CN1366342A - 半导体存储器 - Google Patents
半导体存储器 Download PDFInfo
- Publication number
- CN1366342A CN1366342A CN01133172A CN01133172A CN1366342A CN 1366342 A CN1366342 A CN 1366342A CN 01133172 A CN01133172 A CN 01133172A CN 01133172 A CN01133172 A CN 01133172A CN 1366342 A CN1366342 A CN 1366342A
- Authority
- CN
- China
- Prior art keywords
- mos transistor
- grid
- contact hole
- metal line
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 95
- 239000002184 metal Substances 0.000 claims description 95
- 239000011229 interlayer Substances 0.000 claims description 49
- 239000010410 layer Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 9
- 239000012535 impurity Substances 0.000 abstract description 9
- 210000004027 cell Anatomy 0.000 description 33
- 238000000034 method Methods 0.000 description 24
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 17
- 239000010937 tungsten Substances 0.000 description 17
- 229910052721 tungsten Inorganic materials 0.000 description 17
- 238000005530 etching Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000005755 formation reaction Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 4
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910017464 nitrogen compound Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000005055 memory storage Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 210000000352 storage cell Anatomy 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- -1 silicon oxide compound Chemical class 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7491/2001 | 2001-01-16 | ||
JP2001007491A JP4471504B2 (ja) | 2001-01-16 | 2001-01-16 | 半導体記憶装置 |
JP7491/01 | 2001-01-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1366342A true CN1366342A (zh) | 2002-08-28 |
CN1187833C CN1187833C (zh) | 2005-02-02 |
Family
ID=18875232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011331720A Expired - Lifetime CN1187833C (zh) | 2001-01-16 | 2001-09-18 | 半导体存储器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6597041B2 (zh) |
JP (1) | JP4471504B2 (zh) |
KR (1) | KR100396105B1 (zh) |
CN (1) | CN1187833C (zh) |
DE (1) | DE10145720A1 (zh) |
TW (1) | TW504834B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101211895B (zh) * | 2007-12-21 | 2011-09-21 | 上海宏力半导体制造有限公司 | 监控存储阵列的单元间距的结构以及方法 |
CN101471345B (zh) * | 2007-12-28 | 2012-12-12 | 瑞萨电子株式会社 | 半导体装置和光掩膜 |
CN112509614A (zh) * | 2019-09-13 | 2021-03-16 | 铠侠股份有限公司 | 半导体装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003297954A (ja) * | 2002-01-29 | 2003-10-17 | Mitsubishi Electric Corp | 半導体記憶装置 |
KR20030085323A (ko) * | 2002-04-30 | 2003-11-05 | 주식회사 하이닉스반도체 | 에스렘(sram) 셀 및 그 제조방법 |
KR100450683B1 (ko) * | 2002-09-04 | 2004-10-01 | 삼성전자주식회사 | Soi 기판에 형성되는 에스램 디바이스 |
JP3977246B2 (ja) | 2002-12-27 | 2007-09-19 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP3920804B2 (ja) * | 2003-04-04 | 2007-05-30 | 松下電器産業株式会社 | 半導体記憶装置 |
KR100526870B1 (ko) | 2003-06-04 | 2005-11-09 | 삼성전자주식회사 | 반도체 소자에서의 국부 상호연결배선 형성방법 |
JP2005064127A (ja) * | 2003-08-08 | 2005-03-10 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2007287959A (ja) * | 2006-04-18 | 2007-11-01 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
US8120116B2 (en) * | 2007-12-28 | 2012-02-21 | Renesas Electronics Corporation | Semiconductor device and photomask |
JP2010087420A (ja) * | 2008-10-02 | 2010-04-15 | Renesas Technology Corp | 半導体装置およびフォトマスク |
JP2010118597A (ja) | 2008-11-14 | 2010-05-27 | Nec Electronics Corp | 半導体装置 |
US8390033B2 (en) * | 2009-02-23 | 2013-03-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal structure for memory device |
WO2014197335A1 (en) | 2013-06-08 | 2014-12-11 | Apple Inc. | Interpreting and acting upon commands that involve sharing information with remote devices |
US10211206B1 (en) * | 2017-11-01 | 2019-02-19 | Globalfoundries Inc. | Two-port vertical SRAM circuit structure and method for producing the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712486A (en) | 1980-06-26 | 1982-01-22 | Mitsubishi Electric Corp | Semiconductor storage device |
US5541427A (en) | 1993-12-03 | 1996-07-30 | International Business Machines Corporation | SRAM cell with capacitor |
JP3824343B2 (ja) * | 1996-03-29 | 2006-09-20 | 富士通株式会社 | 半導体装置 |
JP3523762B2 (ja) * | 1996-12-19 | 2004-04-26 | 株式会社東芝 | 半導体記憶装置 |
JPH1145949A (ja) * | 1997-07-28 | 1999-02-16 | Mitsubishi Electric Corp | スタティック型半導体記憶装置およびその製造方法 |
JP2000031300A (ja) * | 1998-07-09 | 2000-01-28 | Fujitsu Ltd | スタティック型半導体記憶装置 |
JP4674386B2 (ja) * | 1999-02-17 | 2011-04-20 | ソニー株式会社 | 半導体記憶装置 |
JP4565700B2 (ja) * | 1999-05-12 | 2010-10-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2001
- 2001-01-16 JP JP2001007491A patent/JP4471504B2/ja not_active Expired - Fee Related
- 2001-07-17 US US09/906,146 patent/US6597041B2/en not_active Expired - Lifetime
- 2001-09-13 TW TW090122720A patent/TW504834B/zh not_active IP Right Cessation
- 2001-09-17 KR KR10-2001-0057242A patent/KR100396105B1/ko not_active IP Right Cessation
- 2001-09-17 DE DE10145720A patent/DE10145720A1/de not_active Ceased
- 2001-09-18 CN CNB011331720A patent/CN1187833C/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101211895B (zh) * | 2007-12-21 | 2011-09-21 | 上海宏力半导体制造有限公司 | 监控存储阵列的单元间距的结构以及方法 |
CN101471345B (zh) * | 2007-12-28 | 2012-12-12 | 瑞萨电子株式会社 | 半导体装置和光掩膜 |
CN112509614A (zh) * | 2019-09-13 | 2021-03-16 | 铠侠股份有限公司 | 半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
US20020093111A1 (en) | 2002-07-18 |
US6597041B2 (en) | 2003-07-22 |
DE10145720A1 (de) | 2002-07-25 |
TW504834B (en) | 2002-10-01 |
KR20020061149A (ko) | 2002-07-23 |
KR100396105B1 (ko) | 2003-08-27 |
JP2002217316A (ja) | 2002-08-02 |
CN1187833C (zh) | 2005-02-02 |
JP4471504B2 (ja) | 2010-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER OWNER: MISSUBISHI ELECTRIC CORP. Effective date: 20140416 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140416 Address after: Kawasaki, Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Tokyo, Japan, Japan Patentee before: Missubishi Electric Co., Ltd. |
|
CP02 | Change in the address of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: Renesas Electronics Corporation Address before: Kawasaki, Kanagawa, Japan Patentee before: Renesas Electronics Corporation |
|
CP02 | Change in the address of a patent holder | ||
CX01 | Expiry of patent term |
Granted publication date: 20050202 |
|
CX01 | Expiry of patent term |