CA2520584A1 - Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins - Google Patents
Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins Download PDFInfo
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- CA2520584A1 CA2520584A1 CA002520584A CA2520584A CA2520584A1 CA 2520584 A1 CA2520584 A1 CA 2520584A1 CA 002520584 A CA002520584 A CA 002520584A CA 2520584 A CA2520584 A CA 2520584A CA 2520584 A1 CA2520584 A1 CA 2520584A1
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- Prior art keywords
- metal
- acetylacetonate
- substrate
- solvent
- electrolysis
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract 21
- 239000000758 substrate Substances 0.000 title claims abstract 13
- 239000007864 aqueous solution Substances 0.000 title claims abstract 6
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract 6
- 150000004706 metal oxides Chemical class 0.000 title claims abstract 6
- 239000011248 coating agent Substances 0.000 title claims abstract 5
- 238000000576 coating method Methods 0.000 title claims abstract 5
- 238000005868 electrolysis reaction Methods 0.000 title claims abstract 5
- 230000015572 biosynthetic process Effects 0.000 title abstract 2
- 229910001510 metal chloride Inorganic materials 0.000 title 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims abstract 15
- 229910052751 metal Inorganic materials 0.000 claims abstract 11
- 239000002184 metal Substances 0.000 claims abstract 11
- 239000002904 solvent Substances 0.000 claims abstract 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract 8
- 239000000243 solution Substances 0.000 claims abstract 8
- 239000010970 precious metal Substances 0.000 claims abstract 5
- 229910000831 Steel Inorganic materials 0.000 claims abstract 4
- 229910052742 iron Inorganic materials 0.000 claims abstract 4
- 239000010959 steel Substances 0.000 claims abstract 4
- 229910001514 alkali metal chloride Inorganic materials 0.000 claims abstract 3
- 230000000737 periodic effect Effects 0.000 claims abstract 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000001035 drying Methods 0.000 claims abstract 2
- 239000010936 titanium Substances 0.000 claims abstract 2
- 229910052719 titanium Inorganic materials 0.000 claims abstract 2
- 229910052726 zirconium Inorganic materials 0.000 claims abstract 2
- 125000005595 acetylacetonate group Chemical group 0.000 claims 4
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 3
- 229910052707 ruthenium Inorganic materials 0.000 claims 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims 2
- 229910052741 iridium Inorganic materials 0.000 claims 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 2
- 150000002576 ketones Chemical class 0.000 claims 2
- 150000002902 organometallic compounds Chemical class 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- -1 alkali metal chlorate Chemical class 0.000 claims 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- XTEGARKTQYYJKE-UHFFFAOYSA-M chlorate Inorganic materials [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 239000011780 sodium chloride Substances 0.000 claims 1
- 230000003381 solubilizing effect Effects 0.000 claims 1
- 239000011877 solvent mixture Substances 0.000 claims 1
- 238000001354 calcination Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/14—Alkali metal compounds
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- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Chemically Coating (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
Abstract
L'invention concerne un procédé de formation d'un revêtement d'oxydes métalliques comprenant au moins un métal précieux du groupe VIII de la classification des éléments éventuellement associé à du titane et/ou du zirconium sur un substrat électroconducteur en acier ou en fer, qui consiste à appliquer une solution d'acétylacétonates dudit (desdits) métal (métaux) dissout(s) dans un (des) solvant(s) solubilisant spécifiquement chaque acétylacétonate métallique, puis à sécher et calciner le substrat revêtu. L'invention concerne également une cathode activée obtenue à partir du substrat électroconducteur revêtu d'oxydes métalliques et son utilisation po ur l'électrolyse de solutions aqueuses de chlorures de métaux alcalins.
Claims (19)
1. Procédé de formation d'un revêtement d'oxydes métalliques comprenant au moins un métal précieux du groupe VIII de la classification périodique des éléments éventuellement associé à du titane et/ou du zirconium, sur un substrat électroconducteur, ledit procédé consistant à appliquer sur ledit substrat une solution comprenant au moins un composé organométallique puis à transformer ledit (ou lesdits) composé(s) organométallique(s) en oxyde(s) métallique(s) au moyen d'un traitement thermique, ledit procédé étant caractérisé en ce que le substrat électroconducteur est en acier ou en fer et en ce que la seule solution appliquée sur ledit substrat est une solution, non aqueuse, d'acétylacétonate métallique ou d'un mélange d'acétylacétonates métalliques dissout(s) dans un (des) solvant(s) solubilisant spécifiquement chaque acétylacétonate métallique, le (les) solvant(s) étant choisi(s) parmi les alcools, les cétones, les chlorométhanes ou un mélange de deux ou plusieurs solvants ci-dessus mentionnés.
2. Procédé selon la revendication 1, caractérisé en ce que le métal précieux du groupe VIII de la classification périodique des éléments est le ruthénium, le rhodium, le palladium, l'osmium, l'iridium ou le platine.
3. Procédé selon la revendication 2, caractérisé en ce que le métal précieux est le ruthénium ou l'iridium.
4. Procédé selon la revendication 3, caractérisé en ce que le métal précieux est le ruthénium.
5. Procédé selon la revendication 1, caractérisé en ce que l'alcool est l'éthanol ou l'isopropanol.
6. Procédé selon la revendication 1, caractérisé en ce que la cétone est l'acétone.
7. Procédé selon la revendication 1, caractérisé en ce que le chlorométhane est le chloroforme.
8. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la solution d'acétylacétonate métallique est obtenue par dissolution dudit acétylacétonate métallique dans son solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique.
9. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la solution contenant plusieurs acétylacétonates métalliques est obtenue :
- soit par dissolution desdits acétylacétonates métalliques dans un mélange de solvants contenant les solvants spécifiques desdits acétylacétonates métalliques ;
- soit par mélange de solutions ne contenant qu'un seul acétylacétonate métallique obtenues par dissolution dudit acétylacétonate métallique dans un solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique dudit acétylacétonate.
- soit par dissolution desdits acétylacétonates métalliques dans un mélange de solvants contenant les solvants spécifiques desdits acétylacétonates métalliques ;
- soit par mélange de solutions ne contenant qu'un seul acétylacétonate métallique obtenues par dissolution dudit acétylacétonate métallique dans un solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique dudit acétylacétonate.
10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce que, pour obtenir le revêtement d'oxyde(s) métallique(s), on effectue dans une première étape, un prétraitement du substrat en acier ou en fer puis dans une seconde étape, on dépose sur ledit substrat prétraité la solution contenant le (ou les) acétylacétonate(s) métallique(s), on sèche puis on calcine le substrat ainsi revêtu.
11. Procédé selon la revendication 10, caractérisé en ce que le séchage est effectué à une température au plus égale à 150°C.
12. Procédé selon la revendication 10, caractérisé en ce que le substrat revêtu par le (ou les) acétylacétonate(s) métallique(s) est calciné sous air ou bien sous gaz inerte enrichi avec de l'oxygène à une température au moins égale à
300°C et, de préférence, à une température comprise entre 400°C et 600°C
pendant une durée allant de 10 minutes à 2 heures.
300°C et, de préférence, à une température comprise entre 400°C et 600°C
pendant une durée allant de 10 minutes à 2 heures.
13. Procédé selon la revendication 10, caractérisé en ce que la seconde étape est répétée au moins 1 fois et, de préférence, répétée entre 2 et 6 fois.
14. Substrat électroconducteur en acier ou en fer portant un revêtement d'oxydes métalliques formé au moyen d'un procédé selon l'une des revendications 1 à 13.
15. Utilisation du substrat électroconducteur selon la revendication 14 pour l'obtention d'une cathode activée.
16. Utilisation d'une cathode activée selon la revendication 15 pour l'électrolyse de solutions aqueuses de chlorures de métaux alcalins.
17. Utilisation selon la revendication 16, caractérisée en ce que les solutions aqueuses de chlorures de métaux alcalins sont des solutions aqueuses de chlorure de sodium.
18. Procédé de fabrication de chlore et d'hydroxyde de métal alcalin par électrolyse du chlorure correspondant au moyen d'une cathode selon la revendication 15.
19. Procédé de fabrication de chlorate de métaux alcalins par électrolyse du chlorure correspondant au moyen d'une cathode selon la revendication 15.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0303867A FR2852973B1 (fr) | 2003-03-28 | 2003-03-28 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. |
| FR03/03867 | 2003-03-28 | ||
| PCT/FR2004/000746 WO2004087992A2 (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2520584A1 true CA2520584A1 (fr) | 2004-10-14 |
| CA2520584C CA2520584C (fr) | 2011-08-23 |
Family
ID=32947259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2520584A Expired - Fee Related CA2520584C (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US7790233B2 (fr) |
| EP (1) | EP1608795B1 (fr) |
| JP (1) | JP4532471B2 (fr) |
| KR (1) | KR101111369B1 (fr) |
| CN (1) | CN1795291B (fr) |
| AT (1) | ATE330043T1 (fr) |
| BR (1) | BRPI0408905A (fr) |
| CA (1) | CA2520584C (fr) |
| DE (1) | DE602004001230T2 (fr) |
| ES (1) | ES2270380T3 (fr) |
| FR (1) | FR2852973B1 (fr) |
| MX (1) | MXPA05010353A (fr) |
| PL (1) | PL1608795T3 (fr) |
| UA (1) | UA80610C2 (fr) |
| WO (1) | WO2004087992A2 (fr) |
| ZA (1) | ZA200507825B (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006283143A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Printing Co Ltd | 金属酸化物膜の製造方法 |
| GB0714021D0 (en) * | 2007-07-18 | 2007-08-29 | Green Metals Ltd | Improvements in anode materials |
| US8022004B2 (en) * | 2008-05-24 | 2011-09-20 | Freeport-Mcmoran Corporation | Multi-coated electrode and method of making |
| SG174447A1 (en) | 2009-05-26 | 2011-10-28 | Agency Science Tech & Res | Muteins of the pyrroline-5-carboxylate reductase 1 |
| CN102505127A (zh) * | 2011-12-29 | 2012-06-20 | 文广 | 贵金属改性钛阳极材料的制备方法 |
| JP6399083B2 (ja) * | 2014-03-12 | 2018-10-03 | Jsr株式会社 | 多層レジストプロセス用組成物および該多層レジストプロセス用組成物を用いたパターン形成方法 |
| CN106521433A (zh) * | 2015-09-09 | 2017-03-22 | 宁波江丰电子材料股份有限公司 | 环件结构及其加工方法 |
| IT201900020026A1 (it) * | 2019-10-30 | 2021-04-30 | Industrie De Nora Spa | Elettrodo per evoluzione elettrolitica di idrogeno |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3850668A (en) | 1972-06-05 | 1974-11-26 | Johnson Matthey Co Ltd | Impregnation of graphite with ruthenium compounds |
| US4300992A (en) | 1975-05-12 | 1981-11-17 | Hodogaya Chemical Co., Ltd. | Activated cathode |
| US4100049A (en) * | 1977-07-11 | 1978-07-11 | Diamond Shamrock Corporation | Coated cathode for electrolysis cells |
| FR2583781A1 (fr) * | 1985-06-24 | 1986-12-26 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
| FR2596776B1 (fr) * | 1986-04-03 | 1988-06-03 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
| JPH0766816B2 (ja) * | 1989-01-13 | 1995-07-19 | 東洋インキ製造株式会社 | ガス拡散型複合電極の製造方法 |
| EP0848658B1 (fr) * | 1995-08-04 | 2006-10-11 | nGimat Co. | Depot chimique en phase vapeur et formation de poudre par metallisation a chaud avec des solutions fluides quasi surcritiques et surcritiques |
| US5864051A (en) * | 1997-11-10 | 1999-01-26 | Uop | Selective oxidation catalyst process for preparing the catalyst and process using the catalyst |
| JP3383838B2 (ja) * | 1999-02-25 | 2003-03-10 | 独立行政法人産業技術総合研究所 | 金属酸化物の製造方法及び微細パターンの形成方法 |
| FR2797646B1 (fr) * | 1999-08-20 | 2002-07-05 | Atofina | Cathode utilisable pour l'electrolyse de solutions aqueuses |
| US7258899B1 (en) * | 2001-12-13 | 2007-08-21 | Amt Holdings, Inc. | Process for preparing metal coatings from liquid solutions utilizing cold plasma |
| US20040077494A1 (en) * | 2002-10-22 | 2004-04-22 | Labarge William J. | Method for depositing particles onto a catalytic support |
-
2003
- 2003-03-28 FR FR0303867A patent/FR2852973B1/fr not_active Expired - Fee Related
-
2004
- 2004-03-25 CA CA2520584A patent/CA2520584C/fr not_active Expired - Fee Related
- 2004-03-25 WO PCT/FR2004/000746 patent/WO2004087992A2/fr active Application Filing
- 2004-03-25 JP JP2006505751A patent/JP4532471B2/ja not_active Expired - Fee Related
- 2004-03-25 EP EP04742353A patent/EP1608795B1/fr not_active Expired - Lifetime
- 2004-03-25 BR BRPI0408905-7A patent/BRPI0408905A/pt not_active Application Discontinuation
- 2004-03-25 US US10/550,646 patent/US7790233B2/en not_active Expired - Fee Related
- 2004-03-25 UA UAA200510604A patent/UA80610C2/uk unknown
- 2004-03-25 ES ES04742353T patent/ES2270380T3/es not_active Expired - Lifetime
- 2004-03-25 PL PL04742353T patent/PL1608795T3/pl unknown
- 2004-03-25 CN CN2004800147636A patent/CN1795291B/zh not_active Expired - Fee Related
- 2004-03-25 DE DE602004001230T patent/DE602004001230T2/de not_active Expired - Lifetime
- 2004-03-25 MX MXPA05010353A patent/MXPA05010353A/es active IP Right Grant
- 2004-03-25 AT AT04742353T patent/ATE330043T1/de not_active IP Right Cessation
- 2004-03-25 KR KR1020057018365A patent/KR101111369B1/ko not_active IP Right Cessation
-
2005
- 2005-09-27 ZA ZA200507825A patent/ZA200507825B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ES2270380T3 (es) | 2007-04-01 |
| DE602004001230T2 (de) | 2007-04-19 |
| EP1608795A2 (fr) | 2005-12-28 |
| EP1608795B1 (fr) | 2006-06-14 |
| ZA200507825B (en) | 2007-01-31 |
| MXPA05010353A (es) | 2005-12-14 |
| DE602004001230D1 (de) | 2006-07-27 |
| KR20050114265A (ko) | 2005-12-05 |
| ATE330043T1 (de) | 2006-07-15 |
| JP2006521469A (ja) | 2006-09-21 |
| CN1795291B (zh) | 2011-08-31 |
| US20060263614A1 (en) | 2006-11-23 |
| CA2520584C (fr) | 2011-08-23 |
| WO2004087992A2 (fr) | 2004-10-14 |
| PL1608795T3 (pl) | 2006-11-30 |
| KR101111369B1 (ko) | 2012-04-09 |
| FR2852973A1 (fr) | 2004-10-01 |
| JP4532471B2 (ja) | 2010-08-25 |
| FR2852973B1 (fr) | 2006-05-26 |
| WO2004087992A3 (fr) | 2005-02-17 |
| CN1795291A (zh) | 2006-06-28 |
| BRPI0408905A (pt) | 2006-03-28 |
| UA80610C2 (en) | 2007-10-10 |
| US7790233B2 (en) | 2010-09-07 |
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| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20150325 |