CN1335419A - 使用电镀液的振动流动与脉冲状电镀电流组合的电镀方法 - Google Patents

使用电镀液的振动流动与脉冲状电镀电流组合的电镀方法 Download PDF

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Publication number
CN1335419A
CN1335419A CN01118269A CN01118269A CN1335419A CN 1335419 A CN1335419 A CN 1335419A CN 01118269 A CN01118269 A CN 01118269A CN 01118269 A CN01118269 A CN 01118269A CN 1335419 A CN1335419 A CN 1335419A
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CN
China
Prior art keywords
electro
vibration
electroplate liquid
plating
electroplating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN01118269A
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English (en)
Chinese (zh)
Inventor
大政龙晋
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Nihon Techno KK
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Nihon Techno KK
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Filing date
Publication date
Application filed by Nihon Techno KK filed Critical Nihon Techno KK
Publication of CN1335419A publication Critical patent/CN1335419A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
CN01118269A 2000-05-25 2001-05-25 使用电镀液的振动流动与脉冲状电镀电流组合的电镀方法 Pending CN1335419A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP155046/2000 2000-05-25
JP2000243249 2000-08-10
JP243249/2000 2000-08-10
JP2001129994A JP2002121699A (ja) 2000-05-25 2001-04-26 めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法
JP129994/2001 2001-04-26

Publications (1)

Publication Number Publication Date
CN1335419A true CN1335419A (zh) 2002-02-13

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
CN01118269A Pending CN1335419A (zh) 2000-05-25 2001-05-25 使用电镀液的振动流动与脉冲状电镀电流组合的电镀方法

Country Status (9)

Country Link
US (1) US20010045360A1 (ja)
EP (1) EP1164208A3 (ja)
JP (1) JP2002121699A (ja)
KR (1) KR100461908B1 (ja)
CN (1) CN1335419A (ja)
CA (1) CA2349156A1 (ja)
HK (1) HK1041715A1 (ja)
SG (1) SG94828A1 (ja)
TW (1) TW526295B (ja)

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CN104060304A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种酸性镀锡电解液
CN105714331A (zh) * 2016-05-11 2016-06-29 吉首大学 正弦波齿盘、磁筒双脉动式电解除杂槽
CN105862086A (zh) * 2016-05-11 2016-08-17 吉首大学 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105862085A (zh) * 2016-05-11 2016-08-17 吉首大学 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105908215A (zh) * 2016-05-11 2016-08-31 吉首大学 超声波脉冲、正弦波齿盘双脉动式电解除杂槽
CN105970258A (zh) * 2015-03-11 2016-09-28 丰田自动车株式会社 膜形成装置和膜形成方法
TWI580328B (zh) * 2012-08-07 2017-04-21 Ebara Corp Electroplating method and plating device for through hole
CN109023494A (zh) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 振动式卧式滚镀装置
CN110359069A (zh) * 2019-07-16 2019-10-22 吉林大学 一种液相多金属混合增材制造装置及方法
CN110438478A (zh) * 2018-08-22 2019-11-12 盛青永致半导体设备(苏州)有限公司 一种化学镀装置及金属化基板的制造方法

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JP3681670B2 (ja) * 2001-09-25 2005-08-10 シャープ株式会社 半導体集積回路の製造装置および製造方法
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CN100503899C (zh) * 2002-03-27 2009-06-24 岛屿涂层有限公司 用于在金属和合金上形成陶瓷涂层的方法和装置及由此方法制得的涂层
GB2386907B (en) * 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
JP2006131926A (ja) * 2004-11-02 2006-05-25 Sharp Corp 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置
JP4856896B2 (ja) * 2005-06-02 2012-01-18 新光電気工業株式会社 リードフレームのめっき方法およびリードフレーム
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (ja) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 めっき装置及びめっき方法
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
JP5583584B2 (ja) 2008-09-01 2014-09-03 日本テクノ株式会社 水素と酸素からなる液状物の製造方法
JP5504147B2 (ja) 2010-12-21 2014-05-28 株式会社荏原製作所 電気めっき方法
US9666426B2 (en) * 2011-06-24 2017-05-30 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248374A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Chemical polishing of aluminum
CN102899708B (zh) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 电镀槽用阴极移动装置
JP6463622B2 (ja) * 2014-11-27 2019-02-06 Ykk株式会社 めっき装置、めっきユニット、及びめっきライン
US10801120B2 (en) 2017-01-26 2020-10-13 Curium Us Llc Systems and methods for electroplating sources for alpha spectroscopy
JP6329681B1 (ja) * 2017-10-31 2018-05-23 株式会社荏原製作所 めっき装置及びめっき方法
CN107952395A (zh) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 拌和振动器

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580328B (zh) * 2012-08-07 2017-04-21 Ebara Corp Electroplating method and plating device for through hole
CN104060304A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种酸性镀锡电解液
CN105970258B (zh) * 2015-03-11 2018-05-29 丰田自动车株式会社 膜形成装置和膜形成方法
CN105970258A (zh) * 2015-03-11 2016-09-28 丰田自动车株式会社 膜形成装置和膜形成方法
CN105862085A (zh) * 2016-05-11 2016-08-17 吉首大学 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105908215A (zh) * 2016-05-11 2016-08-31 吉首大学 超声波脉冲、正弦波齿盘双脉动式电解除杂槽
CN105862086A (zh) * 2016-05-11 2016-08-17 吉首大学 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105908215B (zh) * 2016-05-11 2017-11-07 吉首大学 超声波脉冲、正弦波齿盘双脉动式电解除杂槽
CN105714331B (zh) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 正弦波齿盘、磁筒双脉动式电解除杂槽
CN105714331A (zh) * 2016-05-11 2016-06-29 吉首大学 正弦波齿盘、磁筒双脉动式电解除杂槽
CN110438478A (zh) * 2018-08-22 2019-11-12 盛青永致半导体设备(苏州)有限公司 一种化学镀装置及金属化基板的制造方法
CN109023494A (zh) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 振动式卧式滚镀装置
CN110359069A (zh) * 2019-07-16 2019-10-22 吉林大学 一种液相多金属混合增材制造装置及方法
CN110359069B (zh) * 2019-07-16 2021-01-29 吉林大学 一种液相多金属混合增材制造装置及方法

Also Published As

Publication number Publication date
CA2349156A1 (en) 2001-11-25
SG94828A1 (en) 2003-03-18
JP2002121699A (ja) 2002-04-26
KR100461908B1 (ko) 2004-12-14
TW526295B (en) 2003-04-01
EP1164208A3 (en) 2003-10-08
KR20010107788A (ko) 2001-12-07
US20010045360A1 (en) 2001-11-29
HK1041715A1 (zh) 2002-07-19
EP1164208A2 (en) 2001-12-19

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