JP2005109382A - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP2005109382A JP2005109382A JP2003344096A JP2003344096A JP2005109382A JP 2005109382 A JP2005109382 A JP 2005109382A JP 2003344096 A JP2003344096 A JP 2003344096A JP 2003344096 A JP2003344096 A JP 2003344096A JP 2005109382 A JP2005109382 A JP 2005109382A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- base substrate
- light
- emitting element
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010137 moulding (plastic) Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 101150038956 cup-4 gene Proteins 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
【解決手段】 一対の電極部26,27を有するベース基板22と、このベース基板22上に配置され前記電極部26,27と導通する発光素子23と、この発光素子23の周囲を取り囲むようにしてベース基板22上に設置される反射カップ24と、前記発光素子を被覆する樹脂封止体25とを備えてなる発光ダイオード21において、前記ベース基板22の上面に突出段部32を形成し、この突出段部32の上面に前記発光素子23を配置し、この発光素子23の側面40を前記反射カップ24の下端より高い位置に設定した。
【選択図】 図1
Description
22 ベース基板
23 発光素子
24 反射カップ
25 樹脂封止体
26 カソード電極(電極部)
27 アノード電極(電極部)
32 突出段部
33 突出段部の上面
37 円孔(開口)
38 円孔の内周縁(開口周縁)
40 発光側面(側面)
Claims (4)
- 電極部を有するベース基板と、このベース基板上に配置され前記電極部と導通する発光素子と、この発光素子の周囲を取り囲むようにしてベース基板上に設置される反射カップと、前記発光素子を被覆する樹脂封止体とを備えてなる発光ダイオードにおいて、
前記ベース基板の上面に突出段部を形成し、この突出段部の上面に前記発光素子を配置し、この発光素子の側面を前記反射カップの下端より高い位置に設定したことを特徴とする発光ダイオード。 - 前記ベース基板がフレキシブル基板によって形成され、このフレキシブル基板をプレス成形することによって前記突出段部を形成してなる請求項1記載の発光ダイオード。
- 前記反射カップの下端には、前記突出段部の平面形状より大きい開口が形成され、この開口周縁が突出段部の外周に設置されてなる請求項1記載の発光ダイオード。
- 前記突出段部の上面に配置された発光素子の真下部分に前記ベース基板の裏面まで達する貫通孔を開設し、この貫通孔に対応するベース基板の裏面側に発光素子の下面から出射した光の反射面を設けてなる請求項1記載の発光ダイオード。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344096A JP4288481B2 (ja) | 2003-10-02 | 2003-10-02 | 発光ダイオード |
DE102004046994A DE102004046994A1 (de) | 2003-10-02 | 2004-09-28 | Lichtemittierende Diode |
CNB2004100832574A CN100379039C (zh) | 2003-10-02 | 2004-09-29 | 发光二极管 |
US10/953,576 US7042021B2 (en) | 2003-10-02 | 2004-09-30 | Light emitting diode with reflection cup |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344096A JP4288481B2 (ja) | 2003-10-02 | 2003-10-02 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005109382A true JP2005109382A (ja) | 2005-04-21 |
JP4288481B2 JP4288481B2 (ja) | 2009-07-01 |
Family
ID=34537834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003344096A Expired - Fee Related JP4288481B2 (ja) | 2003-10-02 | 2003-10-02 | 発光ダイオード |
Country Status (4)
Country | Link |
---|---|
US (1) | US7042021B2 (ja) |
JP (1) | JP4288481B2 (ja) |
CN (1) | CN100379039C (ja) |
DE (1) | DE102004046994A1 (ja) |
Cited By (15)
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JP2005191446A (ja) * | 2003-12-26 | 2005-07-14 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びこれを具えた発光デバイス |
JP2006156462A (ja) * | 2004-11-25 | 2006-06-15 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
JP2006351809A (ja) * | 2005-06-15 | 2006-12-28 | Matsushita Electric Works Ltd | 発光装置 |
JP2007329374A (ja) * | 2006-06-09 | 2007-12-20 | Toyoda Gosei Co Ltd | 発光装置及び液晶表示用バックライト装置 |
JP2008004640A (ja) * | 2006-06-20 | 2008-01-10 | Toyoda Gosei Co Ltd | 発光装置 |
JP2010537400A (ja) * | 2007-08-16 | 2010-12-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 薄型の側面発光ledに連結される光学要素 |
US8008674B2 (en) | 2006-05-29 | 2011-08-30 | Toyoda Gosei Co., Ltd. | Light emitting device and LCD backlighting device |
WO2012014372A1 (ja) * | 2010-07-26 | 2012-02-02 | 株式会社小糸製作所 | 発光モジュール |
JP2012222304A (ja) * | 2011-04-13 | 2012-11-12 | Asahi Glass Co Ltd | Ledモジュールおよびledランプ |
JP2016115934A (ja) * | 2014-12-11 | 2016-06-23 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
JP2017502523A (ja) * | 2014-01-08 | 2017-01-19 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 完成したledパッケージとして使用される深い成形リフレクタカップ |
US9698312B2 (en) | 2013-12-17 | 2017-07-04 | Nichia Corporation | Resin package and light emitting device |
JP2017201729A (ja) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | 側面発光型発光装置 |
CN107646145A (zh) * | 2015-05-29 | 2018-01-30 | 奥斯兰姆奥普托半导体有限责任公司 | 具有辐射源的光电子组件 |
JP2019050379A (ja) * | 2012-08-31 | 2019-03-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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KR100592508B1 (ko) * | 2005-07-15 | 2006-06-26 | 한국광기술원 | 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지 |
US7943946B2 (en) * | 2005-11-21 | 2011-05-17 | Sharp Kabushiki Kaisha | Light emitting device |
US20090045423A1 (en) * | 2006-01-13 | 2009-02-19 | Takashi Hashimoto | Semiconductor light-emitting device |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
US7618163B2 (en) * | 2007-04-02 | 2009-11-17 | Ruud Lighting, Inc. | Light-directing LED apparatus |
JP5692952B2 (ja) | 2007-12-11 | 2015-04-01 | シチズン電子株式会社 | 発光ダイオード |
WO2009119461A1 (ja) * | 2008-03-26 | 2009-10-01 | 島根県 | 半導体発光モジュールおよびその製造方法 |
US8348475B2 (en) | 2008-05-23 | 2013-01-08 | Ruud Lighting, Inc. | Lens with controlled backlight management |
US8388193B2 (en) * | 2008-05-23 | 2013-03-05 | Ruud Lighting, Inc. | Lens with TIR for off-axial light distribution |
US9423096B2 (en) | 2008-05-23 | 2016-08-23 | Cree, Inc. | LED lighting apparatus |
US7841750B2 (en) | 2008-08-01 | 2010-11-30 | Ruud Lighting, Inc. | Light-directing lensing member with improved angled light distribution |
TWI366292B (en) * | 2008-12-26 | 2012-06-11 | Ind Tech Res Inst | Flexible light source device and fabricating method of thereof |
US9255686B2 (en) | 2009-05-29 | 2016-02-09 | Cree, Inc. | Multi-lens LED-array optic system |
CN105177795B (zh) | 2009-07-02 | 2019-05-14 | 盖茨公司 | 改善的用于齿动力传动带的织物和带 |
CN201487668U (zh) * | 2009-09-09 | 2010-05-26 | 珠海晟源同泰电子有限公司 | 集束组合led照明光源 |
TWM399313U (en) * | 2010-07-30 | 2011-03-01 | Sigurd Microelectronics Corp | Proximity sensor package structure |
US9541258B2 (en) | 2012-02-29 | 2017-01-10 | Cree, Inc. | Lens for wide lateral-angle distribution |
US9541257B2 (en) | 2012-02-29 | 2017-01-10 | Cree, Inc. | Lens for primarily-elongate light distribution |
US10408429B2 (en) | 2012-02-29 | 2019-09-10 | Ideal Industries Lighting Llc | Lens for preferential-side distribution |
USD697664S1 (en) | 2012-05-07 | 2014-01-14 | Cree, Inc. | LED lens |
CN103000785A (zh) * | 2012-11-05 | 2013-03-27 | 何忠亮 | 一种led发光结构及其制作方法 |
JP6751562B2 (ja) * | 2013-01-10 | 2020-09-09 | ルミレッズ ホールディング ベーフェー | 側方放射用に成形された成長基板を有するled |
USD718490S1 (en) | 2013-03-15 | 2014-11-25 | Cree, Inc. | LED lens |
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US9523479B2 (en) | 2014-01-03 | 2016-12-20 | Cree, Inc. | LED lens |
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US3821775A (en) * | 1971-09-23 | 1974-06-28 | Spectronics Inc | Edge emission gaas light emitter structure |
US5534718A (en) * | 1993-04-12 | 1996-07-09 | Hsi-Huang Lin | LED package structure of LED display |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP2000269551A (ja) * | 1999-03-18 | 2000-09-29 | Rohm Co Ltd | チップ型発光装置 |
JP2002324917A (ja) * | 2001-04-26 | 2002-11-08 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
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-
2003
- 2003-10-02 JP JP2003344096A patent/JP4288481B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-28 DE DE102004046994A patent/DE102004046994A1/de not_active Ceased
- 2004-09-29 CN CNB2004100832574A patent/CN100379039C/zh not_active Expired - Fee Related
- 2004-09-30 US US10/953,576 patent/US7042021B2/en not_active Expired - Fee Related
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JP2006156462A (ja) * | 2004-11-25 | 2006-06-15 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
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JP2006351809A (ja) * | 2005-06-15 | 2006-12-28 | Matsushita Electric Works Ltd | 発光装置 |
JP2017201729A (ja) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | 側面発光型発光装置 |
US10243112B2 (en) | 2006-05-11 | 2019-03-26 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US10580943B2 (en) | 2006-05-11 | 2020-03-03 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US8008674B2 (en) | 2006-05-29 | 2011-08-30 | Toyoda Gosei Co., Ltd. | Light emitting device and LCD backlighting device |
JP2007329374A (ja) * | 2006-06-09 | 2007-12-20 | Toyoda Gosei Co Ltd | 発光装置及び液晶表示用バックライト装置 |
JP2008004640A (ja) * | 2006-06-20 | 2008-01-10 | Toyoda Gosei Co Ltd | 発光装置 |
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JP2012222304A (ja) * | 2011-04-13 | 2012-11-12 | Asahi Glass Co Ltd | Ledモジュールおよびledランプ |
JP2019050379A (ja) * | 2012-08-31 | 2019-03-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US9698312B2 (en) | 2013-12-17 | 2017-07-04 | Nichia Corporation | Resin package and light emitting device |
JP2017502523A (ja) * | 2014-01-08 | 2017-01-19 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 完成したledパッケージとして使用される深い成形リフレクタカップ |
JP2016115934A (ja) * | 2014-12-11 | 2016-06-23 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
CN107646145A (zh) * | 2015-05-29 | 2018-01-30 | 奥斯兰姆奥普托半导体有限责任公司 | 具有辐射源的光电子组件 |
JP2018517292A (ja) * | 2015-05-29 | 2018-06-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス部品 |
Also Published As
Publication number | Publication date |
---|---|
CN100379039C (zh) | 2008-04-02 |
US7042021B2 (en) | 2006-05-09 |
US20050263786A1 (en) | 2005-12-01 |
JP4288481B2 (ja) | 2009-07-01 |
CN1604349A (zh) | 2005-04-06 |
DE102004046994A1 (de) | 2005-06-09 |
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