TW541530B - Cladded read-write conductor for a pinned-on-the-fly soft reference layer - Google Patents
Cladded read-write conductor for a pinned-on-the-fly soft reference layer Download PDFInfo
- Publication number
- TW541530B TW541530B TW090131647A TW90131647A TW541530B TW 541530 B TW541530 B TW 541530B TW 090131647 A TW090131647 A TW 090131647A TW 90131647 A TW90131647 A TW 90131647A TW 541530 B TW541530 B TW 541530B
- Authority
- TW
- Taiwan
- Prior art keywords
- ferromagnetic
- layer
- read
- magnetic
- memory cell
- Prior art date
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 112
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 287
- 230000005291 magnetic effect Effects 0.000 claims abstract description 252
- 230000015654 memory Effects 0.000 claims abstract description 156
- 230000005415 magnetization Effects 0.000 claims abstract description 84
- 238000005253 cladding Methods 0.000 claims abstract description 44
- 239000000696 magnetic material Substances 0.000 claims abstract description 34
- 230000035699 permeability Effects 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 425
- 239000011248 coating agent Substances 0.000 claims description 67
- 238000000576 coating method Methods 0.000 claims description 67
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- 238000004891 communication Methods 0.000 claims description 6
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- 230000006872 improvement Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910000889 permalloy Inorganic materials 0.000 claims description 3
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
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- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- -1 Tie Hua Gu Substances 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000003353 gold alloy Substances 0.000 claims 1
- 229910001004 magnetic alloy Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 116
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- 230000005641 tunneling Effects 0.000 description 18
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- 238000000137 annealing Methods 0.000 description 5
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- 238000012360 testing method Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
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- 239000000126 substance Substances 0.000 description 3
- 241001122767 Theaceae Species 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 235000012054 meals Nutrition 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000005610 quantum mechanics Effects 0.000 description 2
- 239000011257 shell material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910019041 PtMn Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
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- 238000007667 floating Methods 0.000 description 1
- 210000004517 glycocalyx Anatomy 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229940082629 iron antianemic preparations Drugs 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
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- 235000015067 sauces Nutrition 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/825,461 US6404674B1 (en) | 2001-04-02 | 2001-04-02 | Cladded read-write conductor for a pinned-on-the-fly soft reference layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW541530B true TW541530B (en) | 2003-07-11 |
Family
ID=25244051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090131647A TW541530B (en) | 2001-04-02 | 2001-12-20 | Cladded read-write conductor for a pinned-on-the-fly soft reference layer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6404674B1 (enExample) |
| EP (1) | EP1248265A3 (enExample) |
| JP (1) | JP3942931B2 (enExample) |
| KR (1) | KR100816746B1 (enExample) |
| CN (1) | CN1329916C (enExample) |
| TW (1) | TW541530B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7684234B2 (en) | 2006-05-05 | 2010-03-23 | Macronix International Co., Ltd. | Methods and apparatus for thermally assisted programming of a magnetic memory device |
Families Citing this family (67)
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|---|---|---|---|---|
| US6351409B1 (en) * | 2001-01-04 | 2002-02-26 | Motorola, Inc. | MRAM write apparatus and method |
| US6936903B2 (en) * | 2001-09-25 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Magnetic memory cell having a soft reference layer |
| US6504221B1 (en) * | 2001-09-25 | 2003-01-07 | Hewlett-Packard Company | Magneto-resistive device including soft reference layer having embedded conductors |
| US6538917B1 (en) * | 2001-09-25 | 2003-03-25 | Hewlett-Packard Development Company, L.P. | Read methods for magneto-resistive device having soft reference layer |
| US6545906B1 (en) | 2001-10-16 | 2003-04-08 | Motorola, Inc. | Method of writing to scalable magnetoresistance random access memory element |
| US6549447B1 (en) * | 2001-10-31 | 2003-04-15 | Peter Fricke | Memory cell structure |
| DE10158795B4 (de) * | 2001-11-30 | 2005-12-22 | Infineon Technologies Ag | Magnetoresistive Speicherzelle mit dynamischer Referenzschicht |
| US6661688B2 (en) * | 2001-12-05 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Method and article for concentrating fields at sense layers |
| US6552554B1 (en) * | 2001-12-06 | 2003-04-22 | The United States Of America As Represented By The Secretary Of The Navy | Testing current perpendicular to plane giant magnetoresistance multilayer devices |
| US6750491B2 (en) * | 2001-12-20 | 2004-06-15 | Hewlett-Packard Development Company, L.P. | Magnetic memory device having soft reference layer |
| US6593608B1 (en) * | 2002-03-15 | 2003-07-15 | Hewlett-Packard Development Company, L.P. | Magneto resistive storage device having double tunnel junction |
| US6728132B2 (en) * | 2002-04-03 | 2004-04-27 | Micron Technology, Inc. | Synthetic-ferrimagnet sense-layer for high density MRAM applications |
| US6780653B2 (en) * | 2002-06-06 | 2004-08-24 | Micron Technology, Inc. | Methods of forming magnetoresistive memory device assemblies |
| US6707087B2 (en) | 2002-06-21 | 2004-03-16 | Hewlett-Packard Development Company, L.P. | Structure of chalcogenide memory element |
| US6683815B1 (en) * | 2002-06-26 | 2004-01-27 | Silicon Magnetic Systems | Magnetic memory cell and method for assigning tunable writing currents |
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| US7095646B2 (en) | 2002-07-17 | 2006-08-22 | Freescale Semiconductor, Inc. | Multi-state magnetoresistance random access cell with improved memory storage density |
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| JP3788964B2 (ja) * | 2002-09-10 | 2006-06-21 | 株式会社東芝 | 磁気ランダムアクセスメモリ |
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| US6740947B1 (en) * | 2002-11-13 | 2004-05-25 | Hewlett-Packard Development Company, L.P. | MRAM with asymmetric cladded conductor |
| JP3906145B2 (ja) * | 2002-11-22 | 2007-04-18 | 株式会社東芝 | 磁気ランダムアクセスメモリ |
| KR20050084340A (ko) * | 2002-12-18 | 2005-08-26 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 집적 회로 장치, 집적 회로 메모리 장치 및 안티-탬퍼 장치 |
| JP4365591B2 (ja) * | 2003-01-17 | 2009-11-18 | Ｔｄｋ株式会社 | 磁気メモリデバイスおよび書込電流駆動回路、並びに書込電流駆動方法 |
| JP4720067B2 (ja) * | 2003-01-24 | 2011-07-13 | Ｔｄｋ株式会社 | 磁気記憶セルおよび磁気メモリデバイスならびに磁気メモリデバイスの製造方法 |
| US6982901B1 (en) * | 2003-01-31 | 2006-01-03 | Hewlett-Packard Development Company, L.P. | Memory device and method of use |
| US7056749B2 (en) * | 2003-03-03 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Simplified magnetic memory cell |
| JP4419408B2 (ja) * | 2003-03-14 | 2010-02-24 | Ｔｄｋ株式会社 | 磁気抵抗効果素子および磁気メモリデバイス |
| US20040184311A1 (en) * | 2003-03-18 | 2004-09-23 | Manish Sharma | Magnetic sensor |
| US6950919B2 (en) * | 2003-03-26 | 2005-09-27 | Hewlett-Packard Development Company, L.P. | Computer system with operating system to dynamically adjust the main memory |
| JP4729836B2 (ja) * | 2003-03-28 | 2011-07-20 | Ｔｄｋ株式会社 | 磁気記憶セルおよび磁気メモリデバイスならびに磁気メモリデバイスの製造方法 |
| AU2003219639A1 (en) * | 2003-04-16 | 2004-11-04 | Agency For Science, Technology And Research | Magnetic memory device |
| US6785160B1 (en) | 2003-04-29 | 2004-08-31 | Hewlett-Packard Development Company, L.P. | Method of providing stability of a magnetic memory cell |
| US7020009B2 (en) * | 2003-05-14 | 2006-03-28 | Macronix International Co., Ltd. | Bistable magnetic device using soft magnetic intermediary material |
| US6865107B2 (en) * | 2003-06-23 | 2005-03-08 | Hewlett-Packard Development Company, L.P. | Magnetic memory device |
| US6956763B2 (en) | 2003-06-27 | 2005-10-18 | Freescale Semiconductor, Inc. | MRAM element and methods for writing the MRAM element |
| US6906941B2 (en) * | 2003-07-22 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Magnetic memory structure |
| US6967366B2 (en) | 2003-08-25 | 2005-11-22 | Freescale Semiconductor, Inc. | Magnetoresistive random access memory with reduced switching field variation |
| US6925003B2 (en) * | 2003-09-08 | 2005-08-02 | Hewlett-Packard Development Company, L.P. | Magnetic memory cell structure |
| US6990012B2 (en) * | 2003-10-07 | 2006-01-24 | Hewlett-Packard Development Company, L.P. | Magnetic memory device |
| JP4868431B2 (ja) * | 2003-10-10 | 2012-02-01 | Ｔｄｋ株式会社 | 磁気記憶セルおよび磁気メモリデバイス |
| US6911685B2 (en) * | 2003-10-10 | 2005-06-28 | Hewlett-Packard Development Company, L.P. | Thermally-assisted magnetic memory structures |
| US7195927B2 (en) * | 2003-10-22 | 2007-03-27 | Hewlett-Packard Development Company, L.P. | Process for making magnetic memory structures having different-sized memory cell layers |
| US6819586B1 (en) | 2003-10-24 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Thermally-assisted magnetic memory structures |
| KR101001742B1 (ko) * | 2003-10-24 | 2010-12-15 | 삼성전자주식회사 | 자기 램 및 그 제조방법 |
| US7026673B2 (en) * | 2003-12-11 | 2006-04-11 | International Business Machines Corporation | Low magnetization materials for high performance magnetic memory devices |
| US6956271B2 (en) * | 2004-02-11 | 2005-10-18 | Hewlett-Packard Development Company, L.P. | Switching of soft reference layers of magnetic memory devices |
| US7193889B2 (en) * | 2004-02-11 | 2007-03-20 | Hewlett-Packard Development Company, Lp. | Switching of MRAM devices having soft magnetic reference layers |
| JP3977816B2 (ja) * | 2004-03-16 | 2007-09-19 | 株式会社東芝 | 磁気ランダムアクセスメモリ及びその磁気ランダムアクセスメモリのデータ書き込み方法 |
| US7102920B2 (en) * | 2004-03-23 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Soft-reference three conductor magnetic memory storage device |
| US7102921B2 (en) * | 2004-05-11 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Magnetic memory device |
| CN100495567C (zh) * | 2004-10-28 | 2009-06-03 | 中国科学院物理研究所 | 外围电路平衡驱动的磁随机存取存储器 |
| US7129098B2 (en) | 2004-11-24 | 2006-10-31 | Freescale Semiconductor, Inc. | Reduced power magnetoresistive random access memory elements |
| WO2007015358A1 (ja) | 2005-08-02 | 2007-02-08 | Nec Corporation | 磁気ランダムアクセスメモリ及びその動作方法 |
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| US7352613B2 (en) * | 2005-10-21 | 2008-04-01 | Macronix International Co., Ltd. | Magnetic memory device and methods for making a magnetic memory device |
| US7760542B2 (en) | 2008-04-21 | 2010-07-20 | Seagate Technology Llc | Spin-torque memory with unidirectional write scheme |
| US8233319B2 (en) | 2008-07-18 | 2012-07-31 | Seagate Technology Llc | Unipolar spin-transfer switching memory unit |
| US7933146B2 (en) | 2008-10-08 | 2011-04-26 | Seagate Technology Llc | Electronic devices utilizing spin torque transfer to flip magnetic orientation |
| US7933137B2 (en) | 2008-10-08 | 2011-04-26 | Seagate Teachnology Llc | Magnetic random access memory (MRAM) utilizing magnetic flip-flop structures |
| US7940592B2 (en) | 2008-12-02 | 2011-05-10 | Seagate Technology Llc | Spin-torque bit cell with unpinned reference layer and unidirectional write current |
| US8203870B2 (en) * | 2010-11-23 | 2012-06-19 | Seagate Technology Llc | Flux programmed multi-bit magnetic memory |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0875901B1 (en) * | 1997-04-28 | 2006-08-09 | Canon Kabushiki Kaisha | Magnetic thin-film memory element utilizing GMR effect, and magnetic thin-film memory |
| JPH11154389A (ja) * | 1997-09-18 | 1999-06-08 | Canon Inc | 磁気抵抗素子、磁性薄膜メモリ素子および該メモリ素子の記録再生方法 |
| US6111784A (en) * | 1997-09-18 | 2000-08-29 | Canon Kabushiki Kaisha | Magnetic thin film memory element utilizing GMR effect, and recording/reproduction method using such memory element |
| US6196930B1 (en) | 1997-11-12 | 2001-03-06 | Randy T. Aumock | Extension apparatus for golf club |
| US6169686B1 (en) | 1997-11-20 | 2001-01-02 | Hewlett-Packard Company | Solid-state memory with magnetic storage cells |
| DE19836567C2 (de) * | 1998-08-12 | 2000-12-07 | Siemens Ag | Speicherzellenanordnung mit Speicherelementen mit magnetoresistivem Effekt und Verfahren zu deren Herstellung |
| US5982660A (en) | 1998-08-27 | 1999-11-09 | Hewlett-Packard Company | Magnetic memory cell with off-axis reference layer orientation for improved response |
| US6072717A (en) * | 1998-09-04 | 2000-06-06 | Hewlett Packard | Stabilized magnetic memory cell |
| JP2000090658A (ja) * | 1998-09-09 | 2000-03-31 | Sanyo Electric Co Ltd | 磁気メモリ素子 |
| US6097626A (en) | 1999-07-28 | 2000-08-01 | Hewlett-Packard Company | MRAM device using magnetic field bias to suppress inadvertent switching of half-selected memory cells |
| US6172901B1 (en) | 1999-12-30 | 2001-01-09 | Stmicroelectronics, S.R.L. | Low power static random access memory and method for writing to same |
-
2001
- 2001-04-02 US US09/825,461 patent/US6404674B1/en not_active Expired - Lifetime
- 2001-12-20 TW TW090131647A patent/TW541530B/zh not_active IP Right Cessation
-
2002
- 2002-01-31 CN CNB021033366A patent/CN1329916C/zh not_active Expired - Lifetime
- 2002-03-27 EP EP02252274A patent/EP1248265A3/en not_active Withdrawn
- 2002-03-29 JP JP2002095682A patent/JP3942931B2/ja not_active Expired - Lifetime
- 2002-04-01 KR KR1020020017756A patent/KR100816746B1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7684234B2 (en) | 2006-05-05 | 2010-03-23 | Macronix International Co., Ltd. | Methods and apparatus for thermally assisted programming of a magnetic memory device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1248265A2 (en) | 2002-10-09 |
| JP2003007985A (ja) | 2003-01-10 |
| KR20030009094A (ko) | 2003-01-29 |
| US6404674B1 (en) | 2002-06-11 |
| JP3942931B2 (ja) | 2007-07-11 |
| CN1329916C (zh) | 2007-08-01 |
| CN1379408A (zh) | 2002-11-13 |
| EP1248265A3 (en) | 2003-07-30 |
| KR100816746B1 (ko) | 2008-03-26 |
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