EP1164208A3 - Electroplating method using combination of vibrational flow in plating bath and plating current of pulse - Google Patents

Electroplating method using combination of vibrational flow in plating bath and plating current of pulse Download PDF

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Publication number
EP1164208A3
EP1164208A3 EP01112689A EP01112689A EP1164208A3 EP 1164208 A3 EP1164208 A3 EP 1164208A3 EP 01112689 A EP01112689 A EP 01112689A EP 01112689 A EP01112689 A EP 01112689A EP 1164208 A3 EP1164208 A3 EP 1164208A3
Authority
EP
European Patent Office
Prior art keywords
plating
value
plating bath
time
electroplating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01112689A
Other languages
German (de)
French (fr)
Other versions
EP1164208A2 (en
Inventor
Ryushin Omasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Techno KK
Original Assignee
Nihon Techno KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Techno KK filed Critical Nihon Techno KK
Publication of EP1164208A2 publication Critical patent/EP1164208A2/en
Publication of EP1164208A3 publication Critical patent/EP1164208A3/en
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

In an electroplating method, a plating target article (X) disposed so as to be in contact with plating bath (14) is set as a cathode while a metal member disposed so as to be in contact with the plating bath (14) is set as an anode, and a voltage is applied between the cathode and the anode while vibrational flow is induced by vibrating vibrational vanes (16f) which are fixed in multi-stage style to a vibrating rod (16e) vibrating in the plating bath (14) interlockingly with vibration generating means (16d). Plating current flowing from the anode through the plating bath (14) to the cathode is pulsed and alternately set to one of a first state where the plating current keeps a first value I1 for a first time T1 and a second state where the plating current keeps a second value I2 having the same polarity as the first value I1 for a second time T2, the first value I1 being five or more times larger than the second value I2, and the first time T1 being three or more times longer than the second time T2.
EP01112689A 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse Withdrawn EP1164208A3 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2000243249 2000-08-10
JP2001129994 2001-04-26
JP2001129994A JP2002121699A (en) 2000-05-25 2001-04-26 Electroplating method using combination of vibrating flow and impulsive plating current of plating bath

Publications (2)

Publication Number Publication Date
EP1164208A2 EP1164208A2 (en) 2001-12-19
EP1164208A3 true EP1164208A3 (en) 2003-10-08

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01112689A Withdrawn EP1164208A3 (en) 2000-05-25 2001-05-25 Electroplating method using combination of vibrational flow in plating bath and plating current of pulse

Country Status (9)

Country Link
US (1) US20010045360A1 (en)
EP (1) EP1164208A3 (en)
JP (1) JP2002121699A (en)
KR (1) KR100461908B1 (en)
CN (1) CN1335419A (en)
CA (1) CA2349156A1 (en)
HK (1) HK1041715A1 (en)
SG (1) SG94828A1 (en)
TW (1) TW526295B (en)

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KR20040019089A (en) 2001-07-31 2004-03-04 세키스이가가쿠 고교가부시키가이샤 Method for Producing Electroconductive Particles
JP3681670B2 (en) * 2001-09-25 2005-08-10 シャープ株式会社 Semiconductor integrated circuit manufacturing apparatus and manufacturing method
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
GB2386907B (en) * 2002-03-27 2005-10-26 Isle Coat Ltd Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process
CN100503899C (en) * 2002-03-27 2009-06-24 岛屿涂层有限公司 Process for forming ceramic coatings on metals and alloys, and coatings produced by this process
JP3964263B2 (en) * 2002-05-17 2007-08-22 株式会社デンソー Blind via hole filling method and through electrode forming method
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
JP2006131926A (en) * 2004-11-02 2006-05-25 Sharp Corp Plating method for micropore, method for forming gold bump using the same, method for producing semiconductor device, and semiconductor device
JP4856896B2 (en) * 2005-06-02 2012-01-18 新光電気工業株式会社 Lead frame plating method and lead frame
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (en) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 Plating apparatus and plating method
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
WO2010023997A1 (en) 2008-09-01 2010-03-04 日本テクノ株式会社 Liquid material comprising hydrogen and oxygen, regasified gas comprising hydrogen and oxygen produced from the liquid material, process and apparatus for producing the liquid material and regasified gas, and fuel that does not evolve carbon dioxide and comprises the liquid material and regasified gas
JP5504147B2 (en) 2010-12-21 2014-05-28 株式会社荏原製作所 Electroplating method
WO2012174732A1 (en) * 2011-06-24 2012-12-27 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248486A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Electron beam polishing of aluminum
JP5980735B2 (en) * 2012-08-07 2016-08-31 株式会社荏原製作所 Through-hole electroplating method and electroplating apparatus
CN102899708B (en) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 Cathode moving device for electroplating bath
CN104060304A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Acid tinning electrolyte
JP6463622B2 (en) * 2014-11-27 2019-02-06 Ykk株式会社 Plating equipment, plating unit, and plating line
JP6222145B2 (en) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
CN105862086B (en) * 2016-05-11 2017-09-22 吉首大学 Disk pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
CN105714331B (en) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 The double pulsating electrolysis deblending slots of sine wave fluted disc, magnetic cylinder
CN105908215B (en) * 2016-05-11 2017-11-07 吉首大学 The double pulsating electrolysis deblending slots of ultrasonic pulse, sine wave fluted disc
CN105862085B (en) * 2016-05-11 2017-09-19 吉首大学 Disk stirring pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
WO2018140750A1 (en) 2017-01-26 2018-08-02 Mallinckrodt Nuclear Medicine Llc Systems and methods for electroplating sources for alpha spectroscopy
JP6329681B1 (en) * 2017-10-31 2018-05-23 株式会社荏原製作所 Plating apparatus and plating method
CN107952395A (en) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 Mix and stir vibrator
TWI690620B (en) * 2018-08-22 2020-04-11 華紹國際有限公司 Electroless plating device and manufacturing method of metallized substrate
CN109023494A (en) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 The horizontal Tumble-plating device of oscillatory type
CN110359069B (en) * 2019-07-16 2021-01-29 吉林大学 Liquid-phase multi-metal mixed additive manufacturing device and method

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US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
JPH06330395A (en) * 1993-05-17 1994-11-29 Nippon Techno Kk Method for barrel plating of chromium and device therefor
EP0915182A1 (en) * 1997-10-21 1999-05-12 Nihon Techno Kabushiki Kaisha Plating method
JPH11274107A (en) * 1998-03-24 1999-10-08 Japan Energy Corp Copper plating method and aqueous copper plating agent
WO1999054527A2 (en) * 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
WO2000020662A1 (en) * 1998-10-05 2000-04-13 Semitool, Inc. Submicron metallization using electrochemical deposition
JP2000129490A (en) * 1998-10-21 2000-05-09 Ebara Corp Electroplating method and electroplating device

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JPS63312996A (en) * 1987-06-15 1988-12-21 Seiko Instr & Electronics Ltd Method for electrodepositing amorphous alloy
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JPH0230790A (en) * 1988-07-15 1990-02-01 Seiko Instr Inc Method for electrodepositing alloy
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316786A (en) * 1980-09-19 1982-02-23 The United States Of America As Represented By The United States Department Of Energy Apparatus for electroplating particles of small dimension
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
JPH06330395A (en) * 1993-05-17 1994-11-29 Nippon Techno Kk Method for barrel plating of chromium and device therefor
EP0915182A1 (en) * 1997-10-21 1999-05-12 Nihon Techno Kabushiki Kaisha Plating method
JPH11274107A (en) * 1998-03-24 1999-10-08 Japan Energy Corp Copper plating method and aqueous copper plating agent
WO1999054527A2 (en) * 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
WO2000020662A1 (en) * 1998-10-05 2000-04-13 Semitool, Inc. Submicron metallization using electrochemical deposition
JP2000129490A (en) * 1998-10-21 2000-05-09 Ebara Corp Electroplating method and electroplating device

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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06) *

Also Published As

Publication number Publication date
TW526295B (en) 2003-04-01
CN1335419A (en) 2002-02-13
KR100461908B1 (en) 2004-12-14
HK1041715A1 (en) 2002-07-19
JP2002121699A (en) 2002-04-26
KR20010107788A (en) 2001-12-07
SG94828A1 (en) 2003-03-18
EP1164208A2 (en) 2001-12-19
US20010045360A1 (en) 2001-11-29
CA2349156A1 (en) 2001-11-25

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