EP1164208A3 - Electroplating method using combination of vibrational flow in plating bath and plating current of pulse - Google Patents

Electroplating method using combination of vibrational flow in plating bath and plating current of pulse Download PDF

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Publication number
EP1164208A3
EP1164208A3 EP01112689A EP01112689A EP1164208A3 EP 1164208 A3 EP1164208 A3 EP 1164208A3 EP 01112689 A EP01112689 A EP 01112689A EP 01112689 A EP01112689 A EP 01112689A EP 1164208 A3 EP1164208 A3 EP 1164208A3
Authority
EP
European Patent Office
Prior art keywords
plating
value
plating bath
time
electroplating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01112689A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1164208A2 (en
Inventor
Ryushin Omasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Techno KK
Original Assignee
Nihon Techno KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Techno KK filed Critical Nihon Techno KK
Publication of EP1164208A2 publication Critical patent/EP1164208A2/en
Publication of EP1164208A3 publication Critical patent/EP1164208A3/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
EP01112689A 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse Withdrawn EP1164208A3 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2000243249 2000-08-10
JP2001129994 2001-04-26
JP2001129994A JP2002121699A (ja) 2000-05-25 2001-04-26 めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法

Publications (2)

Publication Number Publication Date
EP1164208A2 EP1164208A2 (en) 2001-12-19
EP1164208A3 true EP1164208A3 (en) 2003-10-08

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01112689A Withdrawn EP1164208A3 (en) 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse

Country Status (9)

Country Link
US (1) US20010045360A1 (ja)
EP (1) EP1164208A3 (ja)
JP (1) JP2002121699A (ja)
KR (1) KR100461908B1 (ja)
CN (1) CN1335419A (ja)
CA (1) CA2349156A1 (ja)
HK (1) HK1041715A1 (ja)
SG (1) SG94828A1 (ja)
TW (1) TW526295B (ja)

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KR20040019089A (ko) 2001-07-31 2004-03-04 세키스이가가쿠 고교가부시키가이샤 도전성 미립자의 제조 방법
JP3681670B2 (ja) * 2001-09-25 2005-08-10 シャープ株式会社 半導体集積回路の製造装置および製造方法
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
GB2386907B (en) 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
CN100503899C (zh) * 2002-03-27 2009-06-24 岛屿涂层有限公司 用于在金属和合金上形成陶瓷涂层的方法和装置及由此方法制得的涂层
JP3964263B2 (ja) * 2002-05-17 2007-08-22 株式会社デンソー ブラインドビアホール充填方法及び貫通電極形成方法
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
JP2006131926A (ja) * 2004-11-02 2006-05-25 Sharp Corp 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置
JP4856896B2 (ja) * 2005-06-02 2012-01-18 新光電気工業株式会社 リードフレームのめっき方法およびリードフレーム
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (ja) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 めっき装置及びめっき方法
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
CN101815812A (zh) 2008-09-01 2010-08-25 日本科技股份有限公司 由氢和氧构成的液态物、由该液态物得到的由氢和氧构成的再气化气体、它们的制备方法和装置、以及由这些液态物和再气化气体构成的不产生二氧化碳的燃料
JP5504147B2 (ja) * 2010-12-21 2014-05-28 株式会社荏原製作所 電気めっき方法
US9666426B2 (en) * 2011-06-24 2017-05-30 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248486A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Electron beam polishing of aluminum
JP5980735B2 (ja) * 2012-08-07 2016-08-31 株式会社荏原製作所 スルーホールの電気めっき方法及び電気めっき装置
CN102899708B (zh) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 电镀槽用阴极移动装置
CN104060304A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种酸性镀锡电解液
JP6463622B2 (ja) * 2014-11-27 2019-02-06 Ykk株式会社 めっき装置、めっきユニット、及びめっきライン
JP6222145B2 (ja) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
CN105862086B (zh) * 2016-05-11 2017-09-22 吉首大学 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105908215B (zh) * 2016-05-11 2017-11-07 吉首大学 超声波脉冲、正弦波齿盘双脉动式电解除杂槽
CN105714331B (zh) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 正弦波齿盘、磁筒双脉动式电解除杂槽
CN105862085B (zh) * 2016-05-11 2017-09-19 吉首大学 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
EP3574132A4 (en) 2017-01-26 2020-11-04 Curium US LLC SYSTEMS AND METHODS FOR ELECTROPLATING SOURCES FOR ALPHA SPECTROSCOPY
JP6329681B1 (ja) * 2017-10-31 2018-05-23 株式会社荏原製作所 めっき装置及びめっき方法
CN107952395A (zh) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 拌和振动器
TWI690620B (zh) * 2018-08-22 2020-04-11 華紹國際有限公司 化學鍍裝置及金屬化基板的製造方法
CN109023494A (zh) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 振动式卧式滚镀装置
CN110359069B (zh) * 2019-07-16 2021-01-29 吉林大学 一种液相多金属混合增材制造装置及方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
JPH06330395A (ja) * 1993-05-17 1994-11-29 Nippon Techno Kk クロムのバレルめっき方法と装置
EP0915182A1 (en) * 1997-10-21 1999-05-12 Nihon Techno Kabushiki Kaisha Plating method
JPH11274107A (ja) * 1998-03-24 1999-10-08 Japan Energy Corp 銅めっき方法及び銅めっき液
WO1999054527A2 (en) * 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
WO2000020662A1 (en) * 1998-10-05 2000-04-13 Semitool, Inc. Submicron metallization using electrochemical deposition
JP2000129490A (ja) * 1998-10-21 2000-05-09 Ebara Corp 電解めっき方法及び電解めっき装置

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JPS62235714A (ja) * 1986-04-07 1987-10-15 Hitachi Ltd 磁性合金薄膜の形成方法及びその装置
JPS63312996A (ja) * 1987-06-15 1988-12-21 Seiko Instr & Electronics Ltd アモルファス合金の電着方法
US4720330A (en) * 1987-07-06 1988-01-19 The Dow Chemical Company Device and method for electroplating a workpiece having axial symmetry
JPH0230790A (ja) * 1988-07-15 1990-02-01 Seiko Instr Inc 合金電着方法
DE4322378A1 (de) * 1993-07-06 1995-01-12 Hans Henig Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage
US5684683A (en) * 1996-02-09 1997-11-04 Wisconsin Alumni Research Foundation DC-to-DC power conversion with high current output
US6126808A (en) * 1998-03-23 2000-10-03 Pioneer Metal Finishing Method and apparatus for anodizing objects

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
JPH06330395A (ja) * 1993-05-17 1994-11-29 Nippon Techno Kk クロムのバレルめっき方法と装置
EP0915182A1 (en) * 1997-10-21 1999-05-12 Nihon Techno Kabushiki Kaisha Plating method
JPH11274107A (ja) * 1998-03-24 1999-10-08 Japan Energy Corp 銅めっき方法及び銅めっき液
WO1999054527A2 (en) * 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
WO2000020662A1 (en) * 1998-10-05 2000-04-13 Semitool, Inc. Submicron metallization using electrochemical deposition
JP2000129490A (ja) * 1998-10-21 2000-05-09 Ebara Corp 電解めっき方法及び電解めっき装置

Non-Patent Citations (3)

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Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06) *

Also Published As

Publication number Publication date
TW526295B (en) 2003-04-01
KR20010107788A (ko) 2001-12-07
KR100461908B1 (ko) 2004-12-14
HK1041715A1 (zh) 2002-07-19
JP2002121699A (ja) 2002-04-26
CN1335419A (zh) 2002-02-13
SG94828A1 (en) 2003-03-18
EP1164208A2 (en) 2001-12-19
US20010045360A1 (en) 2001-11-29
CA2349156A1 (en) 2001-11-25

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