CN1585125A - 电路装置 - Google Patents

电路装置 Download PDF

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Publication number
CN1585125A
CN1585125A CNA2004100545279A CN200410054527A CN1585125A CN 1585125 A CN1585125 A CN 1585125A CN A2004100545279 A CNA2004100545279 A CN A2004100545279A CN 200410054527 A CN200410054527 A CN 200410054527A CN 1585125 A CN1585125 A CN 1585125A
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China
Prior art keywords
lead
wire
semiconductor element
circuit arrangement
metal fine
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CN100474579C (zh
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坪野谷诚
涩泽克彦
北泽崇
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Kanto Sanyo Semiconductors Co Ltd
Semiconductor Components Industries LLC
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Northeast Sanyo Semi-Conductive Co Ltd
Sanyo Electric Co Ltd
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Publication of CN1585125A publication Critical patent/CN1585125A/zh
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Publication of CN100474579C publication Critical patent/CN100474579C/zh
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Abstract

提供一种具有引线而且在内部构成电路的电路装置。该电路装置(10)具有：第一半导体元件(13A)及第二半导体元件(13B)；第一引线(11A)，经金属细线(15A)与第一半导体元件(13A)或第二半导体元件(13B)电连接，其端部导出到外部；以及第二引线(11B)，经金属细线(15C)连接在第一半导体元件(13A)及第二半导体元件(13B)两者上，电连接第一及第二半导体元件(13A、13B)。

Description

电路装置
技术领域
本发明涉及电路装置，该电路装置具有作为外部端子而延伸到外部的引线。
背景技术
参照图5，说明现有类型的电路装置100的结构。图5(A)是电路装置100的平面图，图5(B)是其剖视图(请参照专利文献1)。
参照图5(A)及图5(B)，在电路装置100的中央部形成由导电材料组成的焊接区(ランド)102，多个引线101的一端接近焊接区102的周围。引线101的一端经金属细线105与半导体元件104电连接，另一端从密封树脂103中露出。密封树脂103具有将半导体元件104、焊接区102及引线101进行密封并一体支持的作用。
【专利文献1】
(日本)特开平11-340257号公报
然而，在上述电路装置100中，引线101只具有使半导体元件104的电极电延伸到外部的作用，不能用该引线101形成再布线部等。由此，有下述问题：不能用引线101在电路装置内部构成复杂的电路。
发明内容
本发明鉴于上述问题而提出，本发明的主要目的在于提供一种具有引线而且在内部构成电路的电路装置。
本发明的特征在于，具有：多个半导体元件；第一引线组，与上述半导体元件的键合焊盘连接并导出到封装的外部而构成外部端子；以及第二引线组，在上述封装内部，将上述多个半导体元件之间进行连接。
本发明的特征在于，具有：第一半导体元件及第二半导体元件；第一引线，经金属细线与上述第一半导体元件或上述第二半导体元件电连接，其端部导出到外部；以及第二引线，在上述第一半导体元件及上述第二半导体元件两者上经金属细线进行电连接，将上述第一及上述第二半导体元件电连接。
再者，本发明的特征在于，具有：第一引线；第二引线，接近上述第一引线的一方来延伸，设有向上方突出的第一台阶差部；第三引线，接近上述第一引线的另一方来延伸，设有向上方突出的第二台阶差部；以及片状元件，经钎料固定在上述第一台阶差部及上述第二台阶差部上，横跨上述第一引线。
再者，本发明的特征在于，具有：第一电路元件；第一引线，经第一金属细线与上述第一电路元件电连接，其端部导出到外部；第二引线，经第二金属细线与上述第一引线连接；以及第二电路元件，被电连接在上述第二引线上。
再者，本发明具有：岛；第一引线，具有经一端接近上述岛的周围而设的内引线，将另一端从密封树脂突出而成的外引线；以及半导体元件，被设在上述岛上；其特征在于，具有：布线引线，该引线从由上述密封树脂组成的封装的一侧边上的一区域延伸到上述封装的内部，从上述内部延伸到上述封装的一侧边上的另一区域；经上述布线引线，将上述封装内密封的、与上述半导体元件不同的其他电路元件和上述半导体元件进行电连接。
再者，本发明具有：多个岛；第一引线，具有经一端接近上述多个岛的周围而设的内引线，将另一端从密封树脂突出而成的外引线；以及半导体元件，分别被设在上述多个岛上；其特征在于，具有：布线引线，该布线从由上述密封树脂组成的封装的一侧边上的一区域在上述多个岛的近旁延伸，从上述近旁延伸到上述封装的一侧边上的另一区域；经上述布线引线，与上述封装内密封的上述多个半导体元件电连接。
附图说明
图1是说明本发明的电路装置的平面图。
图2是说明本发明的电路装置的平面图。
图3是说明本发明的电路装置的剖视图(A)-(D)。
图4是说明本发明的电路装置的平面图(A)、剖视图(B)。
图5是说明现有的电路装置的平面图(A)、剖视图(B)。
具体实施方式
本发明涉及具有能在封装内连线的引线、实现所谓的SIP(single in-linepackage)的技术。
一般地，引线框架具有一个或两个左右的岛，在其周围，配置着一端接近岛的内引线，以及形成为电极、作为外引线从封装突出到外部的一系列引线。然后在各个岛上，设置半导体芯片，在半导体芯片的各个电极上，为了使输入/输出信号通过而采用上述引线。即，不是为了半导体元件间的连接而采用上述引线。
但是有两个例外。第一是半导体元件叠层而成的叠层型多芯片封装，第二是在岛和岛之间设有桥的平面型多芯片封装。
在第一的叠层型中，引线被有效用于半导体元件间的连接。但是该引线被用作外引线电极。而在第二的平面型多芯片中，在岛间配置桥，用该桥来电连接。它用于连接相互对置的半导体芯片的侧边上所设的各电极。该桥例如用粘接片粘贴保持。
例如在图1中，本申请的要点是具有钩括弧状的第二引线，将该引线作为布线有效使用。在图1中为了连接多个半导体元件、在图4中为了连接半导体元件和无源元件，都采用了引线。该引线本来并不与安装板上的电极电连接。因此，在封装内部，设置于岛的周围即可，形状没有限制。
这里，考虑到第二引线的脱落，为了能够用上下的金属型来保持，呈钩括弧状来配置。此外，如果采用胶带，则不必是钩括弧状。在本发明中，所谓内引线，是指具有电连接各电路元件的作用的引线。此外，在本发明中，所谓引线，除了以下实施例所示的框状的引线，还包含安装板上形成的导电图形等。
参照图1，来说明本发明的电路装置的详细结构。图1是说明本发明的电路装置10的平面图。参照该图，电路装置10具有：第一半导体元件13A及第二半导体元件13B；第一引线11A，经金属细线15A与第一半导体元件13A或第二半导体元件13B电连接，其端部导出到外部；以及第二引线11B，经金属细线15C连接在第一半导体元件13A及第二半导体元件13B两者上，电连接第一及第二半导体元件13A、13B。以下说明上述各构件。
第一半导体元件13A例如是LSI(Large Scale Integration，大规模集成电路)芯片，经粘接剂固定在电路装置10的中央部附近所设的第一岛12A上。这里使用的粘接剂可以按照用途来区分使用焊锡或导电胶等导电性的粘接剂、或树脂造的绝缘性的粘接剂这两者。
第二半导体元件13B例如是与上述第一半导体元件13A相同的LSI芯片，被固定在与第一岛12A相连的第二岛12B上。此外，上述两个岛也可以电分离。
第一岛12A及第二岛12B通过冲压或蚀刻而形成薄导电箔来形成。此外，第一岛12A和第二岛12B经连结部18相连。在纸面上，位于上方的第一岛12A的吊线(吊りリ—ド)从第一岛12A的上部左右角部延伸到电路装置的上部左右角部。再者，在纸面上，位于下方的第二岛12B的吊线19从第二岛12B的下部左右角部延伸到电路装置的下部左右角部。该吊线19具有在电路装置10的制造工序中机械支承第一岛12A及第二岛12B的作用。
第一引线11A的一端经金属细线15A与第一半导体元件13A或第二半导体元件13B连接。第一引线11A的另一端从密封整体的密封树脂16导出到外部，起与外部输入输出电信号的外部端子的作用。
第二引线11B经金属细线15C与第一半导体元件13A电连接，并且经金属细线15C与第二半导体元件13B电连接。因此，第一半导体元件13A和第二半导体元件13B经金属细线15C及第二引线11B电连接。在纸面上，第一及第二半导体元件13A、13B沿上下方向排列而配置在电路装置10的中央部附近。从左右方向夹着排列的第一及第二半导体元件13A、13B，在侧方沿上下方向延伸着多根第二引线11B。这里，用阴影来表示第二引线11B。即，夹着第一及第二半导体元件13A、13B，沿第一及第二半导体元件13A、13B排列的方向，延伸着第二引线11B。此外，第二引线11B的两端从密封树脂16延伸到外部。
第三引线11C在电路装置10内部不与其他构件电连接，其端部从密封树脂16导出到外部。此外，在电路装置10的周边部，上述第一至第三引线的端部大致等间隔地导出而形成端子部。这里，在纸面上的电路装置10的左右端部的第二引线11B所夹的区域上，设有多个第三引线11C。
密封树脂16具有覆盖第一及第二半导体元件13A、13B、引线11、及金属细线15并支持整体的作用。此外，可以使引线11的背面露出，也可以用密封树脂16覆盖包含引线11的背面在内的整体。
本发明的要点在于采用了电连接各半导体元件的第二引线11B。下面说明采用第二引线11B的好处。这里，第一及第二半导体元件13A、13B对置的边上所设的电极之间用金属细线15B直接电连接。然而，难以只用金属细线15来电连接第一及第二半导体元件13A、13B对置的边以外的部位上形成的各电极。因此，在本发明中，通过采用第二引线11B，解决了该问题。例如，经金属细线15C电连接纸面上第一半导体元件13A的横周边部上所设的电极、和第二引线11B。第二引线11B在纸面上沿上下方向从第一半导体元件13A的横周边部延伸到第二半导体元件的横周边部。经金属细线15C电连接第二半导体元件13B和第二引线11B。从而，除与第二半导体元件13B相邻的边之外的部位的第一半导体元件13A的取出电极、和除与第一半导体元件13A相邻的边之外的部位的第二半导体元件13B的取出电极经第二引线电连接。
再者，通过经金属细线15将各引线11间进行连接，能够构成进一步的布线。这里，说明经金属细线15及引线11电连接第一半导体元件13A的电极E1、和第二半导体元件13B的电极E2的结构。这里，所谓电极E1，是与第二半导体元件13B相邻的边对置的周边部的第一半导体元件13A上所设的取出电极。所谓电极E2，是与第一半导体元件13A相邻的边对置的周边部的第二半导体元件13B上所设的取出电极。电极E1经金属细线15A与第一引线11A1连接，第一引线11A1经金属细线15D连接在第二引线11B1的纸面上部上。第二引线11B1在第一及第二半导体元件13A、13B的纸面右侧侧方沿上下方向延伸。第二引线11B1的纸面下部、和电极E2经金属细线15E电连接。
下面说明第一引线11A1附近的电连接构造。第一引线11A1的一个端部从形成封装外形的密封树脂16导出到外部而形成外部端子。第一引线11A1的另一个端部延伸到作为电路元件的第一半导体元件13A的近旁，用金属细线15A与第一半导体元件13A的焊盘电连接。第一引线11A1和第二引线11B1经金属细线15D电连接。这里，金属细线15D超越多个引线来电连接各引线。通过采用这种结构的金属细线15D，能够电连接任意部位的各引线，能够提高用引线构成的连线的自由度。此外，第一引线11A1具有一方导出到外部而构成外部端子的作用，同时通过上述金属细线15D的连接，具有封装中内置的连线图形的一部分的作用。
此外，在图1所示的电路装置中，由第一引线11A、第二引线11B、及第三引线11C的端部组成的外部端子从密封树脂16的4个周边部大致等间隔地导出。通过将这些外部端子固定在安装板上，能够安装电路装置10，能够稳定电路装置10的安装。
参照图2，来说明另一方式的电路装置10的结构。该图所示的电路装置的基本结构与图1所示的相同，以下以不同处为中心来进行说明。
第三半导体元件13C例如是裸晶体管芯片等，被固定在第二引线11B的途中所设的第三岛12C上。半导体元件13C经金属细线15直接连接在第一半导体元件13A或第二半导体元件13B上。这里，半导体元件13C也可以经金属细线15电连接第一或第二引线11A、11B。在该图中，示出接近连结部18而从第二引线11B突出延伸的2个第三岛12C。
第4半导体元件13D是LSI芯片等，被固定在第二半导体元件13B的表面上。即，用第二半导体元件13B、和该第二半导体元件13B上固定的第4半导体元件14D实现了叠层构造。此外，第4半导体元件14D经金属细线15与第一引线11A、第二引线11B、或其他电路元件电连接。
这里，第二引线11B被内置在构成封装外形的密封树脂中。即，第二引线11B的主要作用是电连接内置的各电路元件，所以能够这样将整体内置在封装内部。这里，省略了第三引线11C。因此，能够提供结构简化了的电路装置。
支承带25具有支持第二引线11B的作用。即，第二引线11B分别机械分离，所以在进行形成密封树脂的工序之前，需要机械支承它们的机构。通过这样用支承带25从背面或从表面固定第二引线11B，能够防止在制造工序的途中第二引线11B的位置偏移。具体地说，支承带25具有将多个第二引线11B固定在第一引线11A或其他引线上的作用。此外，在进行树脂密封时，也可以粘贴由树脂等组成的粘接片来对整个引线的背面进行树脂密封。能够防止树脂流入引线背面。
接着，参照图3(A)，来详细说明形成了金属细线15C的部位的第二引线11B上所设的台阶差部17。该图是从X1方向来看图1所示的区域A的图。台阶差部17由相对于沿水平方向延伸的第二引线11B向斜上方延伸的倾斜部20、和从倾斜部20沿水平方向延伸的平坦部21构成。通过该结构，能够使平坦部21的位置位于其他第二引线11B的上方。此外，平坦部21经倾斜部20来连接，所以台阶差部17的刚性提高，能够防止引线键合时的超声波能量分散。上述台阶差部17可以设在第二引线11B上，也可以设在第一引线11A上。
参照图3(B)，来说明第二引线11B和半导体元件13的连接构造。该图是从X2方向来看图1所示的区域A的图。金属细线15C至少超越1个引线11的上方，连接在第二引线11B上所设的台阶差部17上。通过该结构，能够提高整个金属细线15C的位置，增大金属细线15C和引线11(特别是位于台阶差部17跟前的第二引线11B)之间的间隙。因此，即使在由于金属细线15C的自重、或树脂密封时的压力而使金属细线15C向下方变形的情况下，也能够防止台阶差部17和半导体元件13之间延伸的第二引线11B和金属细线15C接触。
参照图3(C)，这里，接近岛12的第二引线11B和岛12上固定的半导体元件13经金属细线15C连接。这样，在连接半导体元件13和其跟前的引线11的情况下，可以在连接了金属细线15C的部位的引线11B上不设台阶差部17，就连接两者。即，这是普通的引线键合。
参照图3(D)，这里，用超越多个引线11的金属细线15C来布线引线11的途中所设的各台阶差部17。即，用球焊来连接一个台阶差部17和金属细线15C，用楔焊来连接另一个台阶差部17和金属细线。
参照图4，来说明另一方式的电路装置30的结构。图4(A)是电路装置30的平面图，图4(B)是从X4方向来看图4(A)的区域C的剖视图。该图所示的电路装置30的基本结构与图1所示的相同，不同点在于片状元件44的连接构造。
这里，电路装置30具有：第一引线31A；第二引线31B，接近第一引线31A的一方来延伸，在其途中设有向上方突出的第一台阶差部45A；第三引线31C，接近第一引线31A的另一方来延伸，接近第一台阶差部45A而设有向上方突出的第二台阶差部45B；以及片状元件44，经钎料固定在第一台阶差部45A及第二台阶差部45B上，横跨第一引线31A。这里，所谓片状元件44，例如是片状电阻或片状电容，经焊锡等钎料46与引线电连接。
参照图4(B)，片状元件44的两端所设的电极和引线31经钎料46连接。像在第二引线31B的第一台阶差部45A、和第三引线31C的第二台阶差部45B之间架桥那样来载置片状元件44。因此，通过形成台阶差部45，片状元件44相对于引线31的位置增高。因此，能够防止连接片状元件44所用的钎料46和其他引线31短路。
参照该图，片状元件44被连接在第二及第三引线31B、31C上，横跨第一引线31A。这样，通过横跨第一引线31A来配置片状元件44，能够采用比较大型的片状电容等片状元件。此外，也可以按照片状元件44的大小，横跨多个第一引线31A来形成第二及第三引线31B、31C。此外，上述台阶差部45被形成得比其他部位的引线31的宽度宽，所以能够防止钎料44泄漏。
在上述说明中，说明了具有引线的类型的封装，但是也可以将上述结构应用于其他类型的封装。例如，也可以将上述结构应用于QFP(Quad FlatPackage，四方扁平封装)、QFN(Quad Flat Non-leaded package，四方扁平无引线封装)、使用环氧玻璃基板等内插板的封装等其他方式的封装。
本发明能够取得以下所示的效果。
第二引线沿多个半导体元件的排列方向延伸，经该第二引线和金属细线将各半导体元件间进行电连接。因此，可采用引线的构造，来得到比较复杂的布线构造。此外，即使在电路装置内部的电路发生设计变更的情况下，不变更引线的图形，只变更形成金属细线的部位，或增减金属细线的数目，就能够在一定程度上应付。
再者，在本发明中，在引线的途中设有向上方突出的台阶差部，使连接半导体元件和引线的金属细线连接在该台阶差部上。因此，能够使整个金属细线的位置处于引线的上方，所以即使在金属细线长的情况下，也能够防止金属细线和引线的意外接触。此外，也能够经钎料将片状元件固定在该台阶差部上。通过该结构，能够防止钎料和其他引线短路。

Claims (21)

1、一种电路装置，其特征在于，具有：
多个半导体元件；
第一引线组，与所述半导体元件的键合焊盘连接并导出到封装的外部而构成外部端子；以及
第二引线组，在所述封装内部将所述多个半导体元件之间进行连接。
2、一种电路装置，其特征在于，具有：
第一半导体元件及第二半导体元件；
第一引线，经金属细线与所述第一半导体元件或所述第二半导体元件电连接，其端部导出到外部；以及
第二引线，在所述第一半导体元件及所述第二半导体元件两者上经金属细线进行电连接，将所述第一及所述第二半导体元件电连接。
3、如权利要求2所述的电路装置，其特征在于，所述金属细线至少超越至少1个所述第一或所述第二引线的上方而连接在所述第二引线上。
4、如权利要求2所述的电路装置，其特征在于，在与所述金属细线连接的部位的所述第二引线上，设有向上方突出的台阶差部。
5、如权利要求4所述的电路装置，其特征在于，所述台阶差部由从所述第二引线向斜上方延伸的倾斜部、和从所述倾斜部延伸的平坦部组成。
6、如权利要求1或权利要求2所述的电路装置，其特征在于，所述第二引线与所述第一及所述第二半导体元件排列的方向平行地延伸。
7、如权利要求2所述的电路装置，其特征在于，将所述金属细线连接的部位的所述引线形成得比其他部位的宽度宽。
8、如权利要求1所述的电路装置，其特征在于，所述第二引线的端部从所述封装导出到外部。
9、如权利要求1所述的电路装置，其特征在于，所述第二引线的端部被容纳在所述封装的内部。
10、一种电路装置，其特征在于，具有：
第一引线；
第二引线，延伸接近所述第一引线的一方，设有向上方突出的第一台阶差部；
第三引线，接近所述第一引线的另一方来延伸，设有向上方突出的第二台阶差部；以及
片状元件，经焊料固定在所述第一台阶差部及所述第二台阶差部上，以横跨所述第一引线。
11、如权利要求10所述的电路装置，其特征在于，所述第一及第二台阶差部由从所述第二及所述第三引线向斜上方延伸的倾斜部、和从所述倾斜部延伸的平坦部组成。
12、如权利要求10所述的电路装置，其特征在于，将所述第一台阶差部及所述第二台阶差部形成得比其他部位的所述引线的宽度宽。
13、一种电路装置，其特征在于，具有：
第一电路元件；
第一引线，经第一金属细线与所述第一电路元件电连接，其端部导出到外部；
第二引线，经第二金属细线与所述第一引线连接；以及
第二电路元件，电连接于所述第二引线。
14、如权利要求13所述的电路装置，其特征在于，所述第一或所述第二金属细线跨越至少1个所述第一或所述第二引线的上方。
15、如权利要求13所述的电路装置，其特征在于，在所述第一或所述第二金属细线连接的部位的所述第一或第二引线上，设有向上方突出的台阶差部。
16、如权利要求15所述的电路装置，其特征在于，所述台阶差部由从所述第一引线向斜上方延伸的倾斜部、和从所述倾斜部延伸的平坦部组成。
17、如权利要求13所述的电路装置，其特征在于，将所述第一或第二金属细线连接的部位的所述第一或第二引线形成得比其他部位的宽度宽。
18、一种电路装置，具有：岛；第一引线，具有经一端接近所述岛的周围而设的内引线，将另一端从密封树脂突出而成的外引线；以及半导体元件，被设在所述岛上；其特征在于，
具有布线引线，该引线从由所述密封树脂组成的封装的一侧边上的一区域延伸到所述封装的内部，从所述内部延伸到所述封装的一侧边上的另一区域；
经所述布线引线，将所述封装内密封的、与所述半导体元件不同的别的电路元件和所述半导体元件进行电连接。
19、如权利要求18所述的电路装置，其中，所述别的电路元件是半导体元件或无源元件。
20、如权利要求18所述的电路装置，其中，在所述岛上，设有叠层而成的多个半导体芯片。
21、一种电路装置，具有：多个岛；第一引线，具有经一端接近所述多个岛的周围而设的内引线，将另一端从密封树脂突出而成的外引线；以及半导体元件，被分别设置在所述多个岛上；其特征在于，
具有布线引线，该引线从由所述密封树脂组成的封装的一侧边上的一区域在所述多个岛的近旁延伸，从所述近旁延伸到所述封装的一侧边上的另一区域；
经所述布线引线，与所述封装内密封的所述多个半导体元件电连接。
CNB2004100545279A 2003-08-20 2004-07-23 电路装置 Expired - Fee Related CN100474579C (zh)

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