CN1328777C - 探测片搬送装置及被接合体移动机构 - Google Patents

探测片搬送装置及被接合体移动机构 Download PDF

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Publication number
CN1328777C
CN1328777C CNB038001012A CN03800101A CN1328777C CN 1328777 C CN1328777 C CN 1328777C CN B038001012 A CNB038001012 A CN B038001012A CN 03800101 A CN03800101 A CN 03800101A CN 1328777 C CN1328777 C CN 1328777C
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CN
China
Prior art keywords
positioning
support
sheet
positioning pin
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB038001012A
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English (en)
Chinese (zh)
Other versions
CN1620723A (zh
Inventor
铃木胜
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1620723A publication Critical patent/CN1620723A/zh
Application granted granted Critical
Publication of CN1328777C publication Critical patent/CN1328777C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manipulator (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Automatic Assembly (AREA)
  • Decoration By Transfer Pictures (AREA)
CNB038001012A 2002-05-29 2003-04-30 探测片搬送装置及被接合体移动机构 Expired - Lifetime CN1328777C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP155175/2002 2002-05-29
JP2002155175A JP4134289B2 (ja) 2002-05-29 2002-05-29 プローブカード搬送装置及びアダプタ

Publications (2)

Publication Number Publication Date
CN1620723A CN1620723A (zh) 2005-05-25
CN1328777C true CN1328777C (zh) 2007-07-25

Family

ID=29561405

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038001012A Expired - Lifetime CN1328777C (zh) 2002-05-29 2003-04-30 探测片搬送装置及被接合体移动机构

Country Status (6)

Country Link
US (1) US6822464B2 (cg-RX-API-DMAC7.html)
JP (1) JP4134289B2 (cg-RX-API-DMAC7.html)
KR (1) KR100657058B1 (cg-RX-API-DMAC7.html)
CN (1) CN1328777C (cg-RX-API-DMAC7.html)
TW (1) TW200308047A (cg-RX-API-DMAC7.html)
WO (1) WO2003100847A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024727A (zh) * 2009-09-21 2011-04-20 东京毅力科创株式会社 加载器

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4391744B2 (ja) * 2002-12-27 2009-12-24 東京エレクトロン株式会社 移動式プローブカード搬送装置、プローブ装置及びプローブ装置へのプローブカードの搬送方法
JP2005265658A (ja) * 2004-03-19 2005-09-29 Tokyo Electron Ltd 複数種のテスタに対応可能なプローブ装置
JP2007147536A (ja) 2005-11-30 2007-06-14 Tokyo Electron Ltd プローブカード移載補助装置及び検査設備
JP2007256117A (ja) * 2006-03-23 2007-10-04 Fujitsu Ltd プリント回路基板試験装置、プリント回路基板試験方法、プリント回路基板試験プログラム、プリント回路基板製造方法
KR100847577B1 (ko) * 2006-12-27 2008-07-21 세크론 주식회사 프로빙 검사장치
KR100878211B1 (ko) * 2006-12-29 2009-01-13 세크론 주식회사 프로브스테이션 및 이를 이용한 웨이퍼 검사방법
EP2237052A1 (en) 2009-03-31 2010-10-06 Capres A/S Automated multi-point probe manipulation
KR101278890B1 (ko) * 2009-07-30 2013-06-26 가부시키가이샤 아드반테스트 프로브카드 홀딩장치 및 프로버
JP5196334B2 (ja) * 2010-11-29 2013-05-15 ワイアイケー株式会社 プローブカード固着ユニット
JP2013191737A (ja) 2012-03-14 2013-09-26 Tokyo Electron Ltd ウエハ検査装置
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
JP6220596B2 (ja) * 2013-08-01 2017-10-25 東京エレクトロン株式会社 プローバ
JP6267928B2 (ja) * 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
JP7539624B2 (ja) * 2022-01-17 2024-08-26 株式会社東京精密 ウェハテストシステム及びプローバ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01264235A (ja) * 1987-12-23 1989-10-20 Tokyo Electron Ltd ウエハプローバ
JPH05337780A (ja) * 1992-06-09 1993-12-21 Mazda Motor Corp ワークの保持方法およびその装置
US5812409A (en) * 1996-08-23 1998-09-22 Advantest Corporation Semiconductor device transport system with deformed tray compensation
CN1228160A (zh) * 1997-06-17 1999-09-08 株式会社爱德万测试 探测卡
JP2001024039A (ja) * 1999-07-09 2001-01-26 Tokyo Electron Ltd プローブカード搬送機構

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
US5290134A (en) * 1991-12-03 1994-03-01 Advantest Corporation Pick and place for automatic test handler
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
US5307011A (en) * 1991-12-04 1994-04-26 Advantest Corporation Loader and unloader for test handler
JP2606554Y2 (ja) * 1992-01-17 2000-11-27 株式会社東京精密 プロービング装置
US5528158A (en) * 1994-04-11 1996-06-18 Xandex, Inc. Probe card changer system and method
JP3689215B2 (ja) * 1997-02-20 2005-08-31 株式会社ルネサステクノロジ 半導体デバイスのテスト用搬送装置
US6034524A (en) * 1997-07-17 2000-03-07 International Business Machines Corporation Apparatus and method for testing flexible circuit substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01264235A (ja) * 1987-12-23 1989-10-20 Tokyo Electron Ltd ウエハプローバ
JPH05337780A (ja) * 1992-06-09 1993-12-21 Mazda Motor Corp ワークの保持方法およびその装置
US5812409A (en) * 1996-08-23 1998-09-22 Advantest Corporation Semiconductor device transport system with deformed tray compensation
CN1228160A (zh) * 1997-06-17 1999-09-08 株式会社爱德万测试 探测卡
JP2001024039A (ja) * 1999-07-09 2001-01-26 Tokyo Electron Ltd プローブカード搬送機構

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024727A (zh) * 2009-09-21 2011-04-20 东京毅力科创株式会社 加载器
CN102024727B (zh) * 2009-09-21 2013-04-17 东京毅力科创株式会社 加载器

Also Published As

Publication number Publication date
TW200308047A (en) 2003-12-16
US20040164756A1 (en) 2004-08-26
WO2003100847A1 (fr) 2003-12-04
US6822464B2 (en) 2004-11-23
KR20050005737A (ko) 2005-01-14
KR100657058B1 (ko) 2006-12-13
JP4134289B2 (ja) 2008-08-20
TWI297189B (cg-RX-API-DMAC7.html) 2008-05-21
CN1620723A (zh) 2005-05-25
JP2003344482A (ja) 2003-12-03

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Granted publication date: 20070725

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