TWI259825B - Docking-type system and method for transferring and treating substrate - Google Patents

Docking-type system and method for transferring and treating substrate Download PDF

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Publication number
TWI259825B
TWI259825B TW093115261A TW93115261A TWI259825B TW I259825 B TWI259825 B TW I259825B TW 093115261 A TW093115261 A TW 093115261A TW 93115261 A TW93115261 A TW 93115261A TW I259825 B TWI259825 B TW I259825B
Authority
TW
Taiwan
Prior art keywords
substrate
transferring
docking
type system
treating
Prior art date
Application number
TW093115261A
Other languages
English (en)
Other versions
TW200513426A (en
Inventor
Yong-Seok Park
Kyung-Chul Kim
Sok-Joo Lee
Original Assignee
Dms Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33550241&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI259825(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dms Co Ltd filed Critical Dms Co Ltd
Publication of TW200513426A publication Critical patent/TW200513426A/zh
Application granted granted Critical
Publication of TWI259825B publication Critical patent/TWI259825B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW093115261A 2003-07-02 2004-05-28 Docking-type system and method for transferring and treating substrate TWI259825B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0044490A KR100500169B1 (ko) 2003-07-02 2003-07-02 도킹형 기판 이송 및 처리 시스템과, 그를 이용한 이송 및 처리 방법

Publications (2)

Publication Number Publication Date
TW200513426A TW200513426A (en) 2005-04-16
TWI259825B true TWI259825B (en) 2006-08-11

Family

ID=33550241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115261A TWI259825B (en) 2003-07-02 2004-05-28 Docking-type system and method for transferring and treating substrate

Country Status (5)

Country Link
US (1) US7065900B2 (zh)
JP (1) JP4391320B2 (zh)
KR (1) KR100500169B1 (zh)
CN (1) CN1316560C (zh)
TW (1) TWI259825B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448408B (zh) * 2010-08-27 2014-08-11 Kawasaki Heavy Ind Ltd A plate member storage case, a plate member transfer apparatus, and a plate member storage method

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ES2263371B1 (es) * 2002-11-25 2008-01-16 Industrias El Gamo, S.A. Perfeccionamientos en el objeto de la patente principal n.200202704 por pistola de gas comprimido.
KR100568069B1 (ko) 2004-09-02 2006-04-05 한국전자통신연구원 Ｔｄｍａ 통신 시스템에서의 반송파 및 도플러 주파수오차 추정 장치 및 그 방법
WO2007084952A2 (en) 2006-01-18 2007-07-26 Akrion Technologies, Inc. Systems and methods for drying a rotating substrate
KR100699128B1 (ko) * 2006-03-24 2007-03-21 주식회사 디엠에스 기판 진공 건조 장치
US9834378B2 (en) 2006-12-22 2017-12-05 Brooks Automation, Inc. Loader and buffer for reduced lot size
KR100864262B1 (ko) * 2008-05-19 2008-10-17 김명학 반도체 웨이퍼 세정장치
KR101331507B1 (ko) 2010-08-09 2013-11-20 엘지디스플레이 주식회사 기판 세정/건조 장치와 이를 포함하는 기판 처리 장치, 그의 기판 세정/건조 방법, 및 디스플레이 패널의 제조 방법
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
CN102610548A (zh) * 2011-01-20 2012-07-25 佶新科技股份有限公司 基板交换装置
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
AT16645U1 (de) * 2012-05-30 2020-04-15 Ev Group E Thallner Gmbh Vorrichtung und Verfahren zum Bonden von Substraten
KR102561186B1 (ko) * 2018-04-19 2023-07-28 삼성디스플레이 주식회사 기재 부착 방법 및 기재 부착 장치
KR102596033B1 (ko) * 2020-11-16 2023-11-01 (주)에스티아이 포드 세정공정
KR102565731B1 (ko) * 2020-11-16 2023-08-17 (주)에스티아이 포드 세정챔버

Family Cites Families (18)

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US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
EP0577766B1 (en) * 1991-04-04 1999-12-29 Seagate Technology, Inc. Apparatus and method for high throughput sputtering
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US5979475A (en) * 1994-04-28 1999-11-09 Hitachi, Ltd. Specimen holding method and fluid treatment method of specimen surface and systems therefor
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JPH08313856A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP3360001B2 (ja) * 1996-10-30 2002-12-24 芝浦メカトロニクス株式会社 処理装置
JPH10256345A (ja) * 1997-03-13 1998-09-25 Tokyo Electron Ltd 基板処理装置および基板搬送方法
JP2000150611A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
TW423052B (en) * 1999-09-06 2001-02-21 Taiwan Semiconductor Mfg Preprocess of metal silidation manufacturing process
US6485988B2 (en) * 1999-12-22 2002-11-26 Texas Instruments Incorporated Hydrogen-free contact etch for ferroelectric capacitor formation
US6635528B2 (en) * 1999-12-22 2003-10-21 Texas Instruments Incorporated Method of planarizing a conductive plug situated under a ferroelectric capacitor
JP2002170823A (ja) * 2000-09-19 2002-06-14 Hitachi Kokusai Electric Inc 半導体製造装置および半導体装置の製造方法並びにそれに使用されるカバー部材
JP3960087B2 (ja) * 2001-05-30 2007-08-15 東京エレクトロン株式会社 搬送装置
JP2003243481A (ja) * 2002-02-21 2003-08-29 Asm Japan Kk 半導体製造装置及びメンテナンス方法
JP4162420B2 (ja) * 2002-04-16 2008-10-08 大日本スクリーン製造株式会社 基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448408B (zh) * 2010-08-27 2014-08-11 Kawasaki Heavy Ind Ltd A plate member storage case, a plate member transfer apparatus, and a plate member storage method

Also Published As

Publication number Publication date
US20050000110A1 (en) 2005-01-06
JP2005026673A (ja) 2005-01-27
US7065900B2 (en) 2006-06-27
KR100500169B1 (ko) 2005-07-07
CN1577720A (zh) 2005-02-09
TW200513426A (en) 2005-04-16
CN1316560C (zh) 2007-05-16
KR20050004347A (ko) 2005-01-12
JP4391320B2 (ja) 2009-12-24

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