CN1604349A - 发光二极管 - Google Patents

发光二极管 Download PDF

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CN1604349A
CN1604349A CNA2004100832574A CN200410083257A CN1604349A CN 1604349 A CN1604349 A CN 1604349A CN A2004100832574 A CNA2004100832574 A CN A2004100832574A CN 200410083257 A CN200410083257 A CN 200410083257A CN 1604349 A CN1604349 A CN 1604349A
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CN100379039C (zh
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矶田宽人
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Citizen Electronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种发光二极管,包括:具有一对电极部的基板,设于此基板上与上述电极部导通的发光元件、包围此发光元件的周缘且设于此基板上的反射罩以及包覆上述发光元件的树脂密封体,其中在上述基板的上表面与形成突出部而于此突出部的上表面中设置上述发光元件,且将此发光元件的侧面设定于比上述反射罩的下端高的位置处。通过这种结构,能从朝上方向有效地取出从发光元件侧面出射的光。

Description

发光二极管
技术领域
本发明涉及各种电子设备的照明中所用的,特别是最近在汽车的计量仪表照明等之中也能使用的发光二极管,尤其涉及到为了具有指向性而设有反射罩的这种发光二极管。
背景技术
以往的这种发光二极管,例如已知有特开2002-324917号公报中所描述的。此种二极管如图1所示,包括在母板1作表面安装的基板2、设置于此基板2上面的发光元件3、围绕这些发光元件3周围设置的反射罩4、密封这些发光元件3与反射罩4的树脂密封体5、设于此树脂密封体上部的鼓状聚光部件6。
对于这种发光二极管,通过使发光元件3出射的光于反射罩的内周面上反射赋予其朝上方向的指向性,再使这种光经过聚光部件6的透镜部7,则能发出更强的有指向性的光。
但在最近已在探求能把发光元件3出射的光集中于极窄的范围,以很强的功率照射到一点的所谓窄指向性的发光二极管。为了实现这种窄指向性,如图2所示,使反射罩4a的内周面7取加抛物面状且将发光元件3a设于此抛物面的焦点处。这样,从反光元件3a出射的光于反射罩4a的内周面7上反射,能作为朝向上方的平行光取出。于是最好是使接近发光元件3a的反射罩4a下端的四周缘9也尽可能如图3中虚线所示,取定成沿内周面7的抛物面轨迹光滑连续的陡斜面形状10。
但是在用塑料形成上述反射罩4a时,在圆孔8的内周缘9上难以成形出上述的斜面形状10,而在实际上则如图10所示,内周缘9的前端成为倒钝角的形状。特别是在把发光元件3a通过倒装片安装时,由于发光元件3a的发光侧面11的下端部12是在距基板2的上表面数十微米(μm)的极近位置处,上述内周缘9的形状对光的反射会有很大影响,从发光元件3a的发光侧面11出射的光接触到上述下端的内周缘9时就会成为扩散光,结果就难以控制进行狭指向性的发光。此外,上述问题在反射罩4a是由金属材料模压加工形成时也会产生。
发明内容
本发明的目的在于提供这样的发光二极管,它能使从发光元件的发光侧面出射的光不会射向到反射罩的下端部上而抑制散射光,同时能高效地取出朝向上方向的光,特别是能控制进行窄指向性的发光。
为了达到上述目的,本发明的发光二极管是在包括了具有电极部的基板、设于此基板上与上述电极部导通的发光元件,包围此发光元件的周缘且设在此基板上的反射罩以及包覆上述发光元件的树脂密封体的发光二极管中,使之具有下述特征:于上述基板的上表面上形成突出部,在此突出部的上表面上设置上述发光元件,同时将此发光元件的侧面设于较上述反射罩的下端高的位置。
作为本发明的一个例子,可将挠性基板用作上述基板。然后对此基板进行模压成形而形成上述突出部。
作为本发明的又一例子,在上述反射罩的下端形成比上述实出部的平面形状大的开口,此开口周缘则设置于突出部的外周。
作为本发明的再一例子,其特征在于,在上述突出部的上表面中配置的发光元件的正下部分中开设一达到上述基板背面的通孔,在与此通孔相对应的基板的背面侧设有发光元件的下表面出射的光的反射表面。
根据本发明,由于从发光元件侧面出射的光不射向到反射罩的下端面可抑制散射光,因此能高效地取出朝向向上方向的平行光,结果能够获得狭指向性的发光二极管。
附图说明
图1是示明已有的发光二极管的例子的剖面图;
图2是示明已有的发光二极管另一例子的剖面图。
图3是上述图2中所示发光二极管的C部分的放大图。
图4是本发明发光二极管一实施形式的透视图。
图5是沿上述图4所示发光二极管的A-A线的剖面图。
图6是上述图5所示发光二极管的B部分的放大图。
具体实施形式
下面根据附图详细说明本发明的发光二极管的实施形式。图4是示明本发明一实施形式的发光二极管的整体形状的透视图,图5是沿上述图4中A-A线的剖面图,图6是上述图5中B部分的放大图。
如上述图4~6所示,本发明的发光二极管21,作为一个例子包括有:于挠性基片的表面上形成有预定的电极图案的大致正方形的基板22、设置于此基板22上面大致中央部分的发光元件23,围绕此发光元件23周围设置以控制发光元件23出射光的指向性的反射罩24、充填于此反射罩24内的透光性树脂密封体25。
形成于上述基板22上的电极图案,由大致沿中央部分分成左右两半的阴极26与阳极27构成,在此阴极26与阳极27相互面对的中央部中形成了载承上述发光元件23的突起部28、29。上述阴极26与阳极27经由通孔30、31,弯延到基板22的背面侧以与母板(未图示)导通,
在此实施形式中应注意的是,在基板22的大致中央部形成了平截头圆锥的台状突出部32,于此突出部32的上表面33上设置着上述发光元件23。前述阴极26与阳极27沿突出部32的凸形形成,突起部28、29则位于突出部32的中心部上述突出部32是在形成基板22之际于加热了的阳模与阴模之间夹设挠性基片进行模压成形的方法与底板22形成整体。在突出部32的上面33开设有沿上下贯通基板22的弯孔50,弯孔50内充填发光性树脂密封体25。
在与上述穿孔50对应的底板22的背面为了封闭上述弯孔50,设有反射腔51。此反射膜51用作此发光元件23下表面发射出的光的反射面。因此,从发光元件23下表面出射的光便入射到弯孔50之内,为设于弯孔50下方的反射膜51所反射,再次通过弯孔50而能作为向上方的反射光52取出。
设置于上述突出部32的上表面33上的发光元件23可视应用所需选择种之发光色的发光元件,并无特别限制。由设于发光元件23下面的一对焊锡凸块34与35可以实现上述阴极26与阳极27的导通。具体地说,是把发光元件23设置于上述突出部32的上表面33之上,将一对焊锡凸块固定于上述阴极26与阳极27的各突起部28,29之上用来实现导通。这样,通过采用焊锡凸块34、35来谋求发光二极管21的小型化,从而有利于的窄指向性为目的的发光二极管。再有,显然也可取代上述的焊锡凸块34、35而把焊线用作导通装置。
在本实施形式中,环绕上述发光元件23周围设置的反射罩24是由与基板22的外形尺寸大致相同的块状树脂成形体构成。然后于此成形体的上表面中央部中形成大的凹部,于此凹部36的下端开设圆孔37。此圆孔37形成为此上述突出部32的平面形状大的开口,在将反射罩24设于基板22元上时,上述发光元件23与突出部32能露出于圆孔37内。特别是在实施形式中,上述圆孔37的周缘部38相接触地包围突出部32的外周。
上述反射罩24的凹部36,如图4和图5所示,其剖面呈抛物线形状。这样,由于上述圆孔37的内周缘38相接触地包围突出部32的外周,而能使置于突出部32的上表面33中的发光元件23与反射罩24的抛物面的焦点大体一致,于是在这种布置结构的情形下,从发光元件23出射到光不会射向上述圆孔37的内周缘之上,而能由上方的反射罩24的内周面上反射,容易作为朝向上方的平行光取出。
此外,本实施例中的反射罩24是由塑性材料形成,与前述的已与技术例子相同,圆孔37的内周缘38的前端是钝角形状。此外,上述凹部36的内周面上通过蒸镀形成金属膜39,此金属膜39最好运用铝与银等高反射率的易形成镜面的金属材料。
如上所述,取上述结构的反射罩24是通过把块状的树脂成形体的下表面粘合到基板22的上表面上而进行安装的,而这种情形下的上述圆孔37的内周缘38则定位成与基板22的突出部32的外周缘接近。结果,设置于突出部32的上表面33之上的发光元件23便设置在比上述反射罩24的下端高的位置处。
下面据图6说明取上述结构的发光二极管21的反射作用。如图6所示,开设于上述反射罩24下端的圆孔37,其内周缘38也位于发光元件23的光侧面40m下端41的下方位置。因此,从发光元件23的发光侧面40出射的光不会射向反射罩24的圆孔37的内周缘38上,而是于其上方位置与凹部36的内周面上反射,结果从发光元件23的发光侧面40出射的光就能通过反射罩24抑制散射而能有地效作为朝向上方向的平行光取出。
结果也能取得易控制指向性的窄指向性的发光二极管。特别是如此实施形式所示,对于通过将挠性基片经模压成形来形成突出部32时,不必要在基板22之上另设子安装基片,从而可使发光二极管21的结构简易而也可降低部分的制造成本。
再有,在上述实施形式中是就将塑性材料来成形反射罩24的情形进行说明,但显然本发明也适用于由金属材料模压加工成反射罩的情形。此外,在上述实施开式中是就以树脂密封体25充填反射罩24的整个凹部36的情形进行说明,但也可只密封发光元件23与突出部32而消除以树脂密封体25充填上述反射罩24的凹部36。

Claims (4)

1.一种发光二极管,包括:具有电极部的基板,设于此基板上与上述电极部导通的发光元件,包围此发光元件的周缘且设在此基板上的反射罩、包覆上述发光元件的树脂密封体,
其特征在于:在上述基板的上表面之上形成突出部,
在此突出部的上表面上设置上述发光元件,同时将此发光元件的侧面设在较上述反射罩的下端高的位置。
2.根据权利要求1所述的发光二极管,其中上述基板是由挠性基片形成的,通过该挠性基板模压形成上述突出部。
3.根据权利要求1所述的发光二极管,其中上述反射罩的下端中形成比上述突出部的平面形状大的开口,而此开口周缘设在该突出部的外周上。
4.根据权利要求1所述的发光二极管,其中在上述突出部的上表面上设置的发光元件的正下方部分中开设有达到上述基板背面的通孔,而在此通孔对应的基板背侧中设有对从发光元件的下表面出射的光的反射面。
CNB2004100832574A 2003-10-02 2004-09-29 发光二极管 Expired - Fee Related CN100379039C (zh)

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