-12 | 1981-11-17 | Hodogaya Chemical Co., Ltd. | Activated cathode |
| US4100049A (en) * | 1977-07-11 | 1978-07-11 | Diamond Shamrock Corporation | Coated cathode for electrolysis cells |
| FR2583781A1 (fr) * | 1985-06-24 | 1986-12-26 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
| FR2596776B1 (fr) * | 1986-04-03 | 1988-06-03 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
| JPH0766816B2 (ja) * | 1989-01-13 | 1995-07-19 | 東洋インキ製造株式会社 | ガス拡散型複合電極の製造方法 |
| PT848658E (pt) * | 1995-08-04 | 2007-01-31 | Ngimat Co | Deposição química de vapor e formação de pó utilizando vaporização térmica com soluções fluidas quase supercríticas e supercríticas |
| US5864051A (en) * | 1997-11-10 | 1999-01-26 | Uop | Selective oxidation catalyst process for preparing the catalyst and process using the catalyst |
| JP3383838B2 (ja) | 1999-02-25 | 2003-03-10 | 独立行政法人産業技術総合研究所 | 金属酸化物の製造方法及び微細パターンの形成方法 |
| FR2797646B1 (fr) * | 1999-08-20 | 2002-07-05 | Atofina | Cathode utilisable pour l'electrolyse de solutions aqueuses |
| US7258899B1 (en) * | 2001-12-13 | 2007-08-21 | Amt Holdings, Inc. | Process for preparing metal coatings from liquid solutions utilizing cold plasma |
| US20040077494A1 (en) * | 2002-10-22 | 2004-04-22 | Labarge William J. | Method for depositing particles onto a catalytic support |
-
2003
- 2003-03-28 FR FR0303867A patent/FR2852973B1/fr not_active Expired - Fee Related
-
2004
- 2004-03-25 UA UAA200510604A patent/UA80610C2/uk unknown
- 2004-03-25 WO PCT/FR2004/000746 patent/WO2004087992A2/fr not_active Ceased
- 2004-03-25 EP EP04742353A patent/EP1608795B1/fr not_active Expired - Lifetime
- 2004-03-25 US US10/550,646 patent/US7790233B2/en not_active Expired - Fee Related
- 2004-03-25 MX MXPA05010353A patent/MXPA05010353A/es active IP Right Grant
- 2004-03-25 AT AT04742353T patent/ATE330043T1/de not_active IP Right Cessation
- 2004-03-25 KR KR1020057018365A patent/KR101111369B1/ko not_active Expired - Fee Related
- 2004-03-25 CN CN2004800147636A patent/CN1795291B/zh not_active Expired - Fee Related
- 2004-03-25 DE DE602004001230T patent/DE602004001230T2/de not_active Expired - Lifetime
- 2004-03-25 ES ES04742353T patent/ES2270380T3/es not_active Expired - Lifetime
- 2004-03-25 JP JP2006505751A patent/JP4532471B2/ja not_active Expired - Fee Related
- 2004-03-25 CA CA2520584A patent/CA2520584C/fr not_active Expired - Fee Related
- 2004-03-25 BR BRPI0408905-7A patent/BRPI0408905A/pt not_active Application Discontinuation
- 2004-03-25 PL PL04742353T patent/PL1608795T3/pl unknown
-
2005
- 2005-09-27 ZA ZA200507825A patent/ZA200507825B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20060263614A1 (en) | 2006-11-23 |
| EP1608795A2 (fr) | 2005-12-28 |
| FR2852973B1 (fr) | 2006-05-26 |
| CA2520584C (fr) | 2011-08-23 |
| KR101111369B1 (ko) | 2012-04-09 |
| WO2004087992A2 (fr) | 2004-10-14 |
| ATE330043T1 (de) | 2006-07-15 |
| DE602004001230D1 (de) | 2006-07-27 |
| KR20050114265A (ko) | 2005-12-05 |
| WO2004087992A3 (fr) | 2005-02-17 |
| US7790233B2 (en) | 2010-09-07 |
| EP1608795B1 (fr) | 2006-06-14 |
| CN1795291B (zh) | 2011-08-31 |
| CA2520584A1 (fr) | 2004-10-14 |
| FR2852973A1 (fr) | 2004-10-01 |
| JP2006521469A (ja) | 2006-09-21 |
| BRPI0408905A (pt) | 2006-03-28 |
| CN1795291A (zh) | 2006-06-28 |
| DE602004001230T2 (de) | 2007-04-19 |
| JP4532471B2 (ja) | 2010-08-25 |
| ZA200507825B (en) | 2007-01-31 |
| ES2270380T3 (es) | 2007-04-01 |
| MXPA05010353A (es) | 2005-12-14 |
| UA80610C2 (en) | 2007-10-10 |
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