JP4242771B2 - 耐熱性エポキシ接着剤フィルム - Google Patents

耐熱性エポキシ接着剤フィルム Download PDF

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Publication number
JP4242771B2
JP4242771B2 JP2003542292A JP2003542292A JP4242771B2 JP 4242771 B2 JP4242771 B2 JP 4242771B2 JP 2003542292 A JP2003542292 A JP 2003542292A JP 2003542292 A JP2003542292 A JP 2003542292A JP 4242771 B2 JP4242771 B2 JP 4242771B2
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JP
Japan
Prior art keywords
resin
weight
polyepoxide
alicyclic
polyepoxide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003542292A
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English (en)
Japanese (ja)
Other versions
JP2005508436A5 (enExample
JP2005508436A (ja
Inventor
エー． ジョージ，クレイトン
ジェイ． シュルツ，ウィリアム
エル． トンプソン，ウェンディ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005508436A publication Critical patent/JP2005508436A/ja
Publication of JP2005508436A5 publication Critical patent/JP2005508436A5/ja
Application granted granted Critical
Publication of JP4242771B2 publication Critical patent/JP4242771B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
JP2003542292A 2001-11-08 2002-09-23 耐熱性エポキシ接着剤フィルム Expired - Fee Related JP4242771B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films
PCT/US2002/030155 WO2003040251A1 (en) 2001-11-08 2002-09-23 High temperature epoxy adhesive films

Publications (3)

Publication Number Publication Date
JP2005508436A JP2005508436A (ja) 2005-03-31
JP2005508436A5 JP2005508436A5 (enExample) 2006-01-05
JP4242771B2 true JP4242771B2 (ja) 2009-03-25

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003542292A Expired - Fee Related JP4242771B2 (ja) 2001-11-08 2002-09-23 耐熱性エポキシ接着剤フィルム

Country Status (10)

Country Link
US (1) US6624213B2 (enExample)
EP (1) EP1442090B1 (enExample)
JP (1) JP4242771B2 (enExample)
CN (1) CN1256396C (enExample)
AT (1) ATE437932T1 (enExample)
BR (1) BR0213751B1 (enExample)
CA (1) CA2462454C (enExample)
DE (1) DE60233153D1 (enExample)
ES (1) ES2330926T3 (enExample)
WO (1) WO2003040251A1 (enExample)

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US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US7521093B2 (en) 2004-07-21 2009-04-21 Zephyros, Inc. Method of sealing an interface
US20060182949A1 (en) 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
WO2007025007A1 (en) * 2005-08-24 2007-03-01 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance
PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
WO2008130433A2 (en) * 2006-10-12 2008-10-30 C-3 International, Llc Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
US20090011247A1 (en) 2007-07-02 2009-01-08 Oil States Industries, Inc. Molded Composite Mandrel for a Downhole Zonal Isolation Tool
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
WO2009055403A2 (en) * 2007-10-26 2009-04-30 3M Innovative Properties Company Aqueous binder or sizing composition
MX2010004855A (es) * 2007-10-30 2010-06-30 Henkel Ag & Co Kgaa Adhesivos de pasta epoxi resistentes al lavado.
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
EP2475730B1 (en) 2009-09-11 2014-10-08 3M Innovative Properties Company Curable and cured adhesive compositions
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
EP2534723A4 (en) 2010-02-10 2015-08-05 Fcet Inc LOW TEMPERATURE ELECTROLYTE FOR SOLID FUEL CELLS WITH HIGH ION CONDUCTIVITY
EP2542403B2 (en) 2010-03-04 2023-08-16 Zephyros Inc. Structural composite laminate
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
US9905871B2 (en) 2013-07-15 2018-02-27 Fcet, Inc. Low temperature solid oxide cells
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
US11485881B2 (en) 2017-12-15 2022-11-01 3M Innovative Properties Company High temperature structural adhesive films
US11370908B2 (en) 2018-06-27 2022-06-28 3M Innovative Properties Company Curable compositions and related methods
CN112969737B (zh) * 2018-10-31 2024-10-01 3M创新有限公司 可固化粘合剂、粘结膜及其粘结方法
KR20230037556A (ko) 2020-07-13 2023-03-16 헨켈 아게 운트 코. 카게아아 구리 결합용 전도성 에폭시 수지 조성물
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
EP4267647A1 (en) * 2020-12-24 2023-11-01 Sika Technology AG One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
KR20240155849A (ko) * 2022-03-03 2024-10-29 헨켈 아게 운트 코. 카게아아 비경화 및 경화 시의 습윤 노출에 저항성이 있는 에폭시 구조용 접착제
WO2025240636A1 (en) * 2024-05-15 2025-11-20 Cytec Industries Inc. Adhesive composition for improved bonding performance

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Also Published As

Publication number Publication date
BR0213751B1 (pt) 2012-09-04
CA2462454C (en) 2009-11-24
CN1256396C (zh) 2006-05-17
ATE437932T1 (de) 2009-08-15
EP1442090A1 (en) 2004-08-04
WO2003040251A1 (en) 2003-05-15
US20030125423A1 (en) 2003-07-03
EP1442090B1 (en) 2009-07-29
US6624213B2 (en) 2003-09-23
DE60233153D1 (de) 2009-09-10
CN1582320A (zh) 2005-02-16
BR0213751A (pt) 2004-10-19
JP2005508436A (ja) 2005-03-31
ES2330926T3 (es) 2009-12-17
CA2462454A1 (en) 2003-05-15

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