CN1279629C - 用于对准掩模段的对准装置和方法 - Google Patents
用于对准掩模段的对准装置和方法 Download PDFInfo
- Publication number
- CN1279629C CN1279629C CNB021540950A CN02154095A CN1279629C CN 1279629 C CN1279629 C CN 1279629C CN B021540950 A CNB021540950 A CN B021540950A CN 02154095 A CN02154095 A CN 02154095A CN 1279629 C CN1279629 C CN 1279629C
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008021 deposition Effects 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011368 organic material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/016451 | 2001-12-10 | ||
US10/016,451 US6749690B2 (en) | 2001-12-10 | 2001-12-10 | Aligning mask segments to provide an assembled mask for producing OLED devices |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1424775A CN1424775A (zh) | 2003-06-18 |
CN1279629C true CN1279629C (zh) | 2006-10-11 |
Family
ID=21777188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021540950A Expired - Lifetime CN1279629C (zh) | 2001-12-10 | 2002-12-10 | 用于对准掩模段的对准装置和方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6749690B2 (zh) |
EP (1) | EP1318541B1 (zh) |
JP (1) | JP4373076B2 (zh) |
KR (1) | KR20030047825A (zh) |
CN (1) | CN1279629C (zh) |
DE (1) | DE60217056T2 (zh) |
TW (1) | TW565742B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104969340A (zh) * | 2012-12-13 | 2015-10-07 | 瓦里安半导体设备公司 | 用于半导体处理的掩膜对准系统 |
CN107099768A (zh) * | 2017-04-28 | 2017-08-29 | 东晶锐康晶体(成都)有限公司 | 一种石英晶体振荡器真空溅射镀膜掩膜板的校准装置及方法 |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7396558B2 (en) * | 2001-01-31 | 2008-07-08 | Toray Industries, Inc. | Integrated mask and method and apparatus for manufacturing organic EL device using the same |
US20030221620A1 (en) * | 2002-06-03 | 2003-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Vapor deposition device |
JP4440563B2 (ja) * | 2002-06-03 | 2010-03-24 | 三星モバイルディスプレイ株式會社 | 有機電子発光素子の薄膜蒸着用マスクフレーム組立体 |
KR100534580B1 (ko) * | 2003-03-27 | 2005-12-07 | 삼성에스디아이 주식회사 | 표시장치용 증착 마스크 및 그의 제조방법 |
JP2005276480A (ja) * | 2004-03-23 | 2005-10-06 | Seiko Epson Corp | マスク、マスクの製造方法、薄膜パターンの形成方法、電気光学装置の製造方法および電子機器 |
US20060086321A1 (en) * | 2004-10-22 | 2006-04-27 | Advantech Global, Ltd | Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process |
CN100529170C (zh) * | 2005-04-22 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | 基板载具 |
KR20070082317A (ko) * | 2006-02-16 | 2007-08-21 | 삼성전자주식회사 | 마스크 및 그 제조 방법 |
KR100753096B1 (ko) * | 2006-08-17 | 2007-08-31 | 삼성전기주식회사 | 정렬방법 및 이를 이용한 임프린팅 방법 |
KR101266489B1 (ko) * | 2006-12-26 | 2013-05-23 | 삼성디스플레이 주식회사 | 쉐도우 마스크 장치 및 이를 이용한 유기 전계발광표시장치의 제조 방법 |
JP2011510179A (ja) * | 2008-01-25 | 2011-03-31 | コンセホ・スペリオール・デ・インベスティガシオネス・シエンティフィカス | マイクロ電子工学の基板に薄膜を選択的に堆積するための自己整合金属マスクアセンブリ、およびその使用方法 |
US20090203283A1 (en) * | 2008-02-07 | 2009-08-13 | Margaret Helen Gentile | Method for sealing an electronic device |
DE102008037387A1 (de) * | 2008-09-24 | 2010-03-25 | Aixtron Ag | Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske |
TWI398533B (zh) * | 2009-12-29 | 2013-06-11 | Au Optronics Corp | 蔭罩及其製作方法 |
KR101182440B1 (ko) * | 2010-01-11 | 2012-09-12 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 프레임 조립체 |
KR101309864B1 (ko) * | 2010-02-02 | 2013-09-16 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
KR101232181B1 (ko) * | 2010-02-03 | 2013-02-12 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
CN102373419A (zh) * | 2010-08-23 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 镀膜加工方法 |
CN102373408A (zh) * | 2010-08-25 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 镀膜加工方法 |
CN103165828B (zh) * | 2011-12-16 | 2015-08-26 | 昆山工研院新型平板显示技术中心有限公司 | 荫罩及其制备方法 |
CN103205681B (zh) * | 2012-01-16 | 2017-02-08 | 昆山允升吉光电科技有限公司 | 对位辅助板 |
CN104685095B (zh) * | 2012-04-19 | 2017-12-29 | 因特瓦克公司 | 用于制造太阳能电池的双掩模装置 |
SG11201406646PA (en) * | 2012-04-20 | 2014-11-27 | Rensselaer Polytech Inst | Light emitting diodes and a method of packaging the same |
SG11201406893XA (en) | 2012-04-26 | 2014-11-27 | Intevac Inc | System architecture for vacuum processing |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
US9579680B2 (en) * | 2013-01-31 | 2017-02-28 | Wki Holding Company, Inc. | Self-centering magnetic masking system |
KR102099238B1 (ko) * | 2013-05-13 | 2020-04-10 | 삼성디스플레이 주식회사 | 마스크 조립체 및 이를 이용한 박막 증착 방법 |
US9490153B2 (en) | 2013-07-26 | 2016-11-08 | Varian Semiconductor Equipment Associates, Inc. | Mechanical alignment of substrates to a mask |
US9333733B2 (en) | 2013-07-26 | 2016-05-10 | Varian Semiconductor Equipment Associates, Inc. | Multi-part mask for implanting workpieces |
US9053405B1 (en) * | 2013-08-27 | 2015-06-09 | Flextronics Ap, Llc | Printed RFID circuit |
CN103762291B (zh) * | 2013-12-27 | 2016-05-18 | 铜陵中发三佳科技股份有限公司 | 适用于led支架emc封装的料片排料和投料装置 |
CN103713466B (zh) * | 2013-12-30 | 2016-05-11 | 京东方科技集团股份有限公司 | 掩膜板及其制作方法 |
US9627558B2 (en) * | 2014-04-09 | 2017-04-18 | Arizona Board Of Regents On Behalf Of Arizona State University | Methods and apparatuses for manufacturing self-aligned integrated back contact heterojunction solar cells |
WO2016022728A1 (en) | 2014-08-05 | 2016-02-11 | Intevac, Inc. | Implant masking and alignment |
KR102280269B1 (ko) * | 2014-11-05 | 2021-07-22 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체 및 그 제조 방법 |
CN104746015B (zh) * | 2015-03-17 | 2017-10-27 | 京东方科技集团股份有限公司 | 面板对位调节装置及其对位方法 |
CN104914679B (zh) * | 2015-05-18 | 2018-11-20 | 合肥芯硕半导体有限公司 | 一种用于半导体光刻的多功能高产能吸盘 |
KR20170059068A (ko) | 2015-11-19 | 2017-05-30 | 삼성전자주식회사 | 광원 모듈, 디스플레이 패널 및 이를 구비한 디스플레이 장치 |
CN105549320A (zh) * | 2016-01-05 | 2016-05-04 | 京东方科技集团股份有限公司 | 一种对位标记结构、掩模板、基板以及对位方法 |
KR102505877B1 (ko) * | 2016-01-29 | 2023-03-06 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체 및 이를 이용한 디스플레이 장치의 제조방법 |
CN105887010B (zh) * | 2016-05-13 | 2018-10-26 | 京东方科技集团股份有限公司 | 掩膜集成框架及蒸镀设备 |
CN106702318B (zh) * | 2016-12-12 | 2018-11-23 | 京东方科技集团股份有限公司 | 掩膜框架及制造方法和掩膜板 |
CN106480404B (zh) * | 2016-12-28 | 2019-05-03 | 京东方科技集团股份有限公司 | 一种掩膜集成框架及蒸镀装置 |
CN111886356A (zh) * | 2018-03-20 | 2020-11-03 | 夏普株式会社 | 成膜用掩模及使用该成膜用掩模的显示装置的制造方法 |
CN110750031B (zh) * | 2018-07-23 | 2021-10-29 | 上海微电子装备(集团)股份有限公司 | 一种拼接式掩模版、曝光装置及曝光方法 |
JP2020535304A (ja) * | 2018-08-06 | 2020-12-03 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | マスクアライナを有する堆積装置、基板をマスクするためのマスク設備、及び基板をマスクするための方法 |
KR102631255B1 (ko) * | 2018-10-18 | 2024-01-31 | 삼성디스플레이 주식회사 | 하이브리드형 마스크 스틱과, 이를 적용한 마스크 프레임 어셈블리 |
US11613802B2 (en) * | 2020-04-17 | 2023-03-28 | Rockwell Collins, Inc. | Additively manufactured shadow masks for material deposition control |
CN111424234A (zh) * | 2020-05-09 | 2020-07-17 | 江苏集萃有机光电技术研究所有限公司 | 一种对位模块、对位设备、薄膜沉积生产线及控制方法 |
CN111471960B (zh) * | 2020-06-09 | 2022-09-09 | 京东方科技集团股份有限公司 | 掩膜板以及制备方法 |
US11715662B2 (en) * | 2020-12-11 | 2023-08-01 | Applied Materials, Inc. | Actively clamped carrier assembly for processing tools |
KR20220126847A (ko) * | 2021-03-09 | 2022-09-19 | 삼성디스플레이 주식회사 | 마그넷 조립체 및 이를 포함하는 증착 장치 |
KR20230096185A (ko) * | 2021-12-22 | 2023-06-30 | 삼성디스플레이 주식회사 | 마스크 어셈블리, 이의 수리방법, 및 이의 제조방법 |
CN115747715A (zh) * | 2022-11-30 | 2023-03-07 | 中国科学院上海技术物理研究所 | 支撑板、吸引体、掩膜块和掩膜版组件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1484463A (en) * | 1975-01-28 | 1977-09-01 | Marconi Co Ltd | Method of aligning a protective mask |
US4676193A (en) * | 1984-02-27 | 1987-06-30 | Applied Magnetics Corporation | Stabilized mask assembly for direct deposition of a thin film pattern onto a substrate |
US6146489A (en) * | 1998-11-19 | 2000-11-14 | General Electric Company | Method and apparatus for depositing scintillator material on radiation imager |
US6475287B1 (en) * | 2001-06-27 | 2002-11-05 | Eastman Kodak Company | Alignment device which facilitates deposition of organic material through a deposition mask |
US6589382B2 (en) * | 2001-11-26 | 2003-07-08 | Eastman Kodak Company | Aligning mask segments to provide a stitched mask for producing OLED devices |
-
2001
- 2001-12-10 US US10/016,451 patent/US6749690B2/en not_active Expired - Lifetime
-
2002
- 2002-10-22 TW TW091124348A patent/TW565742B/zh not_active IP Right Cessation
- 2002-11-28 DE DE60217056T patent/DE60217056T2/de not_active Expired - Lifetime
- 2002-11-28 EP EP02079966A patent/EP1318541B1/en not_active Expired - Lifetime
- 2002-12-09 JP JP2002356285A patent/JP4373076B2/ja not_active Expired - Lifetime
- 2002-12-09 KR KR1020020077786A patent/KR20030047825A/ko not_active Application Discontinuation
- 2002-12-10 CN CNB021540950A patent/CN1279629C/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104969340A (zh) * | 2012-12-13 | 2015-10-07 | 瓦里安半导体设备公司 | 用于半导体处理的掩膜对准系统 |
CN104969340B (zh) * | 2012-12-13 | 2017-06-06 | 瓦里安半导体设备公司 | 掩膜对准系统及掩膜对准方法 |
CN107099768A (zh) * | 2017-04-28 | 2017-08-29 | 东晶锐康晶体(成都)有限公司 | 一种石英晶体振荡器真空溅射镀膜掩膜板的校准装置及方法 |
CN107099768B (zh) * | 2017-04-28 | 2019-07-12 | 东晶锐康晶体(成都)有限公司 | 一种石英晶体振荡器真空溅射镀膜掩膜板的校准装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1318541A3 (en) | 2004-12-15 |
CN1424775A (zh) | 2003-06-18 |
DE60217056T2 (de) | 2007-08-09 |
DE60217056D1 (de) | 2007-02-08 |
EP1318541B1 (en) | 2006-12-27 |
US6749690B2 (en) | 2004-06-15 |
JP2003249358A (ja) | 2003-09-05 |
TW565742B (en) | 2003-12-11 |
KR20030047825A (ko) | 2003-06-18 |
EP1318541A2 (en) | 2003-06-11 |
US20030108805A1 (en) | 2003-06-12 |
JP4373076B2 (ja) | 2009-11-25 |
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Owner name: GLOBAL OLED TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: EASTMAN KODAK COMPANY Effective date: 20100525 |
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