BRPI0408905A - processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos - Google Patents

processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos

Info

Publication number
BRPI0408905A
BRPI0408905A BRPI0408905-7A BRPI0408905A BRPI0408905A BR PI0408905 A BRPI0408905 A BR PI0408905A BR PI0408905 A BRPI0408905 A BR PI0408905A BR PI0408905 A BRPI0408905 A BR PI0408905A
Authority
BR
Brazil
Prior art keywords
electrolysis
metal
forming
alkali metal
oxide coating
Prior art date
Application number
BRPI0408905-7A
Other languages
English (en)
Inventor
Francoise Andolfatto
Philippe Joubert
Gerard Duboeuf
Original Assignee
Arkema
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkema filed Critical Arkema
Publication of BRPI0408905A publication Critical patent/BRPI0408905A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
    • C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/04—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1225—Deposition of multilayers of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1241—Metallic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/14—Alkali metal compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Chemically Coating (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)

Abstract

"PROCESSO DE FORMAçãO DE UM REVESTIMENTO DE óXIDOS METáLICOS SOBRE UM SUBSTRATO ELETROCONDUTOR, CATODO ATIVADO QUE RESULTA DELE E SUA UTILIZAçãO PARA A ELETRóLISE DE SOLUçõES AQUOSAS DE CLORETOS DE METAIS ALCALINOS". A invenção refere-se a um processo de formação de um revestimento de óxidos metálicos que compreende pelo menos um metal precioso do grupo VIII da classificação periódica dos elementos eventualmente associado a titânio e/ou zircónio, sobre um substrato eletrocondutor feito de aço ou de ferro, que consiste em aplicar uma solução de acetilacetonatos do dito (dos ditos) metal (metais) dissolvido(s)em um (vários) solvente(s) que solubiliza(m) especificamente cada acetilacetonato metálico, e depois em secar e calcinar o substrato revestido. A invenção também se refere a um catodo ativado obtido a partir do substrato eletrocondutor revestido de óxidos metálicos e a sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos.
BRPI0408905-7A 2003-03-28 2004-03-25 processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos BRPI0408905A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0303867A FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.
PCT/FR2004/000746 WO2004087992A2 (fr) 2003-03-28 2004-03-25 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins.

Publications (1)

Publication Number Publication Date
BRPI0408905A true BRPI0408905A (pt) 2006-03-28

Family

ID=32947259

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0408905-7A BRPI0408905A (pt) 2003-03-28 2004-03-25 processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos

Country Status (16)

Country Link
US (1) US7790233B2 (pt)
EP (1) EP1608795B1 (pt)
JP (1) JP4532471B2 (pt)
KR (1) KR101111369B1 (pt)
CN (1) CN1795291B (pt)
AT (1) ATE330043T1 (pt)
BR (1) BRPI0408905A (pt)
CA (1) CA2520584C (pt)
DE (1) DE602004001230T2 (pt)
ES (1) ES2270380T3 (pt)
FR (1) FR2852973B1 (pt)
MX (1) MXPA05010353A (pt)
PL (1) PL1608795T3 (pt)
UA (1) UA80610C2 (pt)
WO (1) WO2004087992A2 (pt)
ZA (1) ZA200507825B (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283143A (ja) * 2005-03-31 2006-10-19 Dainippon Printing Co Ltd 金属酸化物膜の製造方法
GB0714021D0 (en) * 2007-07-18 2007-08-29 Green Metals Ltd Improvements in anode materials
US8022004B2 (en) * 2008-05-24 2011-09-20 Freeport-Mcmoran Corporation Multi-coated electrode and method of making
SG174447A1 (en) 2009-05-26 2011-10-28 Agency Science Tech & Res Muteins of the pyrroline-5-carboxylate reductase 1
CN102505127A (zh) * 2011-12-29 2012-06-20 文广 贵金属改性钛阳极材料的制备方法
JP6399083B2 (ja) * 2014-03-12 2018-10-03 Jsr株式会社 多層レジストプロセス用組成物および該多層レジストプロセス用組成物を用いたパターン形成方法
CN106521433A (zh) * 2015-09-09 2017-03-22 宁波江丰电子材料股份有限公司 环件结构及其加工方法
IT201900020026A1 (it) * 2019-10-30 2021-04-30 Industrie De Nora Spa Elettrodo per evoluzione elettrolitica di idrogeno

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850668A (en) 1972-06-05 1974-11-26 Johnson Matthey Co Ltd Impregnation of graphite with ruthenium compounds
US4300992A (en) 1975-05-12 1981-11-17 Hodogaya Chemical Co., Ltd. Activated cathode
US4100049A (en) * 1977-07-11 1978-07-11 Diamond Shamrock Corporation Coated cathode for electrolysis cells
FR2583781A1 (fr) * 1985-06-24 1986-12-26 Atochem Cathode pour electrolyse et un procede de fabrication de ladite cathode
FR2596776B1 (fr) * 1986-04-03 1988-06-03 Atochem Cathode pour electrolyse et un procede de fabrication de ladite cathode
JPH0766816B2 (ja) * 1989-01-13 1995-07-19 東洋インキ製造株式会社 ガス拡散型複合電極の製造方法
EP0848658B1 (en) * 1995-08-04 2006-10-11 nGimat Co. Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
US5864051A (en) * 1997-11-10 1999-01-26 Uop Selective oxidation catalyst process for preparing the catalyst and process using the catalyst
JP3383838B2 (ja) * 1999-02-25 2003-03-10 独立行政法人産業技術総合研究所 金属酸化物の製造方法及び微細パターンの形成方法
FR2797646B1 (fr) * 1999-08-20 2002-07-05 Atofina Cathode utilisable pour l'electrolyse de solutions aqueuses
US7258899B1 (en) * 2001-12-13 2007-08-21 Amt Holdings, Inc. Process for preparing metal coatings from liquid solutions utilizing cold plasma
US20040077494A1 (en) * 2002-10-22 2004-04-22 Labarge William J. Method for depositing particles onto a catalytic support

Also Published As

Publication number Publication date
ES2270380T3 (es) 2007-04-01
DE602004001230T2 (de) 2007-04-19
EP1608795A2 (fr) 2005-12-28
CA2520584A1 (fr) 2004-10-14
EP1608795B1 (fr) 2006-06-14
ZA200507825B (en) 2007-01-31
MXPA05010353A (es) 2005-12-14
DE602004001230D1 (de) 2006-07-27
KR20050114265A (ko) 2005-12-05
ATE330043T1 (de) 2006-07-15
JP2006521469A (ja) 2006-09-21
CN1795291B (zh) 2011-08-31
US20060263614A1 (en) 2006-11-23
CA2520584C (fr) 2011-08-23
WO2004087992A2 (fr) 2004-10-14
PL1608795T3 (pl) 2006-11-30
KR101111369B1 (ko) 2012-04-09
FR2852973A1 (fr) 2004-10-01
JP4532471B2 (ja) 2010-08-25
FR2852973B1 (fr) 2006-05-26
WO2004087992A3 (fr) 2005-02-17
CN1795291A (zh) 2006-06-28
UA80610C2 (en) 2007-10-10
US7790233B2 (en) 2010-09-07

Similar Documents

Publication Publication Date Title
KR101201689B1 (ko) 산소 발생용 아노드
ATE292696T1 (de) Kathode für die elektrolyse von wässrigen lösungen
BR0009218B1 (pt) processo para remover ìons nitrato de solução aquosa e processo para a remoção e destruição de ìons nitrato de água.
BRPI0408905A (pt) processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos
MX2019013437A (es) Panel que tiene un revestimiento electricamente conductor, con visibilidad reducida de huellas digitales.
CL2003002095A1 (es) Proceso para el tratamiento galvanoplastico de un metal desde una solucion de electrolito en una celda electrolitica que tiene por lo menos un anodo que comprende formar un revestimiento superior poroso sobre toda la superficie de un revestimiento de
ATE216183T1 (de) Verstärkung von metall-molluskiziden durch ethylendiamindibernsteinsäure (edds)
BRPI0511816A (pt) processo para a produção de peroxodissulfatos em solução aquosa
BR112017025055A2 (pt) eletrodo adequado para a evolução de oxigênio em processos eletrolíticos, e processo de eletrodeposição catódica de metais a partir de uma solução aquosa
NO20052975D0 (no) Nye 2',5'-oligoadenylsyreanaloger.
ATE507001T1 (de) Synthese von edelmetallsulfidkatalysatoren in einer sulfidionenfreien wässrigen umgebung
BR0316833B1 (pt) processo e dispositivo de tratamento dos efluentes de célula de eletrólise para a produção de alumìnio.
BRPI0409985A (pt) revestimento de ánodo de clorato de morfologia de superfìcie lisa
ES2131758T3 (es) Electrodo para procedimiento electroquimico y utilizacion de dicho electrodo.
BR0314350A (pt) Métodos para reduzir o teor de fluoreto em um processo quìmico e para reduzir o teor de fluoreto em um processo de hidroformilação, e, processo quìmico
KR950032716A (ko) 전극 구조물
ES2126228T3 (es) Procedimiento catalitico de deshidroisomerizacion de n-parafinas.
Cheek et al. Electrochemical Investigations of L-Tryptophan
Cheek et al. Electrochemical Studies of Gold in Mops Buffer System
Rodriguez-Falces et al. Corrigendum to" The peak-to-peak ratio of single-fibre potentials is little influenced by changes in the electrode positions close to the muscle fibre"[J. Electromyogr. Kinesiol. 21 (3)(2011) 423-432]
DE69814083D1 (de) Ameisensaeureloesung mit reduziertem korrosionseffekt
Pescovitz Please Dispose of Properly.
Clark et al. Electrochemical Studies of Bismuth/L-Cysteine and Bismuth/L-Glutathione Interactions in Aqueous Buffers
TH67652A (th) การเคลือบแบบอีเล็กโทรคาทาไลติคด้วยโลหะกลุ่มแพลทินัมต่ำและอีเล็กโทรดที่ทำจากสิ่งนั้น
Manríquez et al. Stainless Steel Mesh Modified By Nanoparticulate TiO2-and TiO2/C-Based Composites for Photoassisted Electrochemical Reduction of Aqueous CO2

Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B25G Requested change of headquarter approved

Owner name: ARKEMA (FR)

B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements