CN103762291B - 适用于led支架emc封装的料片排料和投料装置 - Google Patents

适用于led支架emc封装的料片排料和投料装置 Download PDF

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CN103762291B
CN103762291B CN201310734591.0A CN201310734591A CN103762291B CN 103762291 B CN103762291 B CN 103762291B CN 201310734591 A CN201310734591 A CN 201310734591A CN 103762291 B CN103762291 B CN 103762291B
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led support
rectangular frame
tablet discharge
make way
charging device
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CN103762291A (zh
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杨宇
曹杰
代迎桃
汪宗华
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WENYI TRINITY TECHNOLOGY Co.,Ltd.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

本发明公开了适用于LED支架EMC封装的料片排料装置，它包括带有支撑脚（1）的底板（2），所述底板上表面设有若干LED支架放置槽（3），所述LED支架放置槽两旁开设有让位槽（4），所述让位槽周围均布有与LED支架的定位孔相适配的定位针（5），底板上表面周边还设有若干导向定位柱（6）。还公开了与料片排料装置配合使用的投料装置，使操作工人在生产的过程当中能安全的，平稳的，方便的将LED支架摆放在模具上。

Description

适用于LED支架EMC封装的料片排料和投料装置
技术领域
本发明涉及EMC封装，尤其涉及适用于LED支架EMC封装的料片排料和投料装置。
背景技术
伴随着LED支架EMC封装在国内越来越快的发展，许多常规的PPA封装的产品都在慢慢的往EMC封装发展，例如广泛用于照明的3535，3528等等，且其产品在支架上的集成度越来越高，市场对该类型产品的数量需求也越来越多，在大环境的影响下，许多LED制造商都投资了该类生产线，行业间的竞争也越来越大，只有通过降低销售价格来占据市场份额，于此同时，各制造商也在寻求各种办法降低成本，许多用于民用和工业照明的产品没有太高的要求，因此有部分制造商已经不再用AUTO模来封装产品，而采用MGP模的形式来降低生产成本，由于EMC封装的LED支架集成度很高，模具空间有限，无法使用常规的上料框架，手动放置LED支架的话，工作效率极低，放置精度也不高，还容易被模具烫伤；同时，AUTO模在调试的时候，一般也都是手工放置支架，AUTO的操作空间很狭窄，手工操作极为不便，支架放错位置也不易察觉。
发明内容
本发明要解决的技术问题是现有的用于EMC封装的AUTO模和MGP模放置LED支架需要手动放置，效率低，放置位置不精确，容易被高温模具烫伤，为此提供一种适用于LED支架EMC封装的料片排料和投料装置。
本发明的技术方案是：适用于LED支架EMC封装的料片排料装置，它包括带有支撑脚的底板，所述底板上表面设有若干LED支架放置槽，所述LED支架放置槽两旁开设有让位槽，所述让位槽周围均布有与LED支架的定位孔相适配的定位针，底板上表面周边还设有若干导向定位柱。
上述方案解决了排料的问题，可以在模具封装的空隙时间完成，完成排料后为了解决投料的问题，技术方案如下：与料片排料装置配合使用的投料装置，它包括两端带有手柄的矩形框架，所述矩形框架背面均布有若干导向钉，矩形框架边缘设有若干带有拉手的矩形固定板，所述矩形固定板上固接有若干与矩形框架长度方向垂直的拉杆，所述拉杆通过与所述让位槽相适配的齿轮齿条与矩形框架背面的托板传动连接，当拉动拉手时齿轮带动托板旋转。
排料装置与投料装置配合使用，方可实现将LED支架平稳的放置到模具上的目的，本发明的有益效果是先使用排料装置进行LED支架的摆放，然后通过导向定位柱使投料装置精确贴合排料装置，让位槽可以使投料装置的齿轮齿条放置其中，这样排料装置和投料装置能够稳定配合无晃动，拉动拉手带动齿轮旋转，齿轮带动托板旋转从而在两两托板之间托住LED支架，当投料装置移至模具上方通过导向钉与模具精确定位后再次使托板旋转回初始位置，LED支架落入模具，完成排料投料，整个工作流程操作简单快捷，提高了工作效率。
附图说明
图1是本发明中的料片排料装置示意图；
图2是本发明中的投料装置示意图；
图3是图2的俯视图；
图中，1、支撑脚，2、底板，3、LED支架放置槽，4、让位槽，5、定位针，6、导向定位柱，7、手柄，8、矩形框架，9、导向钉，10、拉手，11、矩形固定板，12、拉杆，13、托板。
具体实施方式
下面结合附图对本发明做进一步说明。
如图1所示，本发明中的料片排料装置，包括带有支撑脚1的底板2，底板上表面设有若干LED支架放置槽3，LED支架放置槽两旁开设有让位槽4，让位槽周围均布有与LED支架的定位孔相适配的定位针5，底板上表面周边还设有若干导向定位柱6。
如图2、图3所示，本发明中的投料装置包括两端带有手柄7的矩形框架8，矩形框架背面均布有若干导向钉9，矩形框架边缘设有若干带有拉手10的矩形固定板11，矩形固定板上固接有若干与矩形框架长度方向垂直的拉杆12，拉杆通过与让位槽相适配的齿轮齿条与矩形框架背面的托板13传动连接，当拉动拉手时齿轮带动托板旋转。
使用时料片排料装置在常温下工作，工作范围开阔，上面设计有让位槽，先将LED支架放置在排料架上的LED支架放置槽内，定位孔落在定位针上，按步距将LED支架在排料架上一片一片摆好，此工作可以在模具封装的空隙时间完成；LED支架摆好后，将投料装置放在料片排料装置上，由导向定位柱6来保证位置精度，投料装置上的齿轮齿条等机构落在排料架的让位槽里，确保其平稳不晃动，此时托板与LED支架处于平行状态，往后推动拉手，由矩形固定板和拉杆带动齿条移动、齿条带动齿轮旋转，使得与齿轮固定的位于矩形框架背面的托板旋转90度这时两两托板之间间隔变小，或者旋转其它角度，只要能让LED支架就被托板托在上料框架上即可，然后将带有LED支架的投料装置摆放在模具上（不需要翻转），往前拉动拉手，通过矩形固定板和拉杆再次带动齿轮、齿条旋转，托板回到起始位置，LED支架通过自身重力作用落在模面上，完成上料过程。
本发明中所说的背面是指工作状态下与料片排料装置、模具接触的一面。
上面结合附图对本发明进行了示例性描述，显然本发明具体实现并不受上述方式的限制，只要采用了本发明的方法构思和技术方案进行的各种非实质性的改进，或未经改进将本发明的构思和技术方案直接应用于其它场合的，均在本发明的保护范围之内。

Claims (2)

1.适用于LED支架EMC封装的料片排料装置，其特征是它包括带有支撑脚（1）的底板（2），所述底板上表面设有若干LED支架放置槽（3），所述LED支架放置槽两旁开设有让位槽（4），所述让位槽周围均布有与LED支架的定位孔相适配的定位针（5），底板上表面周边还设有若干导向定位柱（6）。
2.与权利要求1所述的料片排料装置配合使用的投料装置，其特征是它包括两端带有手柄（7）的矩形框架（8），所述矩形框架背面均布有若干导向钉（9），矩形框架边缘设有若干带有拉手（10）的矩形固定板（11），所述矩形固定板上固接有若干与矩形框架长度方向垂直的拉杆（12），所述拉杆通过与所述让位槽相适配的齿轮齿条与矩形框架背面的托板（13）传动连接，当拉动拉手时齿轮带动托板旋转。
CN201310734591.0A 2013-12-27 2013-12-27 适用于led支架emc封装的料片排料和投料装置 Active CN103762291B (zh)

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Citations (3)

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CN1424775A (zh) * 2001-12-10 2003-06-18 伊斯曼柯达公司 用于生产有机发光二极管器件将多个掩模段对准以提供组装的掩模
CN101546801A (zh) * 2009-03-24 2009-09-30 深圳雷曼光电科技有限公司 大功率led封装方法
CN203659921U (zh) * 2013-12-27 2014-06-18 铜陵中发三佳科技股份有限公司 适用于led支架emc封装的料片排料和投料装置

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US20080112165A1 (en) * 2006-11-15 2008-05-15 Kyocera Corporation Light-emitting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1424775A (zh) * 2001-12-10 2003-06-18 伊斯曼柯达公司 用于生产有机发光二极管器件将多个掩模段对准以提供组装的掩模
CN101546801A (zh) * 2009-03-24 2009-09-30 深圳雷曼光电科技有限公司 大功率led封装方法
CN203659921U (zh) * 2013-12-27 2014-06-18 铜陵中发三佳科技股份有限公司 适用于led支架emc封装的料片排料和投料装置

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