CN1256396C - 高温环氧粘合剂膜 - Google Patents

高温环氧粘合剂膜 Download PDF

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Publication number
CN1256396C
CN1256396C CN02822191.5A CN02822191A CN1256396C CN 1256396 C CN1256396 C CN 1256396C CN 02822191 A CN02822191 A CN 02822191A CN 1256396 C CN1256396 C CN 1256396C
Authority
CN
China
Prior art keywords
weight
adhesive composition
aromatic
resins
polyepoxide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02822191.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN1582320A (zh
Inventor
C·A·乔治
W·J·舒尔茨
W·L·汤普森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1582320A publication Critical patent/CN1582320A/zh
Application granted granted Critical
Publication of CN1256396C publication Critical patent/CN1256396C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
CN02822191.5A 2001-11-08 2002-09-23 高温环氧粘合剂膜 Expired - Fee Related CN1256396C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 2001-11-08
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films

Publications (2)

Publication Number Publication Date
CN1582320A CN1582320A (zh) 2005-02-16
CN1256396C true CN1256396C (zh) 2006-05-17

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02822191.5A Expired - Fee Related CN1256396C (zh) 2001-11-08 2002-09-23 高温环氧粘合剂膜

Country Status (10)

Country Link
US (1) US6624213B2 (enExample)
EP (1) EP1442090B1 (enExample)
JP (1) JP4242771B2 (enExample)
CN (1) CN1256396C (enExample)
AT (1) ATE437932T1 (enExample)
BR (1) BR0213751B1 (enExample)
CA (1) CA2462454C (enExample)
DE (1) DE60233153D1 (enExample)
ES (1) ES2330926T3 (enExample)
WO (1) WO2003040251A1 (enExample)

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US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
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PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
WO2008045270A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
KR20090079934A (ko) * 2006-10-12 2009-07-22 씨-쓰리 인터내셔널, 엘엘씨 유체 가공 시스템 및 그의 성분을 위한 예방적 표면 처리를 제공하기 위한 방법
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
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GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
JP2011500944A (ja) * 2007-10-26 2011-01-06 スリーエム イノベイティブ プロパティズ カンパニー 水性結合剤又はサイジング組成物
CA2703907C (en) * 2007-10-30 2016-11-01 Henkel Ag & Co. Kgaa Epoxy paste adhesives resistant to wash-off
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
EP2475730B1 (en) * 2009-09-11 2014-10-08 3M Innovative Properties Company Curable and cured adhesive compositions
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
EP2534723A4 (en) 2010-02-10 2015-08-05 Fcet Inc LOW TEMPERATURE ELECTROLYTE FOR SOLID FUEL CELLS WITH HIGH ION CONDUCTIVITY
BR112012022319B1 (pt) 2010-03-04 2020-01-28 Zephyros Inc laminado estrutural compósito
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
US9905871B2 (en) 2013-07-15 2018-02-27 Fcet, Inc. Low temperature solid oxide cells
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
EP3724290A1 (en) 2017-12-15 2020-10-21 3M Innovative Properties Company High temperature structural adhesive films
CN112313262A (zh) * 2018-06-27 2021-02-02 3M创新有限公司 可固化组合物和相关方法
EP3873963B1 (en) * 2018-10-31 2024-03-13 3M Innovative Properties Company Curable adhesive, bonding film, and method of bonding the same
JP7761628B2 (ja) * 2020-07-13 2025-10-28 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 銅結合のための導電性エポキシ樹脂組成物
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
US20240010889A1 (en) * 2020-12-24 2024-01-11 Sika Technology Ag One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
CN118451157A (zh) * 2022-03-03 2024-08-06 汉高股份有限及两合公司 耐受未固化和已固化湿度暴露的环氧结构型粘合剂
WO2025240636A1 (en) * 2024-05-15 2025-11-20 Cytec Industries Inc. Adhesive composition for improved bonding performance

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system

Also Published As

Publication number Publication date
US20030125423A1 (en) 2003-07-03
ES2330926T3 (es) 2009-12-17
EP1442090A1 (en) 2004-08-04
CN1582320A (zh) 2005-02-16
US6624213B2 (en) 2003-09-23
CA2462454A1 (en) 2003-05-15
WO2003040251A1 (en) 2003-05-15
JP2005508436A (ja) 2005-03-31
DE60233153D1 (de) 2009-09-10
JP4242771B2 (ja) 2009-03-25
BR0213751B1 (pt) 2012-09-04
BR0213751A (pt) 2004-10-19
CA2462454C (en) 2009-11-24
EP1442090B1 (en) 2009-07-29
ATE437932T1 (de) 2009-08-15

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060517

Termination date: 20190923