CN1280314A - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
- Publication number
- CN1280314A CN1280314A CN00120716A CN00120716A CN1280314A CN 1280314 A CN1280314 A CN 1280314A CN 00120716 A CN00120716 A CN 00120716A CN 00120716 A CN00120716 A CN 00120716A CN 1280314 A CN1280314 A CN 1280314A
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- China
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19676699A JP3371852B2 (ja) | 1999-07-09 | 1999-07-09 | レチクル |
JP196766/1999 | 1999-07-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1280314A true CN1280314A (zh) | 2001-01-17 |
CN100407051C CN100407051C (zh) | 2008-07-30 |
Family
ID=16363276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN001207164A Expired - Fee Related CN100407051C (zh) | 1999-07-09 | 2000-07-07 | 用于制造半导体器件的标线片 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6670632B1 (zh) |
JP (1) | JP3371852B2 (zh) |
KR (1) | KR100375146B1 (zh) |
CN (1) | CN100407051C (zh) |
GB (1) | GB2358714B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102087488A (zh) * | 2009-12-04 | 2011-06-08 | 台湾积体电路制造股份有限公司 | 具有对准标记的装置及用于制作半导体组件的方法 |
CN102314073A (zh) * | 2010-07-02 | 2012-01-11 | 无锡华润上华半导体有限公司 | 光刻版及其套刻方法 |
CN102520594A (zh) * | 2003-07-11 | 2012-06-27 | Asml荷兰有限公司 | 用于对准或重叠的标记结构,限定它的掩模图案及使用该掩模图案的光刻投影装置 |
CN101924013B (zh) * | 2009-06-17 | 2012-10-03 | 上海华虹Nec电子有限公司 | 一种增强外延后光刻套准精度的方法 |
CN101533229B (zh) * | 2008-03-10 | 2013-03-27 | 精工电子有限公司 | 用于投影曝光装置的标线以及使用它的曝光方法 |
CN109860153A (zh) * | 2019-03-29 | 2019-06-07 | 长江存储科技有限责任公司 | 集成电路器件、形成对准测量图形的方法以及光掩模 |
CN110600414A (zh) * | 2019-08-01 | 2019-12-20 | 中国科学院微电子研究所 | 晶圆异构对准方法及装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6914017B1 (en) * | 2000-08-30 | 2005-07-05 | Micron Technology, Inc. | Residue free overlay target |
JP2002148782A (ja) * | 2000-11-10 | 2002-05-22 | Nec Corp | アライメントマーク |
JP3970546B2 (ja) | 2001-04-13 | 2007-09-05 | 沖電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
JP4011353B2 (ja) * | 2002-01-31 | 2007-11-21 | 沖電気工業株式会社 | 合わせ測定用のレジストパターン |
US7209235B2 (en) * | 2002-07-11 | 2007-04-24 | Hymite A/S | Accurate positioning of components of a optical assembly |
JP2004120515A (ja) * | 2002-09-27 | 2004-04-15 | Oki Electric Ind Co Ltd | フェーズロックループ回路 |
EP1498779A3 (en) * | 2003-07-11 | 2005-03-23 | ASML Netherlands B.V. | Marker structure for alignment or overlay |
US6967709B2 (en) * | 2003-11-26 | 2005-11-22 | International Business Machines Corporation | Overlay and CD process window structure |
JP2007173375A (ja) * | 2005-12-20 | 2007-07-05 | Nec Corp | 複合実装デバイス及びその製造方法 |
US20070146670A1 (en) * | 2005-12-27 | 2007-06-28 | Asml Netherlands B.V. | Lithographic apparatus, patterning device and device manufacturing method |
JP4689471B2 (ja) * | 2006-01-06 | 2011-05-25 | エルピーダメモリ株式会社 | 回路パターン露光方法及びマスク |
JP4864776B2 (ja) | 2007-03-14 | 2012-02-01 | 株式会社東芝 | フォトマスク |
KR100928505B1 (ko) * | 2007-10-22 | 2009-11-26 | 주식회사 동부하이텍 | 반도체 소자 제작 방법 및 장치 |
SG153747A1 (en) | 2007-12-13 | 2009-07-29 | Asml Netherlands Bv | Alignment method, alignment system and product with alignment mark |
JP5006889B2 (ja) * | 2008-02-21 | 2012-08-22 | エーエスエムエル ネザーランズ ビー.ブイ. | 粗ウェーハ位置合わせ用マーク構造及びこのようなマーク構造の製造方法 |
US9470987B1 (en) * | 2015-10-22 | 2016-10-18 | United Microelectronics Corp. | Overlay mask |
US10461038B1 (en) * | 2018-08-31 | 2019-10-29 | Micron Technology, Inc. | Methods of alignment marking semiconductor wafers, and semiconductor packages having portions of alignment markings |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
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US435740A (en) * | 1890-09-02 | Thill-tug | ||
US436563A (en) * | 1890-09-16 | Matthias n | ||
JPS58102939A (ja) | 1981-12-15 | 1983-06-18 | Canon Inc | マスクアライナ−用マスク及びマスクアライナ− |
US4759626A (en) | 1986-11-10 | 1988-07-26 | Hewlett-Packard Company | Determination of best focus for step and repeat projection aligners |
JPH01260818A (ja) * | 1988-04-12 | 1989-10-18 | Mitsubishi Electric Corp | アライメントマークの付設構造 |
JPH02112222A (ja) * | 1988-10-21 | 1990-04-24 | Toshiba Corp | 位置検出用マーク |
JPH02152220A (ja) * | 1988-12-02 | 1990-06-12 | Canon Inc | 位置合せ方法 |
JP2918051B2 (ja) * | 1989-12-18 | 1999-07-12 | 富士通株式会社 | 電子ビーム露光装置 |
JP2594660B2 (ja) | 1990-02-06 | 1997-03-26 | 富士通株式会社 | 荷電粒子ビーム露光方法 |
JP3017839B2 (ja) * | 1991-06-10 | 2000-03-13 | 東芝機械株式会社 | 欠陥検査方法及び検査装置 |
US5242770A (en) | 1992-01-16 | 1993-09-07 | Microunity Systems Engineering, Inc. | Mask for photolithography |
JP3328323B2 (ja) * | 1992-07-20 | 2002-09-24 | 株式会社日立製作所 | 位相シフトマスクの製造方法および半導体集積回路装置の製造方法 |
KR970009208B1 (en) * | 1993-07-26 | 1997-06-07 | Lg Electronics Inc | Cathode structure of electron gun for crt |
US5365072A (en) * | 1993-08-30 | 1994-11-15 | The United States Of America As Represented By The Secretary Of The Navy | Repositionable substrate for microscopes |
US5667918A (en) | 1993-09-27 | 1997-09-16 | Micron Technology, Inc. | Method of lithography using reticle pattern blinders |
KR970010666B1 (ko) * | 1993-12-27 | 1997-06-30 | 현대전자산업 주식회사 | 반도체 소자의 패턴 중첩오차 측정방법 |
US5444538A (en) * | 1994-03-10 | 1995-08-22 | New Vision Systems, Inc. | System and method for optimizing the grid and intrafield registration of wafer patterns |
US5580829A (en) * | 1994-09-30 | 1996-12-03 | Motorola, Inc. | Method for minimizing unwanted metallization in periphery die on a multi-site wafer |
US5477058A (en) * | 1994-11-09 | 1995-12-19 | Kabushiki Kaisha Toshiba | Attenuated phase-shifting mask with opaque reticle alignment marks |
US5570405A (en) * | 1995-06-06 | 1996-10-29 | International Business Machines Corporation | Registration and alignment technique for X-ray mask fabrication |
JPH0934100A (ja) | 1995-07-20 | 1997-02-07 | Ricoh Co Ltd | レティクルとレティクルにより作成される半導体装置 |
US5545570A (en) * | 1995-09-29 | 1996-08-13 | Taiwan Semiconductor Manufacturing Company | Method of inspecting first layer overlay shift in global alignment process |
KR0156422B1 (ko) * | 1995-10-05 | 1999-02-01 | 김광호 | 반도체장치 제조용 레티클 |
KR0170889B1 (ko) * | 1995-12-19 | 1999-03-30 | 김광호 | 반도체장치 제조용 레티클 |
JP3516546B2 (ja) * | 1995-12-22 | 2004-04-05 | 株式会社ルネサステクノロジ | 重ね合せ誤差の低減方法 |
JPH09270379A (ja) * | 1996-04-01 | 1997-10-14 | Miyazaki Oki Electric Co Ltd | フォーカス評価用レチクルおよびフォーカス評価方法 |
JP3495517B2 (ja) * | 1996-08-07 | 2004-02-09 | 株式会社リコー | 斜入射照明用レチクル |
JPH10213895A (ja) | 1997-01-30 | 1998-08-11 | Sony Corp | レチクルの合わせ測定用マーク |
JPH10312994A (ja) | 1997-05-12 | 1998-11-24 | Sony Corp | 半導体装置の製造方法 |
US5827625A (en) * | 1997-08-18 | 1998-10-27 | Motorola, Inc. | Methods of designing a reticle and forming a semiconductor device therewith |
JPH11142121A (ja) * | 1997-11-11 | 1999-05-28 | Nikon Corp | レチクルの歪み計測方法および歪み計測装置 |
JPH11162810A (ja) * | 1997-11-26 | 1999-06-18 | Mitsubishi Electric Corp | 電子ビーム露光用アラインメントマーク |
US5982044A (en) * | 1998-04-24 | 1999-11-09 | Vanguard International Semiconductor Corporation | Alignment pattern and algorithm for photolithographic alignment marks on semiconductor substrates |
US6042946A (en) | 1998-07-29 | 2000-03-28 | Lexmark International, Inc. | Polyurethane roller with high surface resistance |
US6042976A (en) * | 1999-02-05 | 2000-03-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of calibrating WEE exposure tool |
TW388803B (en) | 1999-03-29 | 2000-05-01 | Nanya Technology Corp | A structure and method of measuring overlapping marks |
US6251745B1 (en) * | 1999-08-18 | 2001-06-26 | Taiwan Semiconductor Manufacturing Company | Two-dimensional scaling method for determining the overlay error and overlay process window for integrated circuits |
-
1999
- 1999-07-09 JP JP19676699A patent/JP3371852B2/ja not_active Expired - Fee Related
-
2000
- 2000-07-05 US US09/611,580 patent/US6670632B1/en not_active Expired - Lifetime
- 2000-07-07 CN CN001207164A patent/CN100407051C/zh not_active Expired - Fee Related
- 2000-07-08 KR KR10-2000-0039098A patent/KR100375146B1/ko not_active IP Right Cessation
- 2000-07-10 GB GB0016949A patent/GB2358714B/en not_active Expired - Fee Related
-
2002
- 2002-01-25 US US10/056,540 patent/US6645823B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102520594A (zh) * | 2003-07-11 | 2012-06-27 | Asml荷兰有限公司 | 用于对准或重叠的标记结构,限定它的掩模图案及使用该掩模图案的光刻投影装置 |
CN101533229B (zh) * | 2008-03-10 | 2013-03-27 | 精工电子有限公司 | 用于投影曝光装置的标线以及使用它的曝光方法 |
CN101924013B (zh) * | 2009-06-17 | 2012-10-03 | 上海华虹Nec电子有限公司 | 一种增强外延后光刻套准精度的方法 |
CN102087488A (zh) * | 2009-12-04 | 2011-06-08 | 台湾积体电路制造股份有限公司 | 具有对准标记的装置及用于制作半导体组件的方法 |
CN102087488B (zh) * | 2009-12-04 | 2013-05-08 | 台湾积体电路制造股份有限公司 | 具有对准标记的装置及用于制作半导体组件的方法 |
CN102314073A (zh) * | 2010-07-02 | 2012-01-11 | 无锡华润上华半导体有限公司 | 光刻版及其套刻方法 |
CN109860153A (zh) * | 2019-03-29 | 2019-06-07 | 长江存储科技有限责任公司 | 集成电路器件、形成对准测量图形的方法以及光掩模 |
CN110600414A (zh) * | 2019-08-01 | 2019-12-20 | 中国科学院微电子研究所 | 晶圆异构对准方法及装置 |
Also Published As
Publication number | Publication date |
---|---|
CN100407051C (zh) | 2008-07-30 |
GB0016949D0 (en) | 2000-08-30 |
GB2358714A (en) | 2001-08-01 |
US6670632B1 (en) | 2003-12-30 |
GB2358714B (en) | 2002-02-20 |
US20020093110A1 (en) | 2002-07-18 |
KR20010029909A (ko) | 2001-04-16 |
JP2001022051A (ja) | 2001-01-26 |
US6645823B2 (en) | 2003-11-11 |
KR100375146B1 (ko) | 2003-03-29 |
JP3371852B2 (ja) | 2003-01-27 |
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C10 | Entry into substantive examination | ||
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C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20040521 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20040521 Address after: Kanagawa, Japan Applicant after: NEC Corp. Address before: Tokyo, Japan Applicant before: NEC Corp. |
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C14 | Grant of patent or utility model | ||
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Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER NAME: NEC CORP. |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Kanagawa, Japan Patentee before: NEC Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20140707 |
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