HK1041715A1 - Electroplating method using combination of vibrational flow of plating bath and plating current of pulse - Google Patents

Electroplating method using combination of vibrational flow of plating bath and plating current of pulse

Info

Publication number
HK1041715A1
HK1041715A1 HK02103418.6A HK02103418A HK1041715A1 HK 1041715 A1 HK1041715 A1 HK 1041715A1 HK 02103418 A HK02103418 A HK 02103418A HK 1041715 A1 HK1041715 A1 HK 1041715A1
Authority
HK
Hong Kong
Prior art keywords
plating
pulse
combination
electroplating method
plating bath
Prior art date
Application number
HK02103418.6A
Other languages
Chinese (zh)
Inventor
大政龍晋
Original Assignee
日本科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本科技股份有限公司 filed Critical 日本科技股份有限公司
Publication of HK1041715A1 publication Critical patent/HK1041715A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
HK02103418.6A 2000-05-25 2002-05-06 Electroplating method using combination of vibrational flow of plating bath and plating current of pulse HK1041715A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2001129994A JP2002121699A (en) 2000-05-25 2001-04-26 Electroplating method using combination of vibrating flow and impulsive plating current of plating bath

Publications (1)

Publication Number Publication Date
HK1041715A1 true HK1041715A1 (en) 2002-07-19

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02103418.6A HK1041715A1 (en) 2000-05-25 2002-05-06 Electroplating method using combination of vibrational flow of plating bath and plating current of pulse

Country Status (9)

Country Link
US (1) US20010045360A1 (en)
EP (1) EP1164208A3 (en)
JP (1) JP2002121699A (en)
KR (1) KR100461908B1 (en)
CN (1) CN1335419A (en)
CA (1) CA2349156A1 (en)
HK (1) HK1041715A1 (en)
SG (1) SG94828A1 (en)
TW (1) TW526295B (en)

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US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US6884335B2 (en) * 2003-05-20 2005-04-26 Novellus Systems, Inc. Electroplating using DC current interruption and variable rotation rate
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
JP2006131926A (en) * 2004-11-02 2006-05-25 Sharp Corp Plating method for micropore, method for forming gold bump using the same, method for producing semiconductor device, and semiconductor device
JP4856896B2 (en) * 2005-06-02 2012-01-18 新光電気工業株式会社 Lead frame plating method and lead frame
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (en) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 Plating apparatus and plating method
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
CN101815812A (en) 2008-09-01 2010-08-25 日本科技股份有限公司 Liquid material comprising hydrogen and oxygen, regasified gas comprising hydrogen and oxygen produced from the liquid material, process and apparatus for producing the liquid material and regasified gas, and fuel that does not evolve carbon dioxide
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WO2012174732A1 (en) * 2011-06-24 2012-12-27 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248486A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Electron beam polishing of aluminum
JP5980735B2 (en) * 2012-08-07 2016-08-31 株式会社荏原製作所 Through-hole electroplating method and electroplating apparatus
CN102899708B (en) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 Cathode moving device for electroplating bath
CN104060304A (en) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 Acid tinning electrolyte
JP6463622B2 (en) * 2014-11-27 2019-02-06 Ykk株式会社 Plating equipment, plating unit, and plating line
JP6222145B2 (en) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
CN105862086B (en) * 2016-05-11 2017-09-22 吉首大学 Disk pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
CN105908215B (en) * 2016-05-11 2017-11-07 吉首大学 The double pulsating electrolysis deblending slots of ultrasonic pulse, sine wave fluted disc
CN105714331B (en) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 The double pulsating electrolysis deblending slots of sine wave fluted disc, magnetic cylinder
CN105862085B (en) * 2016-05-11 2017-09-19 吉首大学 Disk stirring pulse, sine wave fluted disc, the pulsating of magnetic cylinder three electrolysis deblending slot
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JP6329681B1 (en) * 2017-10-31 2018-05-23 株式会社荏原製作所 Plating apparatus and plating method
CN107952395A (en) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 Mix and stir vibrator
TWI690620B (en) * 2018-08-22 2020-04-11 華紹國際有限公司 Electroless plating device and manufacturing method of metallized substrate
CN109023494A (en) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 The horizontal Tumble-plating device of oscillatory type
CN110359069B (en) * 2019-07-16 2021-01-29 吉林大学 Liquid-phase multi-metal mixed additive manufacturing device and method
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Also Published As

Publication number Publication date
US20010045360A1 (en) 2001-11-29
CA2349156A1 (en) 2001-11-25
KR20010107788A (en) 2001-12-07
TW526295B (en) 2003-04-01
JP2002121699A (en) 2002-04-26
SG94828A1 (en) 2003-03-18
KR100461908B1 (en) 2004-12-14
CN1335419A (en) 2002-02-13
EP1164208A2 (en) 2001-12-19
EP1164208A3 (en) 2003-10-08

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