CN105874620B - 用作完整led封装的深模制反射器杯体 - Google Patents
用作完整led封装的深模制反射器杯体 Download PDFInfo
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Abstract
LED封装在不使用透镜的情况下在非常紧凑的封装中创建窄射束。塑料模制在金属引线框架(12,14)周围以形成模制杯体(26),其中杯体具有从杯体的底部区域延伸到其顶部的抛物面壁。引线框架形成暴露在杯体的底部区域处的第一组电极以用于电气接触一组LED管芯电极(18,20)。引线框架还形成杯体外部的第二组电极以用于连接到电源。反射性金属(28)然后沉积在杯体的弯曲壁上。LED管芯(16)安装在杯体的底部区域处并且电气连接到第一组电极。杯体然后部分地填充有包含磷光体(66)的包封剂(64)。
Description
技术领域
本发明涉及经封装的发光二极管(LED),并且特别地涉及用作针对LED管芯的完整且紧凑的封装的反射性杯体。
背景技术
常见的是将LED管芯安装在印刷电路板(PCB)或其它衬底上以用于将LED的电极电气连接到PCB上的传导迹线。然后,将具有中心孔的模制反射器杯体粘附到PCB并且其围绕LED管芯。杯体然后填充有磷光体混合物或透明材料,并且被固化以包封LED管芯。杯体限制LED管芯的侧面光发射并且将其引导在一般向前的方向上。因此,LED管芯封装是PCB、杯体和包封剂的组合。
在一些情况下,将包含包封剂的半球状透镜粘附在LED管芯之上以改进光提取。这要求杯体中的大中心孔以容纳透镜。
所得到的封装相当大,因为PCB必须延伸超出反射性杯体。另外,存在到封装的多个部分,其要求处置并且其降低封装的可靠性。
使用具有中心孔的模制反射器杯体的另一缺点是面向LED管芯的杯体的内边缘形成短竖直壁,而不是有角度的刃形边缘。刃形边缘不可利用标准模制过程实现。因此,内边缘阻挡一些光而不是将它反射在向前的方向上。
此外,常规反射性杯体相对浅,其产生宽射束,因为杯体的目的仅仅是反射侧面光并且包含包封剂。杯体不用于对射束成形。为了对射束成形,诸如使射束准直,在将杯体粘附到PCB之前,将透镜提供在LED管芯之上。因此,透镜及所添加的处置向封装添加另外的成本。透镜还使光衰减。
浅反射性杯体的一些示例在美国公开2013/0228810中示出,其中杯体被完全填充,并且在一些情况下,透镜模制在杯体和LED管芯之上。
所需要的是在要求准直射束的应用中用于LED管芯的更紧凑、更廉价且更可靠的封装。
发明内容
在本发明的一个示例中,塑料杯体模制在引线框架之上,其中杯体的中心具有用于连接到LED管芯的电极的金属垫。杯体的弯曲壁涂敷有高反射性膜,诸如银或铝。杯体是深的(例如至少5mm)以创建窄准直射束。引线框架可以从塑料杯体的侧面延伸出来,或者引线框架可以引至杯体上的底部电极。引线框架可以是铜以得到良好的电气和热量传导,并且金属垫/电极可以镀有金、具有金凸块、利用焊料润湿,或者以其它方式准备适合用于键合到LED电极和衬底(包括PCB)上的垫。
LED管芯然后安装在杯体的基底上并且电气连接到引线框架。引线框架和杯体材料从LED管芯传导热量。导线键合也可以用于非倒装芯片管芯。
在将LED管芯安装在杯体中之后,杯体部分地填充有包封剂,其可以是透明的或磷光体混合物。包封剂然后被固化。
由于杯体不具有中心孔,所以其可以被容易地模制使得不存在阻挡光或者将光反射回到管芯中的靠近LED管芯的壁的竖直部分。入射在反射性壁上的所有光被反射在向前的方向上。
因而,整个封装是反射性杯体的大小的单个单元。深杯体用于对射束成形,因此不需要透镜。封装由于其是单个件而具有高可靠性。
描述了其它实施例。
附图说明
图1是依照本发明的一个实施例的安装在模制到深反射性杯体中的引线框架上的倒装芯片LED管芯的截面视图。
图2是依照本发明的另一实施例的安装在模制到深反射性杯体中的引线框架上的经导线键合的LED管芯的截面视图。
图3是依照本发明的另一实施例的安装在模制到深反射性杯体中的引线框架上的倒装芯片LED管芯的截面视图,其中引线框架形成杯体的底部垫。
图4是依照本发明的另一实施例的安装在模制到深反射性杯体中的引线框架上的经导线键合的LED管芯的截面视图,其中引线框架形成杯体的底部垫。
图5是图1-4的实施例中的任一个的杯体部分的自顶向下视图,其示出杯体中的键合垫的位置和杯体内的LED管芯的位置。
图6图示了在将磷光体混合物或透明混合物沉积在杯体中以包封LED管芯之后的图1的杯体和LED管芯。
图7图示了在将磷光体混合物或透明混合物沉积在杯体中以包封LED管芯之后的图3的杯体和LED管芯。
图8是针对400-750nm之间的任何LED管芯波长的光强度与角度分布的关系,其图示了以图1-7的深杯体得到的相对窄的射束。
相同或类似的元件以相同的标号标记。
具体实施方式
图1图示了依照本发明的一个实施例的反射性杯体封装10。铜引线框架从一个或多个片压印以形成封装10的引线12和14。可以存在连接在一起的引线框架的阵列以简化封装的处理,并且在形成封装之后切割引线框架以分离出各个封装。
其中引线12和14要键合到LED管芯16电极18和20的区域可以镀有适当的金属,诸如金或合金,以形成键合垫22和24。金球、焊料润湿或其它技术(如果要求的话)也可以用于允许键合到管芯电极18/20。用于电气连接的引线框架的任何部分在本文中称为键合垫或电极,无论连接是通过焊料、超声焊接、导线键合、传导性环氧树脂等。
在引线框架之上模制塑料杯体26。等同的塑料杯体同时模制在阵列中的每一个引线框架之上。可以使用压缩模制或者注射模制。优选地,塑料是热学传导的。如果塑料也是电气传导的,例如由于包含金属颗粒(用于增加其热学传导性),则与塑料接触的引线框架的部分具有在模制步骤之前形成于其之上的电介质涂层(没有单独示出)。
杯体26一般形成与LED 16的顶部发光表面的平面正交的抛物线体,其具有平行于LED 16的顶部发光表面的平面的圆形截面,诸如在图5中示出。形状也可以是复合抛物面聚光器(CRC)。在一个实施例中,杯体26的抛物线体部分为大约5mm深,其顶部开口的直径为大约6-7mm,并且其用于LED管芯16的底部表面平坦区域的直径为大约1-2mm。杯体26从其底部表面向其顶部边缘向上倾斜以一般向上反射所有LED管芯光。杯体越深,射束就越窄,因此射束形状由杯体形状而不是任何透镜来确定。在优选实施例中,不使用透镜。
杯体26的内侧表面然后通过溅射、蒸镀、喷涂或其它过程涂敷有反射性材料28,诸如银或铝膜。反射对于最窄射束可以是镜面的或者对于较宽射束可以是漫射性的(诸如通过使用白漆)。掩蔽过程可以用于确保该键合垫22/24不通过反射材料28短接或涂敷。在可替换方案中,反射性材料可以从键合垫22/24移除并且然后镀有金或任何其它适当的材料。
在另一实施例中,反射性膜是调谐到LED管芯发射的二色性涂层。掩蔽过程可以用于确保电极不涂敷有反射性材料28或可替换的二色性涂层。
倒装芯片LED管芯16的底部电极18/20然后键合到形成于引线12和14的端部处的键合垫22/24。键合可以是通过超声焊接、焊料、焊料膏、传导性环氧树脂或通过其它手段。LED管芯典型地是方形并且每一侧的量级为0.5-1mm。引线12和14形成阳极和阴极引线以用于连接到电源。
取决于应用,引线12和14的外端部可以焊接到印刷电路板(PCB)或其它衬底上的金属垫以向LED管芯16供应电力。从LED管芯16发射的光线30被示出在向前的方向上反射离开杯体26的壁。来自LED管芯16的侧壁的任何光线将类似地由杯体26向上反射。
来自LED管芯16的热量通过LED管芯16、引线12和14以及封装10之上的空气的组合而移除。封装10的底部表面32可以使用热学传导膏而热学耦合到衬底。衬底和/或杯体26可以具有充当热沉的铝核(未示出)。
图5图示了键合垫22和24相对于LED管芯16(通过虚线示出为透明的)的位置。键合垫22和24可以如LED管芯16那么宽或者比它宽。图1中的引线12/14可以比LED管芯16宽得多以更好地从LED管芯降低热量。
图2图示了类似于图1的封装36,但是LED管芯38具有经由导线42导线键合到引线40的键合垫的顶部电极。LED管芯38具有键合到引线44的键合垫的底部电极以得到良好的热学和电气传导性。杯体26否则相同。
LED管芯可以是具有两个顶部电极的类型,并且两个电极导线键合到引线的键合垫。LED管芯的底部热学垫将使用热学传导性环氧树脂而热学键合到杯体26的塑料基底。
在图1和2中,引线12/14或40/44的宽度可以至少如LED管芯那么宽,诸如2mm宽或更大,以提供到衬底(例如PCB)的良好热学路径。
图3图示了用于封装48的电极图案,其中在将塑料杯体54模制在引线框架周围之后,引线框架形成底部键合垫50和52。引线的顶部和底部表面可以镀有金或其它金属以增强到LED管芯16电极和衬底电极的键合。可以使用金球、焊料或其它键合技术而不是镀层。图3示出形成在引线框架的顶部表面上的顶部键合垫56和57。底部电极50和52可以延伸封装48的整个宽度以最大化与衬底的热学接触。相比于图1的封装10,封装48提供LED管芯16与衬底之间的更好热学传导。
在图5中示出的键合垫配置也可以应用于图3。
图4图示了类似于图3的封装58,但是LED管芯38的顶部电极通过导线42连接到顶部键合垫60。
LED管芯也可以具有导线键合到引线框架的顶部键合垫的两个顶部电极,并且LED管芯的底部热学垫通过热学传导性环氧树脂而热学耦合到封装48或58。
图6和7图示了在安装于杯体中之后包封的封装10和48中的LED管芯16。相同包封也可以使用在封装36和58中。包封保护LED管芯16并且通过典型地具有LED管芯材料(例如GaN)与空气之间的折射率而改进光提取。为了波长转换,包封剂64可以是注入有磷光体粉末(诸如YAG磷光体或红色和绿色磷光体)的硅树脂结合剂。如果LED管芯16发射蓝光,则一些蓝光将泄漏并与磷光体光组合以产生白光。可以通过磷光体的选择生成任何颜色。磷光体颗粒66被示出发射黄色光线68,其与LED管芯的蓝色光线30混合以创建白光。
包封剂64可以替代地为透明或漫射的。可以使用硅树脂。漫射材料可以是硅树脂中的TiO2(白色)颗粒。
磷光体甚至可以是在沉积包封剂64之前覆盖LED管芯16的分离层。
相比于图6和7,用于约束侧面光的现有技术浅杯体典型地由于杯体的非常小的体积而完全填充有包封剂。透镜然后典型地安装在浅杯体之上。
图6和7还示出键合(例如焊接)到衬底76/78(诸如PCB)上的相应垫或迹线70-73的引线12/14和底部垫50/52。衬底76/78可以具有金属核(未示出)以用于传导热量离开LED管芯16。
在另一实施例中,引线从封装的单个侧面延伸并且形成用于插座或其它类型的阴型连接器的阳型连接器(电极)。
图8是具有抛物面反射性壁的5mm深杯体的光强度与角度分布的关系。y轴上的单位表达相对通量而不是绝对值。射束定义非常明确、窄并且关于LED管芯的中心轴对称(在90度处)。射束可以通过杯体而不是透镜来成形。还预想到具有大于5mm的深度的杯体以得到较窄的射束。通过使用深杯体封装,甚至可以使用低功率LED来生成非常明亮但窄的射束。
考虑到杯体必须具有针对所期望的光发射的某些尺寸,所得到的封装基本上是可能的最小的大小。
如果塑料杯体由白色塑料形成,则不要求反射性膜沉积在杯体壁上,如果期望漫反射的话。
尽管已经在可模制材料的示例中使用塑料,但是可以将任何其它适当的可模制材料用于杯体。
虽然已经示出和描述了本发明的特定实施例,但是对本领域技术人员将显而易见的是,可以做出改变和修改而不脱离以其较宽方面的本发明,并且因此,随附权利要求要在其范围内涵盖如落在本发明的真实精神或范围内的所有这样的改变和修改。
Claims (11)
1.一种发光器件,包括:
形成多个键合垫和多个引线的全金属引线框架,每一个键合垫耦合到不同的一个引线,每一个键合垫具有第一宽度,并且每一个引线具有大于第一宽度的第二宽度;
模制在引线框架上以形成模制杯体的第一材料,杯体包括从布置成暴露键合垫的杯体的底部区域延伸的竖直弯曲壁;
在所述多个键合垫之上设置在杯体的底部区域上的倒装芯片LED管芯,LED管芯包括电极集合,每一个电极电气连接到不同的一个键合垫,LED管芯具有小于或等于每一个键合垫的第一宽度的宽度;
部分地填充杯体的包封剂,使得从LED管芯发射的至少一些光反射离开包封剂上方的杯体的壁,
第一材料、引线框架和包封剂形成用于LED管芯的封装。
2.权利要求1所述的器件,其中杯体具有至少5mm的深度。
3.权利要求1所述的器件,其中杯体的内部表面涂敷有金属膜涂层。
4.权利要求1所述的器件,其中第一材料是反射性的。
5.权利要求1所述的器件,其中LED管芯的电极直接连接到引线框架的键合垫。
6.权利要求1所述的器件,其中:
每一个键合垫与不同的一个引线一体形成;
LED管芯小于2mm宽,并且第二宽度大于2mm。
7.权利要求1所述的器件,其中包封剂包括磷光体。
8.一种形成发光器件的方法,包括:
将第一材料模制在全金属引线框架上以形成模制杯体,其中模制杯体具有从杯体的底部区域延伸到杯体的顶部的竖直弯曲壁,引线框架形成多个键合垫和多个引线,每一个键合垫耦合到不同的一个引线,每一个键合垫具有第一宽度,并且每一个引线具有大于第一宽度的第二宽度;
在所述多个键合垫之上在杯体的底部区域上安装倒装芯片LED管芯,并且将LED管芯的多个电极中的每一个电气连接到不同的一个键合垫,LED管芯具有小于或等于每一个键合垫的第一宽度的宽度;
利用包封剂部分地填充杯体使得从LED管芯发射的至少一些光反射离开包封剂上方的杯体的壁,
模制杯体、引线框架和包封剂形成用于LED管芯的封装。
9.权利要求8所述的方法,还包括在杯体的弯曲壁上沉积反射性材料以用于在杯体的顶部的方向上反射光。
10.权利要求8所述的方法,其中杯体具有至少5mm的深度。
11.权利要求8所述的方法,其中:
每一个键合垫与不同的一个引线一体形成;
LED管芯小于2mm宽,并且第二宽度大于2mm。
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