HK1041715A1 - 使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法 - Google Patents

使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法

Info

Publication number
HK1041715A1
HK1041715A1 HK02103418.6A HK02103418A HK1041715A1 HK 1041715 A1 HK1041715 A1 HK 1041715A1 HK 02103418 A HK02103418 A HK 02103418A HK 1041715 A1 HK1041715 A1 HK 1041715A1
Authority
HK
Hong Kong
Prior art keywords
plating
pulse
combination
electroplating method
plating bath
Prior art date
Application number
HK02103418.6A
Other languages
English (en)
Inventor
大政龍晋
Original Assignee
日本科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本科技股份有限公司 filed Critical 日本科技股份有限公司
Publication of HK1041715A1 publication Critical patent/HK1041715A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
    • B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
    • B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonics, vibrations
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
HK02103418.6A 2000-05-25 2002-05-06 使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法 HK1041715A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000155046 2000-05-25
JP2000243249 2000-08-10
JP2001129994A JP2002121699A (ja) 2000-05-25 2001-04-26 めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法

Publications (1)

Publication Number Publication Date
HK1041715A1 true HK1041715A1 (zh) 2002-07-19

Family

ID=27343513

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02103418.6A HK1041715A1 (zh) 2000-05-25 2002-05-06 使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法

Country Status (9)

Country Link
US (1) US20010045360A1 (zh)
EP (1) EP1164208A3 (zh)
JP (1) JP2002121699A (zh)
KR (1) KR100461908B1 (zh)
CN (1) CN1335419A (zh)
CA (1) CA2349156A1 (zh)
HK (1) HK1041715A1 (zh)
SG (1) SG94828A1 (zh)
TW (1) TW526295B (zh)

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US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
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JP4856896B2 (ja) * 2005-06-02 2012-01-18 新光電気工業株式会社 リードフレームのめっき方法およびリードフレーム
US20070012576A1 (en) * 2005-07-13 2007-01-18 Rohm And Haas Electronic Materials Llc Plating method
JP4458057B2 (ja) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 めっき装置及びめっき方法
US7876793B2 (en) 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US7728397B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
EP2319958A4 (en) 2008-09-01 2014-04-30 Japan Techno Co Ltd LIQUID MATERIAL WITH HYDROGEN AND OXYGEN, REGASSIFIED GAS WITH HYDROGEN AND OXYGEN PRODUCED FROM LIQUID MATERIAL, METHOD AND DEVICE FOR PRODUCING LIQUID MATERIAL AND REGASIFIED GAS AND FUEL WITHOUT CARBON DIOXIDE FORMULATION WITH LIQUID MATERIAL AND REGASIFIED GAS
JP5504147B2 (ja) * 2010-12-21 2014-05-28 株式会社荏原製作所 電気めっき方法
US9666426B2 (en) * 2011-06-24 2017-05-30 Acm Research (Shanghai) Inc. Methods and apparatus for uniformly metallization on substrates
US20130248374A1 (en) * 2012-03-23 2013-09-26 Apple Inc. Chemical polishing of aluminum
JP5980735B2 (ja) * 2012-08-07 2016-08-31 株式会社荏原製作所 スルーホールの電気めっき方法及び電気めっき装置
CN102899708B (zh) * 2012-11-05 2015-02-25 无锡宏联电镀设备有限公司 电镀槽用阴极移动装置
CN104060304A (zh) * 2014-06-13 2014-09-24 安徽省宁国天成电工有限公司 一种酸性镀锡电解液
JP6463622B2 (ja) * 2014-11-27 2019-02-06 Ykk株式会社 めっき装置、めっきユニット、及びめっきライン
JP6222145B2 (ja) * 2015-03-11 2017-11-01 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
CN105908215B (zh) * 2016-05-11 2017-11-07 吉首大学 超声波脉冲、正弦波齿盘双脉动式电解除杂槽
CN105862086B (zh) * 2016-05-11 2017-09-22 吉首大学 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
CN105714331B (zh) * 2016-05-11 2017-11-17 盐城云林环保工程有限公司 正弦波齿盘、磁筒双脉动式电解除杂槽
CN105862085B (zh) * 2016-05-11 2017-09-19 吉首大学 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽
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JP6329681B1 (ja) * 2017-10-31 2018-05-23 株式会社荏原製作所 めっき装置及びめっき方法
CN107952395A (zh) * 2017-11-27 2018-04-24 新乡市永振机械设备有限公司 拌和振动器
TWI690620B (zh) * 2018-08-22 2020-04-11 華紹國際有限公司 化學鍍裝置及金屬化基板的製造方法
CN109023494A (zh) * 2018-10-12 2018-12-18 扬州市金杨电镀设备有限公司 振动式卧式滚镀装置
CN110359069B (zh) * 2019-07-16 2021-01-29 吉林大学 一种液相多金属混合增材制造装置及方法
CN118103553A (zh) * 2022-12-16 2024-05-28 株式会社荏原制作所 镀覆装置及镀覆方法

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Also Published As

Publication number Publication date
TW526295B (en) 2003-04-01
CN1335419A (zh) 2002-02-13
EP1164208A3 (en) 2003-10-08
US20010045360A1 (en) 2001-11-29
EP1164208A2 (en) 2001-12-19
CA2349156A1 (en) 2001-11-25
KR20010107788A (ko) 2001-12-07
SG94828A1 (en) 2003-03-18
KR100461908B1 (ko) 2004-12-14
JP2002121699A (ja) 2002-04-26

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