CN1316481A - 连接材料 - Google Patents

连接材料 Download PDF

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Publication number
CN1316481A
CN1316481A CN01112366A CN01112366A CN1316481A CN 1316481 A CN1316481 A CN 1316481A CN 01112366 A CN01112366 A CN 01112366A CN 01112366 A CN01112366 A CN 01112366A CN 1316481 A CN1316481 A CN 1316481A
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China
Prior art keywords
mentioned
electrode
trapping agent
metallic ion
ion trapping
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Granted
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CN01112366A
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CN1211450C (zh
Inventor
坂入干夫
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Dexerials Corp
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Sony Chemicals Corp
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Publication of CN1316481A publication Critical patent/CN1316481A/zh
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract

本发明提供了一种连接材料，该连接材料的粘结性、电连接性和绝缘性优良，将一对被连接部件的形成多个电极的面彼此贴合，在各被连接部件的相对电极间施加高电压或者高电流时，邻接的电极间不发生短路。在本发明的连接材料5中添加的金属离子捕集剂粒子8由铋系离子交换剂、或者乙烯基三嗪化合物构成，其平均粒径小于导电生粒子7，因此使用本发明的连接材料将被连接部件20、30贴合时，即使在相对的电极2、4间施加高电压的情况下，邻接的电极2、4也不发生短路。

Description

连接材料
本发明是关于用于连接具有相对的电极的被连接部件的连接材料，特别是关于适合于连接具有供给高电压、高电流的电极的被连接部件的连接材料。
作为用于连接具有相对的电极的被连接部件的连接材料，代替以往使用的软钎料，现在已经使用各向异性导电膜。这种各向异性导电膜是在热固性树脂中分散导电性粒子的连接材料，通过介于被连接部件之间，进行热压接，在电极间导电性粒子与电极接触，进行电连接，在电极不存在的部分以导电性粒子分散的状态树脂进行固化，做到邻接的电极间的绝缘及被连接部件彼此的机械粘结。
这样的各向异性导电膜具有各向异性导电性，即将相对的电极之间电连接，而邻接的电极间是绝缘的。在印刷电路板上实装半导体元件的场合，或者在印刷电路板上连接其他印刷电路板，例如软性印刷电路板的场合等正在使用，在通常的液晶显示器中在连接印刷电路板的场合也采用。
可是，这样的各向异性导电膜，一般适用于连接低电压、低电流的电极，在电极上施加高电压或者高电流时，不能确保电连接性乃至绝缘性。例如，在等离子显示板中需要施加50V以上500V以下、500mA以上2A以下的高电压、高电流，因而在等离子显示板和软性印刷电路板的连接时，利用各向异性导电膜进行连接有困难，目前仍然在利用软钎料的连接。
本发明人调查了在高电压或者高电流的情况下不能使用各向异性导电膜的原因，结果发现，由于通电时电极的金属离子的迁移，邻接的电极间发生短路，这是主要的原因。越是高电压或者越是高电流，这样的迁移就越大。
本发明的目的是提供粘结性、电连接性、绝缘性优良，即使施加高电压或者高电流时，邻接的电极间也不发生短路，能够用于具有高电压或者高电流用的相对电极的被连接部件的连接材料。
本发明是用于连接具有相对电极的被连接部件的连接材料，连接材料具有导电性粒子、捕集从上述电极游离的金属离子的金属离子捕集剂粒子以及以热固性树脂为主成分的树脂成分，上述金属离子捕集剂的平均粒径比上述导电性粒子的平均粒径小。
本发明是上述金属离子捕集剂粒子含有铋系离子交换剂或者乙烯基三嗪(ビニルトリジァニン)化合物的至少一种的连接材料。
本发明是相对100重量份数上述树脂成分，以1.5重量份数以上、60重量份数以下的范围添加上述金属离子捕集剂粒子的连接材料。
本发明是相对100重量份数上述树脂成分，以3重量份数以上、50重量份数以下的范围添加上述金属离子捕集剂粒子的连接材料。
本发明是上述导电性粒子的平均粒径处于1μm以上、60μm以下的范围，上述金属离子捕集剂粒子的平均粒径处于0.1μm以上、不到10μm范围的连接材料。
本发明是上述金属离子捕集剂粒子的比表面积处于0.8m2/g以上、100m2/g以下范围的连接材料。
本发明是具有相对电极和以配置在上述电极之间的状态进行热固化、使上述电极相互间至少进行电连接的连接材料的连接体，上述连接材料具有导电性粒子、捕集从上述电极游离的金属离子的金属离子捕集剂粒子及以热固性树脂为主成分的树脂成分，上述金属离子捕集剂粒子的平均粒径小于上述导电性粒子的平均粒径，在上述相对电极上施加的电压为50V以上、500V以下范围。
在本发明中，作为连接对象的被连接部件，可以是所有具有相对的电极，尤其是具有多个电极的部件，特别适合于连接下述的部件，即该连接部件具有施加50V以上、500V以下的范围、特别70V以上、300V以下范围的高电压或者100mA以上、10A以下的范围、特别200mA以上、5A以下范围的高电流的电极。作为这样的被连接部件的连接，可举出上述的等离子显示板或者其驱动用的印刷电路板与连接它们的软性印刷电路板的连接等。
作为构成这些被连接部件的基板，可举出玻璃基板、树脂基板等，在软性印刷电路板上大多使用由聚酰亚胺树脂构成的树脂基板。作为在这些基板上形成的电极，可举出含有银、铜、镍、铬等、作为金属离子离析的金属的电极，但也可以含有不离析的金属。
本发明的连接材料含有热固性树脂、导电性粒子和金属离子捕集剂，使该连接材料介于被连接部件之间，从两侧加压，压紧相对的电极，使之与导电性粒子接触，使树脂集中在不存在电极的部分，在该部分中以分散导电性粒子的状态进行固化而粘结，由此进行电连接和机械粘结固定。
作为在本发明的连接材料中使用的热固性树脂的主剂树脂，可以没有限制地使用环氧树脂、聚氨酯树脂、酚醛树脂、含有羟基的聚酯树脂、含有羟基的丙烯酸树脂等通过与固化剂并用、在加热下或者在紫外线等光照射下进行固化的树脂，从其固化温度、时间、保存稳定性等的平衡考虑，最好是环氧树脂。
作为环氧树脂可以使用双酚型环氧树脂、环氧线型酚醛树脂或者在分子内具有2个以上的环氧乙烷基的环氧化合物等。对于这些树脂来说，可以原封不动地使用市售品。
上述的热固性树脂的主剂树脂，一般可以通过与固化剂并用进行固化反应，但在结合对主剂树脂给予固化反应的官能基的情况下，可以省略固化剂。作为固化剂可以使用咪唑、胺、酸酐、酰肼、双氰胺、它们的改性物等，通过加热、光照射与主剂树脂发生反应而进行固化反应的固化剂，也可以使用市售品。作为这样的固化剂最好是潜在性固化剂。
潜在性固化剂是在常温下制造、保存以及在利用40℃以上、100℃以下范围的较低温度条件的干燥时不进行固化反应，而通过在固化温度下的加热加压(热压接)或者紫外线等光照射进行固化反应的固化剂。
作为这样的潜在性固化剂，尤其最好是将咪唑、胺等上述固化剂成分微胶囊化的潜在性固化剂等，也可以原封不动地使用市售品。在热活性的情况下，作为固化开始温度，最好处于80℃以上、150℃以下的范围。
作为导电性粒子，可以使用软钎料、镍等金属粒子、通过电镀等用导电材料涂敷由高分子有机化合物构成的核材粒子的导电材料涂敷粒子，或者用绝缘树脂涂敷这些导电性粒子的绝缘材料涂敷导电性粒子等。这些导电性粒子的平均粒径处于1μm以上、20μm以下，最好处于3μm以上、不到10μm的范围。在本发明中，所谓平均粒径表示粒子直径的平均值。
金属离子捕集剂是构成材料从电极作为金属离子进行离析时，捕集该金属离子而防止其迁移的化合物，可以使用离子交换剂、配位剂等，可以是无机质的，也可以是有机质的。作为无机质的金属离子捕集剂，例如可举出铋系离子交换剂、锑系离子交换剂、铋·锑系离子交换剂等，作为有机质的金属离子捕集剂，可举出乙烯基三嗪化合物等。
铋系离子交换剂是含有铋作为构成成分的离子交换剂，可举出BiO(OH)、BiO(OH)0.7(NO3)0.3、BiO(OH)0.74(NO3)0.15(HSiO3)0.11等。锑系离子交换剂是含有锑作为构成成分的离子交换剂，可举出Sb2O2·2H2O等。铋·锑系离子交换剂是含有铋和锑作为构成成分的离子交换剂，可举出以任意的比例，例如以5∶5以上、7∶3以下的比例配合上述铋系离子交换剂和锑系离子交换剂的组合物等。
推测这些离子交换剂通过阳离子交换捕集金属离子。
乙烯基三嗪化合物可举出乙烯基三嗪、其衍生物或者它们的酸加成物等。其中最好是以下述式(1)表示的2,4-二氨基-6-乙烯基-s-三嗪、以式(2)表示的2,4-二氨基-6-乙烯基-s-三嗪·三聚异氰酸加成物以及以式(3)表示的2,4-二氨基-6-甲基丙烯酰氧基乙基-s-三嗪·三聚异氰酸加成物。推测这些三嗪化合物通过形成配位化合物捕集离析的金属离子。【化1】
Figure A0111236600061
【化2】
Figure A0111236600062
【化3】
Figure A0111236600071
上述的金属离子捕集剂使用比导电性粒子小的粒径。作为这样的金属离子捕集剂，其平均粒径处于0.1μm以上、不到10μm的范围，最好处于0.1μm以上、3μm以下的范围，由于金属离子捕集剂的平均粒径小于导电性粒子的平均粒径，因此能够使连接时的电连接性良好。
另外，金属离子捕集剂的比表面积处于0.8m2/g以上、100m2/g以下的范围，最好处于1m2/g以上、50m2/g以下的范围，由此和金属离子的接触机会增多，能够有效地防止金属离子的迁移。
在本发明中，除了上述的各成分以外，为了对连接材料赋予涂布性或者薄膜成形性，可以配合热塑性树脂。作为这样的热塑性树脂可以使用苯氧树脂、聚酯树脂、丙烯酸树脂等。
除此以外，根据需要，在本发明的连接材料中可以配合其他的添加剂。作为其他添加剂，例如为了提高和玻璃基板的亲和性，可举出硅烷偶合剂、表面活性剂、防老化剂等。
相对于热固性树脂，热塑性树脂的配合比例可以是0重量％以上、100重量％以下，最好是0重量％以上、99重量％以下。相对这些树脂成分的合计重量，配合1重量％以上、60重量％以下，最好3重量％以上、50重量％以下的金属离子捕集剂。其他添加剂的配合比，在粘结剂成分中可以是10重量％以下，最好是5重量％以下。相对上述各成分构成的连接材料，导电性粒子的配合比可以是1体积％以上、50体积％以下，最好是1体积％以上、30体积％以下。
本发明的连接材料可以制成糊状或薄膜状形态的制品。在制成糊状时，根据材料的选择，可以不使用溶剂制成糊状，但一般可以在溶剂中溶解或分散上述的各成分而制成糊状。作为溶剂，可以使用像醇类、酮类、酯类、醚类、酚类、缩醛类、含氮烃等溶剂，例如甲苯、甲基乙基酮、乙酸乙酯、乙酸溶纤剂等。相对于树脂成分，溶剂的使用量是约20重量％以上、40重量％以下。
在制成薄膜状时，可以将上述的糊涂布在经过剥离处理的聚对苯二甲酸乙二醇酯等剥离薄片上形成薄膜状，通过使溶剂挥发而成形。
使用本发明的连接材料，在连接等离子显示板或软性印刷电路板等被连接材料时，以在这些被连接部件之间介入本发明的被连接材料的状态，从被连接材料的两侧加压、加热，使树脂固化进行连接。在连接材料是糊状的情况下，在包括被连接部件的电极的连接区域涂布连接材料，干燥后或者不进行干燥，重叠被连接部件进行压接、固化。在连接材料是薄膜状的情况下，使连接材料介于被连接部件之间进行加压、加热、固化。
在上述的连接过程中，以在被连接部件之间介入连接材料的状态进行加热，使连接材料的树脂溶化，加压时，连接材料的树脂就从电极的相对部分流入没有电极的部分，导电性粒子残留在电极间，在电极间进行接触而压接。流入没有电极部分的树脂成分，以在该部分分散导电性粒子的状态发生固化，使被连接部件间固定。借此进行电极间的电连接和被连接部件间的机械粘结固定。
作为使连接材料固化的方法，除了加热以外，也可以通过紫外线等光照射进行。此时，作为连接材料的树脂成分，不是热固性树脂，而最好使用以光聚合性的树脂为主成分的树脂。
本发明的连接材料使用粒径小于导电性粒子的小粒径金属捕集剂，因此即使在电极的间距、面积和间隔狭小的情况下，也能良好地进行机械固定和电连接。
以下，参照附图说明本发明的实施方式。
图1(a)是示意地表示利用实施方式的连接材料进行连接中的状态的断面图，(b)是示意地表示连接后的状态的断面图。
在图1中，符号20表示在等离子显示板等平板显示器中使用的面板。
该面板20具有玻璃基板1，在玻璃基板1的表面上形成由制成规定形状图案的银薄膜构成的电极2。
另外，图1的符号30表示软性印刷电路板，该软性印刷电路板30具有由聚酰亚胺构成的树脂薄膜3。
在软性印刷电路板30的树脂薄膜3的表面上形成电极4，电极4由形成规定形状图案的铜薄膜、在该铜薄膜表面形成的镀镍层、以及在该镀镍层表面上形成的镀金层构成。
为了连接上述的面板20和软性印刷电路板30，如图1(a)所示，以夹持形成薄膜状的本发明连接材料5的状态，使面板20的形成电极2的面和软性印刷电路板30的形成电极4的面相对地配置。
面板20的电极2和软性印刷电路板30表面的电极4预先设置成彼此相对的位置，这些电极2、4一边要相对位置地组合，一边用面板20和软性印刷电路板30夹住连接材料5，一边加热全体，一边进行挤压。
连接材料5具有以热固性树脂为主成分的树脂6、导电性粒子7以及粒径小于导电性粒子的小粒径金属离子捕集剂8，连接材料5的树脂6通过加热而熔融，流入面板20和软性印刷电路板30之间不存在电极电极2、4的部分(间隙)9中。
接着，使全体冷却，连接材料5的树脂6固化，得到如图1(b)所示的连接体10。
在电极2、4间残留导电性粒子7并与电极接触，在该状态树脂6发生固化收缩，电极2和电极4压接导电性粒子7，从而保持电的连接状态。在连接材料5中，作为金属离子捕集剂8使用粒径小于导电性粒子7的小粒径金属离子捕集剂，借此保持电极2、4和导电性粒子7的良好接触，能够得到优良的粘结强度和电连接的可靠性。
上述的实施方式虽然表示连接等离子显示板20和软性印刷电路板30的情况，但也能够适用于等离子显示板驱动用的印刷电路板和上述的软性印刷电路板20的连接，以及其他的被连接部件间的连接。
以下，说明本发明的实施例。
实施例1～7、比较例1～4
连接材料的调制
分别按下述表1、2的组成使用：作为树脂成分之一是热固性树脂的双酚A型环氧树脂(油化シェル公司制的商品名“828”)，作为固化剂的咪唑固化剂(四国化成工业公司制的商品名“2E4MZ”)，作为树脂成分之一的热塑性树脂苯氧树脂(东都化成公司制的商品名“YP50”)，导电性粒子(积水ファィン化学公司制的商品名“AU-205”，平均粒径5μm)，作为偶合剂的环氧硅烷(日本ュニカ-公司制的商品名“A187”)，作为金属离子捕集剂A的铋·锑系离子交换剂(东亚合成(株)社制的商品名“IXE-633”)，作为金属离子捕集剂B的乙烯基三嗪化合物2,4-二氨基-6-乙烯基-s-三嗪·三聚异氰酸加成物(四国化成工业公司制的商品名“VT·OK”)，作为金属离子捕集剂C的2,4-二氨基-6-甲基丙烯酰氧基乙基-s-三嗪·三聚异氰酸加成物(四国化成工业公司制的商品名“MAVT·OK”)。将它们溶解于甲苯中，得到11种糊状的连接材料。
接着，将这些糊状的连接材料分别涂布在聚对苯二甲酸乙二醇酯制剥离薄膜上，形成干燥膜厚40μm的各涂层，在80℃的热风循环式烘箱中放置5分钟，使甲苯挥发，得到实施例1～7、比较例1～4的薄膜状连接材料。
如下述表1、2所示，作为连接材料的组成，在实施例1～7和比较例1～4中，相对各自的50重量份数双酚A型环氧树脂，分别使用4重量份数固化剂、50重量份数苯氧树脂、2重量份数偶合剂，使导电性粒子的添加量达到连接材料全体的3体积％。
如下述表1所示，在实施例1～3中，作为金属离子捕集剂，使用铋·锑系离子交换剂(金属离子捕集剂A)，相对100重量份数由双酚A型环氧树脂和苯氧树脂构成的树脂成分的金属离子捕集剂添加量，在实施例1中是3重量份数，在实施例2中是25重量份数，在实施例3中是50重量份数。
在实施例4～6中，作为金属离子捕集剂，使用乙烯基三嗪化合物2,4-二氨基-6-乙烯基-s-三嗪·三聚异氰酸加成物(金属离子捕集剂B)，相对100重量份数由双酚A型环氧树脂和苯氧树脂构成的树脂成分的金属离子捕集剂添加量，在实施例4中是3重量份数，在实施例5中是25重量份数，在实施例6中是50重量份数。
在实施例7中，作为金属离子捕集剂，使用2,4-二氨基-6-甲基丙烯酰氧基乙基-s-三嗪·三聚异氰酸加成物(金属离子捕集剂C)，相对100重量份数由双酚A型环氧树脂和苯氧树脂构成的树脂成分的金属离子捕集剂添加量是25重量份数。
连接体的制作
在玻璃基板(旭玻璃公司制的商品名“PD200”)的表面上，以0.1mm的间隔形成多个由膜厚为8μm、宽度为0.1mm的银构成的电极，制成11块由玻璃基板和电极构成的面板。
与此不同，在由聚酰亚胺树脂构成的树脂薄膜表面上，以0.1mm的间隔形成多个膜厚为18μm、宽度为0.1mm的电极，制成11块由树脂薄膜和电极构成的软性印刷电路板。
在此，作为软性印刷电路板的电极，使用由在树脂薄膜表面上形成的铜薄膜、在铜薄膜表面上形成的镍被膜以及在镍被膜表面上形成的镀金被膜构成的电极。
分别使这些面板的形成电极的面和软性印刷电路板的形成电极的面相对，分别夹持按上述制成的实施例1～7、比较例1～4的薄膜状连接材料，在200℃、以40kgf/cm2热压接10分钟，得到实施例1～7、比较例1～4的连接体。
使用这些实施例1～7、比较例1～4的连接体进行下述所示的“导通试验”、“绝缘试验”。
导通试验
向实施例1～7、比较例1～4的各连接体的面板和软性印刷电路板的电极通电，测定连接体的电阻。被检测的电阻值不到5Ω者评定为○,5Ω以上、不到10Ω者评定为△,10Ω以上者评定为×。这些结果示于下述表1、2中。
绝缘试验
测定实施例1～7、比较例1～4的各连接体的、隔着连接材料而彼此邻接的面板和软性印刷电路板的电极的绝缘电阻值，以这些测定值作为初期绝缘电阻值，记载于下述表1、2中。
接着，在60℃、相对湿度85％的高温高湿条件中分别放置实施例1～7、比较例1～4的各连接体，在该高温高湿条件下，在软性印刷电路板和面板的邻接的电极间一边分别施加100V直流电压，一边定时测定各连接体的隔着连接材料彼此邻接的面板和软性印刷电路板的电极的绝缘电阻值。
在高温高湿下，施加100小时的100V直流电压，以绝缘电阻值是106Ω以上作为合格，在经过100时间之前未达到106Ω作为不合格。以这些结果作为高温高湿施加电压试验，该试验结果以合格作为○，记载于下述表1、2中，不合格的情况，将不到106Ω的时的时间记载于下述表1、2中。
表1：连接材料的组成和连接试验的评价结果(实施例)
  实施例1   实施例2  实施例3  实施例4  实施例5  实施例6  实施例7
连接材料的组成 双酚A型环氧树脂     50     50    50    50     50     50     50
固化剂     4     4    4    4     4     4     4
苯氧树脂     50     50    50    50     50     50     50
导电性粒子     3     3    3    3     3     3     3
偶合剂     2     2    2    2     2     2     2
金属离子捕集剂A     3     25    50    0     0     0     0
金属离子捕集剂B     0     0    0    3     25     50     0
金属离子捕集剂C     0     0    0    0     0     0     25
金属离子捕集剂的平均粒径(μm)     2     2    2    2     2     2     2
金属离子捕集剂的比表面积(m2/g)     1.2     1.2    1.2    1.2     1.2     1.2     1.2
连接试验的评价结果 导通试验     ○     ○    △    ○     ○     △     ○
绝缘试验 初期绝缘电阻值(Ω) 1011 1011 1011 1011 1011 1011 1011
高温高湿施加电压试验 ○ ○ ○ ○ ○ ○ ○
*在上述表1的“连接材料的组成”中，双酚A型环氧树脂、固化剂、苯氧树脂、偶合剂、金属离子捕集剂A～C的单位分别是重量份数，导电性粒子的单位是在连接材料全体中占有的导电性粒子的体积(体积％)。
表2：连接材料的组成和连接试验的评价结果(比较例)
 比较例1  比较例2  比较例3 比较例4
连接材料的组成 双酚A型环氧树脂     50     50     50     50
固化剂     4     4     4     4
苯氧树脂     50     50     50     50
导电性粒子     3     3     3     3
偶合剂     2     2     2     2
金属离子捕集剂A     0     70     0     0
金属离子捕集剂B     0     0     100     25
金属离子捕集剂C     0     0     0     0
金属离子捕集剂的平均粒径(μm)     -     2     2     10
金属离子捕集剂的比表面积(m2/g)     -     1.2     1.2     1.5
连接试验的评价结果 导通试验     ○     ×     ×     ×
绝缘试验 初期绝缘电阻值(Ω) 1011 1011 1011 1011
高温高湿施加电压试验 12 ○ ○ ○
*在上述表1的“连接材料的组成”中，双酚A型环氧树脂、固化剂、苯氧树脂、偶合剂、金属离子捕集剂A～C的单位分别是重量份数，导电性粒子的单位是在连接材料全体中占有的导电性粒子的体积(体积％)。
从表1、2的结果可知，金属离子捕集剂的添加量相对100重量份数树脂成分是0重量份数的比较例1，绝缘电阻值显著地降低，金属离子捕集剂的添加量相对100重量份数树脂成分是70重量份数以上的比较例2、3，在“导通试验”中，连接体的电阻值大，电连接性劣化。
另一方面，金属离子捕集剂的添加量相对100重量份数树脂成分处于3重量份数以上、50重量份数以下的实施例1～7，“导通试验”和“绝缘试验”的结果优良。
正如这些结果所清楚地表明，相对100重量份数树脂成分的金属离子捕集剂的添加量，其下限为超过0重量份数、而且处于3重量份数以下的范围，其上限为处于50重量份数以上、不到70重量份数的范围。
因此，在本发明的连接材料中，金属离子捕集剂的优选添加量推测为其下限范围的中间以上、其上限范围的中间以下，即相对100重量份数树脂成分最好处于1.5重量份数以上、60重量份数以下的范围。
另外，在金属离子捕集剂的平均粒径比导电性粒子的平均粒径大的比较例4中，电连接性低下。
以上虽然说明了将连接材料5形成薄膜状，用于软性印刷电路板和面板的连接的情况，但本发明并不限于此，例如，作为连接材料也可以使用糊状物。
参照图2(a)，图2(a)的符号20和符号30分别表示和图1所示相同的面板和软性印刷电路板，为了连接这些面板20和软性印刷电路板30，首先，在面板20的形成电极2的面上涂布形成糊状的本发明连接材料，形成由糊状的连接材料构成的涂布层15。
接着，如图2(a)所示，使软性印刷电路板30的形成电极4的面和面板20的形成涂布层15的面相对，使软性印刷电路板30和面板20的电极2、4彼此相对地形成位置组合，使软性印刷电路板30的电极4压接涂布层15的表面。
随后，一边挤压全体，一边加热，通过加热使涂布层15中的树脂16的粘度降低，树脂流入在面板20和软性印刷电路板30之间不存在电极2、4的部分9中。
接着，冷却全体，树脂16固化，得到如图2(b)的符号50所示的连接体。
和图1(b)所示的连接体10相同，图2(b)所示的连接体50通过残留在电极2、4之间的导电性粒子17进行电连接，在构成连接材料层15的连接材料中使用平均粒径小于导电性粒子17的小粒径金属离子捕集剂18，借此提高电极2、4的电连接的可靠性。
即使在上述的实施方式中，在连接等离子显示板和软性印刷电路板时或等离子显示板驱动用的印刷电路板和软性印刷电路板的连接、其他的被连接部件间的连接中都能够使用。
按照本发明，使用热固性树脂、导电性粒子和粒径小于导电性粒子的小粒径的金属离子捕集剂，因此粘结性、电连接性、绝缘性优良，即使在施加高电压或者高电流的情况下，邻接的电极间也不发生短路，能够用于具有高电压或者高电流用的相对电极的被连接部件的连接。
这样连接的等离子显示板与软性印刷电路板的连接体，在电极上施加高电压或者高电流而使用时，由于施加高电压或高电流而从电极上离析的金属离子被金属离子捕集剂捕集，因此不会发生由迁移而引起的邻接电极的短路。
图1(a)是示意地表示利用本实施方式的薄膜状连接材料进行连接中的状态断面图，(b)是示意地表示连接后的状态断面图。
图2(a)是示意地表示利用本实施方式的糊状连接材料进行连接中的状态断面图，(b)是示意地表示连接后的状态断面图。

Claims (7)

1．连接材料，它是用于连接具有相对电极的被连接部件的连接材料，其特征在于，具有导电性粒子、捕集从上述电极游离的金属离子的金属离子捕集剂粒子及以热固性树脂为主成分的树脂成分，上述金属离子捕集剂的平均粒径小于上述导电性粒子的平均粒径。
2．权利要求1所述的连接材料，其中，上述金属离子捕集剂粒子含有铋系离子交换剂或者乙烯基三嗪化合物中的至少一方。
3．权利要求2所述的连接材料，其中，相对100重量份数的上述树脂成分，添加1.5重量份数以上、60重量份数以下的上述金属离子捕集剂粒子。
4．权利要求2所述的连接材料，其中，相对100重量份数的上述树脂成分，添加3重量份数以上、50重量份数以下的上述金属离子捕集剂粒子。
5．权利要求2所述的连接材料，其中，上述导电性粒子的平均粒径处于1μm以上、60μm以下的范围，上述金属离子捕集剂粒子的平均粒径处于0.1μm以上、不到10μm的范围
6．权利要求2所述的连接材料，其中，上述金属离子捕集剂粒子的比表面积处于0.8m2/g以上、100m2/g以下的范围。
7．连接体，它是具有相对的电极和以配置在上述电极之间的状态进行热固化而将上述电极至少相互电连接的连接材料的连接体，其特征在于，上述连接材料具有导电性粒子、捕集从上述电极游离的金属离子的金属离子捕集剂粒子及以热固性树脂为主成分的树脂成分，上述金属离子捕集剂的平均粒径小于上述导电性粒子的平均粒径，在上述相对的电极上施加的电压是50V以上、500V以下的范围。
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CN103718253A (zh) * 2011-08-05 2014-04-09 积水化学工业株式会社 导电材料及连接结构体
CN104136623A (zh) * 2012-02-29 2014-11-05 生命扫描苏格兰有限公司 用于生物传感器中的聚合物聚(乙烯基-二氨基-三嗪)纳米颗粒
CN105493204A (zh) * 2015-10-29 2016-04-13 京东方科技集团股份有限公司 各向异性导电胶、绑定结构显示面板及其制备方法
CN110190042A (zh) * 2019-06-26 2019-08-30 云谷（固安）科技有限公司 绑定结构、绑定方法、显示面板及显示装置

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