CN1316560C - 输送和处理衬底的对接型系统和方法 - Google Patents
输送和处理衬底的对接型系统和方法 Download PDFInfo
- Publication number
- CN1316560C CN1316560C CNB2004100487305A CN200410048730A CN1316560C CN 1316560 C CN1316560 C CN 1316560C CN B2004100487305 A CNB2004100487305 A CN B2004100487305A CN 200410048730 A CN200410048730 A CN 200410048730A CN 1316560 C CN1316560 C CN 1316560C
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- China
- Prior art keywords
- substrate
- transfer member
- cleaning
- transfer
- buffer cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0044490A KR100500169B1 (ko) | 2003-07-02 | 2003-07-02 | 도킹형 기판 이송 및 처리 시스템과, 그를 이용한 이송 및 처리 방법 |
KR1020030044490 | 2003-07-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1577720A CN1577720A (zh) | 2005-02-09 |
CN1316560C true CN1316560C (zh) | 2007-05-16 |
Family
ID=33550241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100487305A Active CN1316560C (zh) | 2003-07-02 | 2004-06-15 | 输送和处理衬底的对接型系统和方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7065900B2 (zh) |
JP (1) | JP4391320B2 (zh) |
KR (1) | KR100500169B1 (zh) |
CN (1) | CN1316560C (zh) |
TW (1) | TWI259825B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2263371B1 (es) * | 2002-11-25 | 2008-01-16 | Industrias El Gamo, S.A. | Perfeccionamientos en el objeto de la patente principal n.200202704 por pistola de gas comprimido. |
KR100568069B1 (ko) | 2004-09-02 | 2006-04-05 | 한국전자통신연구원 | Tdma 통신 시스템에서의 반송파 및 도플러 주파수오차 추정 장치 및 그 방법 |
US7644512B1 (en) | 2006-01-18 | 2010-01-12 | Akrion, Inc. | Systems and methods for drying a rotating substrate |
KR100699128B1 (ko) * | 2006-03-24 | 2007-03-21 | 주식회사 디엠에스 | 기판 진공 건조 장치 |
US9834378B2 (en) | 2006-12-22 | 2017-12-05 | Brooks Automation, Inc. | Loader and buffer for reduced lot size |
KR100864262B1 (ko) * | 2008-05-19 | 2008-10-17 | 김명학 | 반도체 웨이퍼 세정장치 |
KR101331507B1 (ko) | 2010-08-09 | 2013-11-20 | 엘지디스플레이 주식회사 | 기판 세정/건조 장치와 이를 포함하는 기판 처리 장치, 그의 기판 세정/건조 방법, 및 디스플레이 패널의 제조 방법 |
JP5681412B2 (ja) * | 2010-08-27 | 2015-03-11 | 川崎重工業株式会社 | 板状部材収納用ラック、板状部材移載設備、及び板状部材収納方法 |
CN102064126B (zh) * | 2010-11-04 | 2013-04-17 | 友达光电股份有限公司 | 基板运输处理方法 |
CN102610548A (zh) * | 2011-01-20 | 2012-07-25 | 佶新科技股份有限公司 | 基板交换装置 |
JP6133120B2 (ja) | 2012-05-17 | 2017-05-24 | 株式会社荏原製作所 | 基板洗浄装置 |
AT16645U1 (de) * | 2012-05-30 | 2020-04-15 | Ev Group E Thallner Gmbh | Vorrichtung und Verfahren zum Bonden von Substraten |
KR102561186B1 (ko) * | 2018-04-19 | 2023-07-28 | 삼성디스플레이 주식회사 | 기재 부착 방법 및 기재 부착 장치 |
KR102596033B1 (ko) * | 2020-11-16 | 2023-11-01 | (주)에스티아이 | 포드 세정공정 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5135608A (en) * | 1989-07-11 | 1992-08-04 | Hitachi, Ltd. | Method of producing semiconductor devices |
CN1258093A (zh) * | 1998-11-06 | 2000-06-28 | 佳能株式会社 | 样品处理系统 |
US6187132B1 (en) * | 1997-03-13 | 2001-02-13 | Tokyo Electron Ltd. | Substrate treatment device and substrate transporting method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4923584A (en) * | 1988-10-31 | 1990-05-08 | Eaton Corporation | Sealing apparatus for a vacuum processing system |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
JP3416910B2 (ja) * | 1991-04-04 | 2003-06-16 | シーゲイト テクノロジィ リミテッド ライアビリティ カンパニー | スループットの高いスパッタリング装置及び方法 |
US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
JPH08313856A (ja) * | 1995-05-18 | 1996-11-29 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP3360001B2 (ja) * | 1996-10-30 | 2002-12-24 | 芝浦メカトロニクス株式会社 | 処理装置 |
TW423052B (en) * | 1999-09-06 | 2001-02-21 | Taiwan Semiconductor Mfg | Preprocess of metal silidation manufacturing process |
US6635528B2 (en) * | 1999-12-22 | 2003-10-21 | Texas Instruments Incorporated | Method of planarizing a conductive plug situated under a ferroelectric capacitor |
US6485988B2 (en) * | 1999-12-22 | 2002-11-26 | Texas Instruments Incorporated | Hydrogen-free contact etch for ferroelectric capacitor formation |
JP2002170823A (ja) * | 2000-09-19 | 2002-06-14 | Hitachi Kokusai Electric Inc | 半導体製造装置および半導体装置の製造方法並びにそれに使用されるカバー部材 |
JP3960087B2 (ja) * | 2001-05-30 | 2007-08-15 | 東京エレクトロン株式会社 | 搬送装置 |
JP2003243481A (ja) * | 2002-02-21 | 2003-08-29 | Asm Japan Kk | 半導体製造装置及びメンテナンス方法 |
JP4162420B2 (ja) * | 2002-04-16 | 2008-10-08 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2003
- 2003-07-02 KR KR10-2003-0044490A patent/KR100500169B1/ko active IP Right Grant
-
2004
- 2004-05-25 US US10/852,965 patent/US7065900B2/en active Active
- 2004-05-28 TW TW093115261A patent/TWI259825B/zh active
- 2004-06-01 JP JP2004163771A patent/JP4391320B2/ja active Active
- 2004-06-15 CN CNB2004100487305A patent/CN1316560C/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5135608A (en) * | 1989-07-11 | 1992-08-04 | Hitachi, Ltd. | Method of producing semiconductor devices |
US6187132B1 (en) * | 1997-03-13 | 2001-02-13 | Tokyo Electron Ltd. | Substrate treatment device and substrate transporting method |
CN1258093A (zh) * | 1998-11-06 | 2000-06-28 | 佳能株式会社 | 样品处理系统 |
Also Published As
Publication number | Publication date |
---|---|
KR100500169B1 (ko) | 2005-07-07 |
JP4391320B2 (ja) | 2009-12-24 |
KR20050004347A (ko) | 2005-01-12 |
JP2005026673A (ja) | 2005-01-27 |
CN1577720A (zh) | 2005-02-09 |
TW200513426A (en) | 2005-04-16 |
US7065900B2 (en) | 2006-06-27 |
TWI259825B (en) | 2006-08-11 |
US20050000110A1 (en) | 2005-01-06 |
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C06 | Publication | ||
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD. Effective date: 20140227 |
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TR01 | Transfer of patent right |
Effective date of registration: 20140227 Address after: Gyeonggi Do, South Korea Patentee after: Display Production Service Co., Ltd. Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd Address before: Gyeonggi Do, South Korea Patentee before: Display Production Service Co., Ltd. |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 264205 No. 88-1, Bekaert Road, Weihai Economic and Technological Development Zone, Weihai City, Shandong Province Patentee after: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd. Patentee after: DMS Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: DMS Co.,Ltd. Patentee before: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd. |
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CP03 | Change of name, title or address |