CN1329916C - 用于运行中固定的软参考层的包围层读－写导体 - Google Patents

用于运行中固定的软参考层的包围层读－写导体 Download PDF

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Publication number
CN1329916C
CN1329916C CNB021033366A CN02103336A CN1329916C CN 1329916 C CN1329916 C CN 1329916C CN B021033366 A CNB021033366 A CN B021033366A CN 02103336 A CN02103336 A CN 02103336A CN 1329916 C CN1329916 C CN 1329916C
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China
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layer
ferromagnetic
read
write
surrounding
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Expired - Lifetime
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CNB021033366A
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Chinese (zh)
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CN1379408A (zh
Inventor
T·C·安东尼
M·沙马
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Samsung Electronics Co Ltd
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Hewlett Packard Co
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
CNB021033366A 2001-04-02 2002-01-31 用于运行中固定的软参考层的包围层读－写导体 Expired - Lifetime CN1329916C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/825,461 US6404674B1 (en) 2001-04-02 2001-04-02 Cladded read-write conductor for a pinned-on-the-fly soft reference layer
US09/825461 2001-04-02

Publications (2)

Publication Number Publication Date
CN1379408A CN1379408A (zh) 2002-11-13
CN1329916C true CN1329916C (zh) 2007-08-01

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Family Applications (1)

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CNB021033366A Expired - Lifetime CN1329916C (zh) 2001-04-02 2002-01-31 用于运行中固定的软参考层的包围层读－写导体

Country Status (6)

Country Link
US (1) US6404674B1 (enExample)
EP (1) EP1248265A3 (enExample)
JP (1) JP3942931B2 (enExample)
KR (1) KR100816746B1 (enExample)
CN (1) CN1329916C (enExample)
TW (1) TW541530B (enExample)

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US6552554B1 (en) * 2001-12-06 2003-04-22 The United States Of America As Represented By The Secretary Of The Navy Testing current perpendicular to plane giant magnetoresistance multilayer devices
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US6728132B2 (en) * 2002-04-03 2004-04-27 Micron Technology, Inc. Synthetic-ferrimagnet sense-layer for high density MRAM applications
US6780653B2 (en) * 2002-06-06 2004-08-24 Micron Technology, Inc. Methods of forming magnetoresistive memory device assemblies
US6707087B2 (en) 2002-06-21 2004-03-16 Hewlett-Packard Development Company, L.P. Structure of chalcogenide memory element
US6683815B1 (en) * 2002-06-26 2004-01-27 Silicon Magnetic Systems Magnetic memory cell and method for assigning tunable writing currents
US6744663B2 (en) * 2002-06-28 2004-06-01 Motorola, Inc. Circuit and method for reading a toggle memory cell
US7095646B2 (en) 2002-07-17 2006-08-22 Freescale Semiconductor, Inc. Multi-state magnetoresistance random access cell with improved memory storage density
US6885576B2 (en) * 2002-08-13 2005-04-26 Micron Technology, Inc. Closed flux magnetic memory
US6924539B2 (en) * 2002-08-30 2005-08-02 Hewlett-Packard Development Company, L.P. Magnetic memory cell having an annular data layer and a soft reference layer
US6577529B1 (en) * 2002-09-03 2003-06-10 Hewlett-Packard Development Company, L.P. Multi-bit magnetic memory device
US6801451B2 (en) * 2002-09-03 2004-10-05 Hewlett-Packard Development Company, L.P. Magnetic memory devices having multiple bits per memory cell
JP3788964B2 (ja) * 2002-09-10 2006-06-21 株式会社東芝 磁気ランダムアクセスメモリ
JP4596230B2 (ja) * 2002-09-13 2010-12-08 Ｔｄｋ株式会社 磁気メモリデバイスおよびその製造方法
JP4404182B2 (ja) * 2002-09-25 2010-01-27 Ｔｄｋ株式会社 磁気メモリデバイスおよびその読出方法
JP2004153181A (ja) * 2002-10-31 2004-05-27 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
US6740947B1 (en) * 2002-11-13 2004-05-25 Hewlett-Packard Development Company, L.P. MRAM with asymmetric cladded conductor
JP3906145B2 (ja) * 2002-11-22 2007-04-18 株式会社東芝 磁気ランダムアクセスメモリ
KR20050084340A (ko) * 2002-12-18 2005-08-26 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 집적 회로 장치, 집적 회로 메모리 장치 및 안티-탬퍼 장치
JP4365591B2 (ja) * 2003-01-17 2009-11-18 Ｔｄｋ株式会社 磁気メモリデバイスおよび書込電流駆動回路、並びに書込電流駆動方法
JP4720067B2 (ja) * 2003-01-24 2011-07-13 Ｔｄｋ株式会社 磁気記憶セルおよび磁気メモリデバイスならびに磁気メモリデバイスの製造方法
US6982901B1 (en) * 2003-01-31 2006-01-03 Hewlett-Packard Development Company, L.P. Memory device and method of use
US7056749B2 (en) * 2003-03-03 2006-06-06 Hewlett-Packard Development Company, L.P. Simplified magnetic memory cell
JP4419408B2 (ja) * 2003-03-14 2010-02-24 Ｔｄｋ株式会社 磁気抵抗効果素子および磁気メモリデバイス
US20040184311A1 (en) * 2003-03-18 2004-09-23 Manish Sharma Magnetic sensor
US6950919B2 (en) * 2003-03-26 2005-09-27 Hewlett-Packard Development Company, L.P. Computer system with operating system to dynamically adjust the main memory
JP4729836B2 (ja) * 2003-03-28 2011-07-20 Ｔｄｋ株式会社 磁気記憶セルおよび磁気メモリデバイスならびに磁気メモリデバイスの製造方法
AU2003219639A1 (en) * 2003-04-16 2004-11-04 Agency For Science, Technology And Research Magnetic memory device
US6785160B1 (en) 2003-04-29 2004-08-31 Hewlett-Packard Development Company, L.P. Method of providing stability of a magnetic memory cell
US7020009B2 (en) * 2003-05-14 2006-03-28 Macronix International Co., Ltd. Bistable magnetic device using soft magnetic intermediary material
US6865107B2 (en) * 2003-06-23 2005-03-08 Hewlett-Packard Development Company, L.P. Magnetic memory device
US6956763B2 (en) 2003-06-27 2005-10-18 Freescale Semiconductor, Inc. MRAM element and methods for writing the MRAM element
US6906941B2 (en) * 2003-07-22 2005-06-14 Hewlett-Packard Development Company, L.P. Magnetic memory structure
US6967366B2 (en) 2003-08-25 2005-11-22 Freescale Semiconductor, Inc. Magnetoresistive random access memory with reduced switching field variation
US6925003B2 (en) * 2003-09-08 2005-08-02 Hewlett-Packard Development Company, L.P. Magnetic memory cell structure
US6990012B2 (en) * 2003-10-07 2006-01-24 Hewlett-Packard Development Company, L.P. Magnetic memory device
JP4868431B2 (ja) * 2003-10-10 2012-02-01 Ｔｄｋ株式会社 磁気記憶セルおよび磁気メモリデバイス
US6911685B2 (en) * 2003-10-10 2005-06-28 Hewlett-Packard Development Company, L.P. Thermally-assisted magnetic memory structures
US7195927B2 (en) * 2003-10-22 2007-03-27 Hewlett-Packard Development Company, L.P. Process for making magnetic memory structures having different-sized memory cell layers
US6819586B1 (en) 2003-10-24 2004-11-16 Hewlett-Packard Development Company, L.P. Thermally-assisted magnetic memory structures
KR101001742B1 (ko) * 2003-10-24 2010-12-15 삼성전자주식회사 자기 램 및 그 제조방법
US7026673B2 (en) * 2003-12-11 2006-04-11 International Business Machines Corporation Low magnetization materials for high performance magnetic memory devices
US6956271B2 (en) * 2004-02-11 2005-10-18 Hewlett-Packard Development Company, L.P. Switching of soft reference layers of magnetic memory devices
US7193889B2 (en) * 2004-02-11 2007-03-20 Hewlett-Packard Development Company, Lp. Switching of MRAM devices having soft magnetic reference layers
JP3977816B2 (ja) * 2004-03-16 2007-09-19 株式会社東芝 磁気ランダムアクセスメモリ及びその磁気ランダムアクセスメモリのデータ書き込み方法
US7102920B2 (en) * 2004-03-23 2006-09-05 Hewlett-Packard Development Company, L.P. Soft-reference three conductor magnetic memory storage device
US7102921B2 (en) * 2004-05-11 2006-09-05 Hewlett-Packard Development Company, L.P. Magnetic memory device
CN100495567C (zh) * 2004-10-28 2009-06-03 中国科学院物理研究所 外围电路平衡驱动的磁随机存取存储器
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US7457149B2 (en) 2006-05-05 2008-11-25 Macronix International Co., Ltd. Methods and apparatus for thermally assisted programming of a magnetic memory device
US7760542B2 (en) 2008-04-21 2010-07-20 Seagate Technology Llc Spin-torque memory with unidirectional write scheme
US8233319B2 (en) 2008-07-18 2012-07-31 Seagate Technology Llc Unipolar spin-transfer switching memory unit
US7933146B2 (en) 2008-10-08 2011-04-26 Seagate Technology Llc Electronic devices utilizing spin torque transfer to flip magnetic orientation
US7933137B2 (en) 2008-10-08 2011-04-26 Seagate Teachnology Llc Magnetic random access memory (MRAM) utilizing magnetic flip-flop structures
US7940592B2 (en) 2008-12-02 2011-05-10 Seagate Technology Llc Spin-torque bit cell with unpinned reference layer and unidirectional write current
US8203870B2 (en) * 2010-11-23 2012-06-19 Seagate Technology Llc Flux programmed multi-bit magnetic memory

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EP0875901A2 (en) * 1997-04-28 1998-11-04 Canon Kabushiki Kaisha Magnetic thin-film memory element utilizing GMR effect, and magnetic thin-film memory
EP0910092A2 (en) * 1997-09-18 1999-04-21 Canon Kabushiki Kaisha Magnetic thin film memory element and recording/reproduction method using such memory element
JPH11154389A (ja) * 1997-09-18 1999-06-08 Canon Inc 磁気抵抗素子、磁性薄膜メモリ素子および該メモリ素子の記録再生方法
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Also Published As

Publication number Publication date
EP1248265A2 (en) 2002-10-09
JP2003007985A (ja) 2003-01-10
KR20030009094A (ko) 2003-01-29
US6404674B1 (en) 2002-06-11
JP3942931B2 (ja) 2007-07-11
TW541530B (en) 2003-07-11
CN1379408A (zh) 2002-11-13
EP1248265A3 (en) 2003-07-30
KR100816746B1 (ko) 2008-03-26

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C06 Publication
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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SAMSUNG ELECTRONICS CO., LTD

Free format text: FORMER OWNER: HEWLETT-PACKARD DEVELOPMENT COMPANY

Effective date: 20071228

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071228

Address after: Gyeonggi Do, South Korea

Patentee after: Samsung Electronics Co.,Ltd.

Address before: California, USA

Patentee before: Hewlett-Packard Co.

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Granted publication date: 20070801

CX01 Expiry of patent term