CN1312246C - 可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物 - Google Patents

可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物 Download PDF

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Publication number
CN1312246C
CN1312246C CNB038079127A CN03807912A CN1312246C CN 1312246 C CN1312246 C CN 1312246C CN B038079127 A CNB038079127 A CN B038079127A CN 03807912 A CN03807912 A CN 03807912A CN 1312246 C CN1312246 C CN 1312246C
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CN
China
Prior art keywords
adhesive composition
solvent
cationically polymerizable
cationic polymerization
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038079127A
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English (en)
Chinese (zh)
Other versions
CN1646657A (zh
Inventor
山口裕顕
秋山良太
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1646657A publication Critical patent/CN1646657A/zh
Application granted granted Critical
Publication of CN1312246C publication Critical patent/CN1312246C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CNB038079127A 2002-04-01 2003-02-19 可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物 Expired - Fee Related CN1312246C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002099071A JP4201519B2 (ja) 2002-04-01 2002-04-01 カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP099071/2002 2002-04-01

Publications (2)

Publication Number Publication Date
CN1646657A CN1646657A (zh) 2005-07-27
CN1312246C true CN1312246C (zh) 2007-04-25

Family

ID=28786222

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038079127A Expired - Fee Related CN1312246C (zh) 2002-04-01 2003-02-19 可阳离子聚合的粘合剂组合物和各向异性导电粘合剂组合物

Country Status (10)

Country Link
EP (1) EP1490450B1 (enExample)
JP (1) JP4201519B2 (enExample)
KR (1) KR20040111454A (enExample)
CN (1) CN1312246C (enExample)
AT (1) ATE338102T1 (enExample)
AU (1) AU2003215305A1 (enExample)
DE (1) DE60308000T2 (enExample)
MY (1) MY133275A (enExample)
TW (1) TWI322172B (enExample)
WO (1) WO2003085062A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110325612A (zh) * 2017-02-22 2019-10-11 罗曼有限合资公司 可缠绕和冲压的粘合膜

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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JP4293187B2 (ja) 2003-06-25 2009-07-08 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP3977302B2 (ja) 2003-08-13 2007-09-19 キヤノン株式会社 露光装置及びその使用方法並びにデバイス製造方法
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
DE102009013710A1 (de) * 2009-03-20 2010-09-23 Merck Patent Gmbh Polymere aus Mischungen mit Vinylether-Monomeren
WO2011021441A1 (ja) * 2009-08-21 2011-02-24 Dic株式会社 カチオン重合性接着剤及びそれを用いて得られた偏光板
JP5643623B2 (ja) * 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
KR101671187B1 (ko) * 2010-12-31 2016-11-01 동우 화인켐 주식회사 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
JP2011102404A (ja) * 2011-02-17 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
CN102690611B (zh) * 2011-12-27 2015-06-24 3M中国有限公司 胶带组合物以及由其制备的胶带
JP6002518B2 (ja) * 2012-09-21 2016-10-05 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
TWI672351B (zh) 2018-08-21 2019-09-21 財團法人工業技術研究院 感光膠組合物、感光導電膠組合物及包含感光導電膠組合物之電子裝置
KR102878827B1 (ko) 2020-09-28 2025-11-03 삼성디스플레이 주식회사 타일드 표시 장치
WO2024257539A1 (ja) * 2023-06-16 2024-12-19 株式会社スリーボンド 導電性樹脂接着剤およびその硬化物
JP2025079120A (ja) * 2023-11-09 2025-05-21 株式会社レゾナック 回路接続構造体の製造方法、回路接続用接着剤フィルム、及び回路接続構造体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1554429A (en) * 1975-06-27 1979-10-24 Westinghouse Electric Corp Resin rich eposidemica flexible high voltage insulation
US5486655A (en) * 1992-08-17 1996-01-23 Hitachi Chemical Co., Ltd. Multiple wire adhesive on a multiple wire wiring board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6490269A (en) * 1987-09-30 1989-04-06 Fujikura Ltd Anisotropically conductive adhesive coating
JPH05262816A (ja) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd 熱潜在性有機金属触媒
JPH05287696A (ja) * 1992-04-09 1993-11-02 Nippon Kayaku Co Ltd 紙用活性エネルギー線硬化性樹脂組成物及びその硬化物
US5453450A (en) * 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
JPH08295830A (ja) * 1995-04-27 1996-11-12 Sekisui Chem Co Ltd 導電性塗料組成物及びそれを用いた物品
CN1105749C (zh) * 1997-08-19 2003-04-16 美国3M公司 导电环氧树脂组合物及其应用
JP3775773B2 (ja) * 1998-06-17 2006-05-17 株式会社東芝 硬化触媒、樹脂組成物、樹脂封止型半導体装置、およびコーティング材
JP2001048921A (ja) * 1999-08-04 2001-02-20 Daicel Chem Ind Ltd エポキシ化ジエン系ブロック共重合体の粉末状水和反応物およびその製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1554429A (en) * 1975-06-27 1979-10-24 Westinghouse Electric Corp Resin rich eposidemica flexible high voltage insulation
US5486655A (en) * 1992-08-17 1996-01-23 Hitachi Chemical Co., Ltd. Multiple wire adhesive on a multiple wire wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110325612A (zh) * 2017-02-22 2019-10-11 罗曼有限合资公司 可缠绕和冲压的粘合膜
CN110325612B (zh) * 2017-02-22 2022-01-11 罗曼有限合资公司 可缠绕和冲压的粘合膜

Also Published As

Publication number Publication date
DE60308000D1 (de) 2006-10-12
KR20040111454A (ko) 2004-12-31
HK1073473A1 (en) 2005-10-07
AU2003215305A1 (en) 2003-10-20
ATE338102T1 (de) 2006-09-15
EP1490450B1 (en) 2006-08-30
TWI322172B (en) 2010-03-21
WO2003085062A1 (en) 2003-10-16
JP4201519B2 (ja) 2008-12-24
MY133275A (en) 2007-10-31
TW200304935A (en) 2003-10-16
CN1646657A (zh) 2005-07-27
DE60308000T2 (de) 2007-03-01
JP2003292921A (ja) 2003-10-15
EP1490450A1 (en) 2004-12-29

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070425

Termination date: 20120219