CN1319158C - 具有铟热偶的电子组件的构造方法 - Google Patents

具有铟热偶的电子组件的构造方法 Download PDF

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Publication number
CN1319158C
CN1319158C CNB008126321A CN00812632A CN1319158C CN 1319158 C CN1319158 C CN 1319158C CN B008126321 A CNB008126321 A CN B008126321A CN 00812632 A CN00812632 A CN 00812632A CN 1319158 C CN1319158 C CN 1319158C
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CN
China
Prior art keywords
alloy
sheet
substance
semiconductor chip
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008126321A
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English (en)
Chinese (zh)
Other versions
CN1373903A (zh
Inventor
T·J·蒂松
P·W·楚里拉
D·H·普伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1373903A publication Critical patent/CN1373903A/zh
Application granted granted Critical
Publication of CN1319158C publication Critical patent/CN1319158C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB008126321A 1999-09-13 2000-08-29 具有铟热偶的电子组件的构造方法 Expired - Fee Related CN1319158C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/394,860 US6461891B1 (en) 1999-09-13 1999-09-13 Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US09/394,860 1999-09-13

Publications (2)

Publication Number Publication Date
CN1373903A CN1373903A (zh) 2002-10-09
CN1319158C true CN1319158C (zh) 2007-05-30

Family

ID=23560692

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008126321A Expired - Fee Related CN1319158C (zh) 1999-09-13 2000-08-29 具有铟热偶的电子组件的构造方法

Country Status (8)

Country Link
US (2) US6461891B1 (enExample)
JP (1) JP5030352B2 (enExample)
KR (1) KR20020035870A (enExample)
CN (1) CN1319158C (enExample)
AU (1) AU7088900A (enExample)
MX (1) MXPA02002649A (enExample)
MY (1) MY122678A (enExample)
WO (1) WO2001020673A1 (enExample)

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US6461891B1 (en) 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US6709898B1 (en) * 2000-10-04 2004-03-23 Intel Corporation Die-in-heat spreader microelectronic package
CN100362655C (zh) * 2002-01-30 2008-01-16 霍尼韦尔国际公司 热界面材料以及包括铟和锌的组合物
US6882041B1 (en) * 2002-02-05 2005-04-19 Altera Corporation Thermally enhanced metal capped BGA package
US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
DE10335111B4 (de) * 2003-07-31 2006-12-28 Infineon Technologies Ag Montageverfahren für ein Halbleiterbauteil
US7132746B2 (en) * 2003-08-18 2006-11-07 Delphi Technologies, Inc. Electronic assembly with solder-bonded heat sink
JP4411123B2 (ja) * 2004-03-31 2010-02-10 新光電気工業株式会社 放熱板の製造方法
JP2007266150A (ja) * 2006-03-28 2007-10-11 Fujitsu Ltd 熱伝導性接合材、半導体パッケージ、ヒートスプレッダ、半導体チップ、及び半導体チップとヒートスプレッダとを接合する接合方法
JP5211457B2 (ja) * 2006-09-19 2013-06-12 富士通セミコンダクター株式会社 半導体装置及びその製造方法
US7633151B2 (en) * 2007-03-16 2009-12-15 Advanced Micro Devices, Inc. Integrated circuit package lid with a wetting film
US7834442B2 (en) * 2007-12-12 2010-11-16 International Business Machines Corporation Electronic package method and structure with cure-melt hierarchy
JP5153316B2 (ja) * 2007-12-21 2013-02-27 新光電気工業株式会社 半導体パッケージ用放熱板およびそのめっき方法
US8378480B2 (en) * 2010-03-04 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy wafers in 3DIC package assemblies

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US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US5323265A (en) * 1989-08-31 1994-06-21 Aisin Seiki Kabushiki Kaisha Outside mirror for vehicle including a vibrator fixed to a one-piece supporting member separate from a holder member
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5863814A (en) * 1996-12-16 1999-01-26 International Business Machines Corporation Electronic package with compressible heatsink structure
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die

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US4092697A (en) 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4607277A (en) 1982-03-16 1986-08-19 International Business Machines Corporation Semiconductor assembly employing noneutectic alloy for heat dissipation
US4620215A (en) 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation
US4545840A (en) * 1983-03-08 1985-10-08 Monolithic Memories, Inc. Process for controlling thickness of die attach adhesive
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JPH04192552A (ja) 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
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JP3258764B2 (ja) * 1993-06-01 2002-02-18 三菱電機株式会社 樹脂封止型半導体装置の製造方法ならびに外部引出用電極およびその製造方法
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JPH10335383A (ja) * 1997-05-28 1998-12-18 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
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Publication number Priority date Publication date Assignee Title
US4034469A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US5323265A (en) * 1989-08-31 1994-06-21 Aisin Seiki Kabushiki Kaisha Outside mirror for vehicle including a vibrator fixed to a one-piece supporting member separate from a holder member
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5863814A (en) * 1996-12-16 1999-01-26 International Business Machines Corporation Electronic package with compressible heatsink structure
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die

Also Published As

Publication number Publication date
US20020151110A1 (en) 2002-10-17
AU7088900A (en) 2001-04-17
KR20020035870A (ko) 2002-05-15
US20020020912A1 (en) 2002-02-21
JP2003509865A (ja) 2003-03-11
MY122678A (en) 2006-04-29
US6461891B1 (en) 2002-10-08
CN1373903A (zh) 2002-10-09
MXPA02002649A (es) 2003-01-28
JP5030352B2 (ja) 2012-09-19
US6882043B2 (en) 2005-04-19
WO2001020673A1 (en) 2001-03-22

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Granted publication date: 20070530

Termination date: 20150829

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