CN1382827A - 在有机发光装置的制造中可重复使用的物质量传感器 - Google Patents
在有机发光装置的制造中可重复使用的物质量传感器 Download PDFInfo
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- CN1382827A CN1382827A CN02118053A CN02118053A CN1382827A CN 1382827 A CN1382827 A CN 1382827A CN 02118053 A CN02118053 A CN 02118053A CN 02118053 A CN02118053 A CN 02118053A CN 1382827 A CN1382827 A CN 1382827A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/063—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators
- G01B7/066—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators for measuring thickness of coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/839,886 US6558735B2 (en) | 2001-04-20 | 2001-04-20 | Reusable mass-sensor in manufacture of organic light-emitting devices |
US09/839886 | 2001-04-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1382827A true CN1382827A (zh) | 2002-12-04 |
CN1279208C CN1279208C (zh) | 2006-10-11 |
Family
ID=25280893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021180539A Expired - Lifetime CN1279208C (zh) | 2001-04-20 | 2002-04-22 | 在有机发光装置制造中沉积有机层的方法和装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US6558735B2 (zh) |
EP (1) | EP1251571A3 (zh) |
JP (1) | JP2002373782A (zh) |
KR (1) | KR20020082128A (zh) |
CN (1) | CN1279208C (zh) |
TW (1) | TW546987B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103668079A (zh) * | 2012-09-17 | 2014-03-26 | 三星显示有限公司 | 蒸镀装置 |
CN104099573A (zh) * | 2013-04-03 | 2014-10-15 | 三星显示有限公司 | 沉积设备 |
CN104630735A (zh) * | 2013-11-06 | 2015-05-20 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 温度监控装置及等离子体加工设备 |
WO2016029539A1 (zh) * | 2014-08-28 | 2016-03-03 | 京东方科技集团股份有限公司 | 蒸镀设备及蒸镀方法 |
CN108011054A (zh) * | 2017-11-29 | 2018-05-08 | 合肥鑫晟光电科技有限公司 | 在基板上形成膜层的方法和在基板上形成膜层的设备 |
CN108291291A (zh) * | 2016-10-25 | 2018-07-17 | 应用材料公司 | 用于测量沉积率的测量组件、蒸发源、沉积设备及其方法 |
CN108883830A (zh) * | 2017-01-24 | 2018-11-23 | 威里利生命科学有限责任公司 | 用于移动自动大量释放昆虫的系统和方法 |
CN110471264A (zh) * | 2018-05-09 | 2019-11-19 | 柯尼卡美能达办公系统研发(无锡)有限公司 | 定影装置以及图像形成装置 |
WO2023108729A1 (zh) * | 2021-12-15 | 2023-06-22 | 深圳市华星光电半导体显示技术有限公司 | 显示面板、显示面板的制作方法以及制作显示面板的机台 |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020011205A1 (en) | 2000-05-02 | 2002-01-31 | Shunpei Yamazaki | Film-forming apparatus, method of cleaning the same, and method of manufacturing a light-emitting device |
US6649436B2 (en) * | 2002-02-11 | 2003-11-18 | Eastman Kodak Company | Using organic materials in making an organic light-emitting device |
JP3973605B2 (ja) * | 2002-07-10 | 2007-09-12 | 東京エレクトロン株式会社 | 成膜装置及びこれに使用する原料供給装置、成膜方法 |
DE602004027256D1 (de) * | 2003-06-27 | 2010-07-01 | Sundew Technologies Llc | Vorrichtung und verfahren zur steuerung des dampfdrucks einer chemikalienquelle |
US20100129548A1 (en) * | 2003-06-27 | 2010-05-27 | Sundew Technologies, Llc | Ald apparatus and method |
JP4366226B2 (ja) * | 2004-03-30 | 2009-11-18 | 東北パイオニア株式会社 | 有機elパネルの製造方法、有機elパネルの成膜装置 |
KR100762701B1 (ko) * | 2006-05-11 | 2007-10-01 | 삼성에스디아이 주식회사 | 크리스탈 센서 및 이를 구비한 유기 발광소자 증착장치. |
ITBO20060397A1 (it) * | 2006-05-24 | 2007-11-25 | Consiglio Nazionale Ricerche | Macchina per la deposizione automatizzata di materiale mediante un aerografo |
KR101222980B1 (ko) * | 2006-06-30 | 2013-01-17 | 엘지디스플레이 주식회사 | 증착 장비의 결정 센서의 재생 방법 |
KR20080066285A (ko) * | 2007-01-11 | 2008-07-16 | 삼성전자주식회사 | 증발장치와 유기층 형성 방법 |
JP2009001885A (ja) * | 2007-06-25 | 2009-01-08 | Canon Inc | 膜厚検知装置及び蒸着方法 |
KR100974041B1 (ko) * | 2008-07-03 | 2010-08-05 | 주식회사 선익시스템 | 막 증착 장치와 막 두께 측정 방법 |
JP5121645B2 (ja) * | 2008-09-25 | 2013-01-16 | 日立造船株式会社 | 真空蒸着設備の膜厚検出装置 |
KR101499228B1 (ko) * | 2008-12-08 | 2015-03-05 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 방법 |
US20100233353A1 (en) * | 2009-03-16 | 2010-09-16 | Applied Materials, Inc. | Evaporator, coating installation, and method for use thereof |
TWI472639B (zh) * | 2009-05-22 | 2015-02-11 | Samsung Display Co Ltd | 薄膜沉積設備 |
TWI475124B (zh) * | 2009-05-22 | 2015-03-01 | Samsung Display Co Ltd | 薄膜沉積設備 |
US8882920B2 (en) | 2009-06-05 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
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JP5328726B2 (ja) * | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
JP5611718B2 (ja) * | 2009-08-27 | 2014-10-22 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
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KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
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- 2002-04-08 EP EP02076382A patent/EP1251571A3/en not_active Withdrawn
- 2002-04-17 JP JP2002114385A patent/JP2002373782A/ja active Pending
- 2002-04-19 KR KR1020020021486A patent/KR20020082128A/ko not_active Application Discontinuation
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CN110471264A (zh) * | 2018-05-09 | 2019-11-19 | 柯尼卡美能达办公系统研发(无锡)有限公司 | 定影装置以及图像形成装置 |
WO2023108729A1 (zh) * | 2021-12-15 | 2023-06-22 | 深圳市华星光电半导体显示技术有限公司 | 显示面板、显示面板的制作方法以及制作显示面板的机台 |
Also Published As
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US6682600B2 (en) | 2004-01-27 |
KR20020082128A (ko) | 2002-10-30 |
EP1251571A3 (en) | 2007-09-19 |
EP1251571A2 (en) | 2002-10-23 |
CN1279208C (zh) | 2006-10-11 |
JP2002373782A (ja) | 2002-12-26 |
TW546987B (en) | 2003-08-11 |
US20020187253A1 (en) | 2002-12-12 |
US6558735B2 (en) | 2003-05-06 |
US20030140858A1 (en) | 2003-07-31 |
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