CN1692685B - 内装电子部件的组件 - Google Patents

内装电子部件的组件 Download PDF

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Publication number
CN1692685B
CN1692685B CN2003801001779A CN200380100177A CN1692685B CN 1692685 B CN1692685 B CN 1692685B CN 2003801001779 A CN2003801001779 A CN 2003801001779A CN 200380100177 A CN200380100177 A CN 200380100177A CN 1692685 B CN1692685 B CN 1692685B
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China
Prior art keywords
insulating resin
electronic unit
assembly
electrode
substrate
Prior art date
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Expired - Lifetime
Application number
CN2003801001779A
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English (en)
Chinese (zh)
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CN1692685A (zh
Inventor
川本英司
叶山雅昭
胜又雅昭
矢部裕城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003199254A external-priority patent/JP4341321B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority claimed from PCT/JP2003/016427 external-priority patent/WO2004060034A1/ja
Publication of CN1692685A publication Critical patent/CN1692685A/zh
Application granted granted Critical
Publication of CN1692685B publication Critical patent/CN1692685B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2003801001779A 2002-12-24 2003-12-22 内装电子部件的组件 Expired - Lifetime CN1692685B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP372227/2002 2002-12-24
JP2002372227A JP4350366B2 (ja) 2002-12-24 2002-12-24 電子部品内蔵モジュール
JP2003199254A JP4341321B2 (ja) 2003-07-18 2003-07-18 電子部品内蔵モジュール
JP199254/2003 2003-07-18
PCT/JP2003/016427 WO2004060034A1 (ja) 2002-12-24 2003-12-22 電子部品内蔵モジュール

Publications (2)

Publication Number Publication Date
CN1692685A CN1692685A (zh) 2005-11-02
CN1692685B true CN1692685B (zh) 2012-05-23

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CN2003801001779A Expired - Lifetime CN1692685B (zh) 2002-12-24 2003-12-22 内装电子部件的组件

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CN (1) CN1692685B (ja)

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Publication number Priority date Publication date Assignee Title
JP4687196B2 (ja) * 2005-03-30 2011-05-25 住友ベークライト株式会社 配線板
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
US20090002969A1 (en) 2007-06-27 2009-01-01 Rf Micro Devices, Inc. Field barrier structures within a conformal shield
US8053872B1 (en) 2007-06-25 2011-11-08 Rf Micro Devices, Inc. Integrated shield for a no-lead semiconductor device package
US8062930B1 (en) 2005-08-08 2011-11-22 Rf Micro Devices, Inc. Sub-module conformal electromagnetic interference shield
JP2007142355A (ja) * 2005-10-18 2007-06-07 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュール
KR100737098B1 (ko) 2006-03-16 2007-07-06 엘지이노텍 주식회사 전자파 차폐장치 및 그 제조 공정
KR100844790B1 (ko) * 2006-11-29 2008-07-07 엘지이노텍 주식회사 전자파 차폐장치 및 이를 갖는 고주파 모듈과 고주파 모듈제조방법
WO2010007969A1 (ja) * 2008-07-18 2010-01-21 株式会社 村田製作所 部品内蔵モジュールの製造方法及び部品内蔵モジュール
US7829981B2 (en) * 2008-07-21 2010-11-09 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
JP5359146B2 (ja) * 2008-09-19 2013-12-04 株式会社ジェイテクト 多層回路基板
WO2011007519A1 (ja) * 2009-07-16 2011-01-20 パナソニック株式会社 モジュール部品とその製造方法
US9137934B2 (en) 2010-08-18 2015-09-15 Rf Micro Devices, Inc. Compartmentalized shielding of selected components
JP5814928B2 (ja) * 2010-11-04 2015-11-17 アルプス電気株式会社 電子部品モジュール
CN103299410B (zh) * 2011-01-26 2016-01-27 株式会社村田制作所 电子元器件模块及电子元器件单元
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
JP2013157576A (ja) * 2012-02-01 2013-08-15 Nec Corp 回路素子実装構造
US9237686B2 (en) * 2012-08-10 2016-01-12 Panasonic Intellectual Property Management Co., Ltd. Method and system for producing component mounting board
JP5983426B2 (ja) 2013-01-22 2016-08-31 株式会社村田製作所 モジュール基板
US9807890B2 (en) 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
JP5549769B1 (ja) 2013-08-26 2014-07-16 Ｔｄｋ株式会社 モジュール部品の製造方法
JP2015115558A (ja) * 2013-12-13 2015-06-22 株式会社東芝 半導体装置
JP6858642B2 (ja) * 2017-05-25 2021-04-14 三菱電機株式会社 パワーモジュール
CN111386751B (zh) * 2017-11-02 2023-05-16 株式会社村田制作所 电路模块
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094354A (en) * 1996-12-03 2000-07-25 Nec Corporation Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board
CN1348205A (zh) * 2000-10-02 2002-05-08 三洋电机株式会社 电路装置的制造方法
CN1426103A (zh) * 2001-12-14 2003-06-25 矽品精密工业股份有限公司 可设置无源元件的芯片承载件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6094354A (en) * 1996-12-03 2000-07-25 Nec Corporation Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board
CN1348205A (zh) * 2000-10-02 2002-05-08 三洋电机株式会社 电路装置的制造方法
CN1426103A (zh) * 2001-12-14 2003-06-25 矽品精密工业股份有限公司 可设置无源元件的芯片承载件

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