BR0213751B1 - composição adesiva curável. - Google Patents

composição adesiva curável.

Info

Publication number
BR0213751B1
BR0213751B1 BRPI0213751-8A BR0213751A BR0213751B1 BR 0213751 B1 BR0213751 B1 BR 0213751B1 BR 0213751 A BR0213751 A BR 0213751A BR 0213751 B1 BR0213751 B1 BR 0213751B1
Authority
BR
Brazil
Prior art keywords
adhesive composition
curable adhesive
polyepoxide
polyepoxide resin
adhesives
Prior art date
Application number
BRPI0213751-8A
Other languages
English (en)
Portuguese (pt)
Other versions
BR0213751A (pt
Inventor
Clayton Allen George
William John Schultz
Wendy Lee Thompson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BR0213751A publication Critical patent/BR0213751A/pt
Publication of BR0213751B1 publication Critical patent/BR0213751B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
BRPI0213751-8A 2001-11-08 2002-09-23 composição adesiva curável. BR0213751B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films
PCT/US2002/030155 WO2003040251A1 (en) 2001-11-08 2002-09-23 High temperature epoxy adhesive films

Publications (2)

Publication Number Publication Date
BR0213751A BR0213751A (pt) 2004-10-19
BR0213751B1 true BR0213751B1 (pt) 2012-09-04

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0213751-8A BR0213751B1 (pt) 2001-11-08 2002-09-23 composição adesiva curável.

Country Status (10)

Country Link
US (1) US6624213B2 (enExample)
EP (1) EP1442090B1 (enExample)
JP (1) JP4242771B2 (enExample)
CN (1) CN1256396C (enExample)
AT (1) ATE437932T1 (enExample)
BR (1) BR0213751B1 (enExample)
CA (1) CA2462454C (enExample)
DE (1) DE60233153D1 (enExample)
ES (1) ES2330926T3 (enExample)
WO (1) WO2003040251A1 (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7473715B2 (en) 2001-05-02 2009-01-06 Zephyros, Inc. Two component (epoxy/amine) structural foam-in-place material
US7125461B2 (en) 2003-05-07 2006-10-24 L & L Products, Inc. Activatable material for sealing, baffling or reinforcing and method of forming same
US20060261312A1 (en) * 2003-05-28 2006-11-23 Lonza Inc. Quaternary ammonium salts containing non-halogen anions as anticorrosive agents
US20060240198A1 (en) * 2003-06-04 2006-10-26 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
KR100935774B1 (ko) * 2003-06-04 2010-01-06 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 액정 표시 소자용 시일제 및 액정표시 소자
US7199165B2 (en) 2003-06-26 2007-04-03 L & L Products, Inc. Expandable material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US7521093B2 (en) 2004-07-21 2009-04-21 Zephyros, Inc. Method of sealing an interface
US20060182949A1 (en) 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
WO2007025007A1 (en) * 2005-08-24 2007-03-01 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance
PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
WO2008130433A2 (en) * 2006-10-12 2008-10-30 C-3 International, Llc Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
US20090011247A1 (en) 2007-07-02 2009-01-08 Oil States Industries, Inc. Molded Composite Mandrel for a Downhole Zonal Isolation Tool
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
WO2009055403A2 (en) * 2007-10-26 2009-04-30 3M Innovative Properties Company Aqueous binder or sizing composition
MX2010004855A (es) * 2007-10-30 2010-06-30 Henkel Ag & Co Kgaa Adhesivos de pasta epoxi resistentes al lavado.
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
EP2475730B1 (en) 2009-09-11 2014-10-08 3M Innovative Properties Company Curable and cured adhesive compositions
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
EP2534723A4 (en) 2010-02-10 2015-08-05 Fcet Inc LOW TEMPERATURE ELECTROLYTE FOR SOLID FUEL CELLS WITH HIGH ION CONDUCTIVITY
EP2542403B2 (en) 2010-03-04 2023-08-16 Zephyros Inc. Structural composite laminate
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
US9905871B2 (en) 2013-07-15 2018-02-27 Fcet, Inc. Low temperature solid oxide cells
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
US11485881B2 (en) 2017-12-15 2022-11-01 3M Innovative Properties Company High temperature structural adhesive films
US11370908B2 (en) 2018-06-27 2022-06-28 3M Innovative Properties Company Curable compositions and related methods
CN112969737B (zh) * 2018-10-31 2024-10-01 3M创新有限公司 可固化粘合剂、粘结膜及其粘结方法
KR20230037556A (ko) 2020-07-13 2023-03-16 헨켈 아게 운트 코. 카게아아 구리 결합용 전도성 에폭시 수지 조성물
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
EP4267647A1 (en) * 2020-12-24 2023-11-01 Sika Technology AG One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
KR20240155849A (ko) * 2022-03-03 2024-10-29 헨켈 아게 운트 코. 카게아아 비경화 및 경화 시의 습윤 노출에 저항성이 있는 에폭시 구조용 접착제
WO2025240636A1 (en) * 2024-05-15 2025-11-20 Cytec Industries Inc. Adhesive composition for improved bonding performance

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL92155C (enExample) 1956-05-17
US3449280A (en) 1960-04-27 1969-06-10 Minnesota Mining & Mfg Adhesive composition containing high molecular weight polyamides,epoxy resins and curing agents
US3298998A (en) 1961-03-07 1967-01-17 Eastman Kodak Co Bisglycidyl ethers of bisphenols
US3316195A (en) 1961-11-13 1967-04-25 Raybestos Manhattan Inc Curable binder composition comprising epoxy resin, curing agent, and polymeric latex
US3332908A (en) 1965-02-08 1967-07-25 Union Carbide Corp Glycidyl ethers
US3894112A (en) 1969-10-31 1975-07-08 Minnesota Mining & Mfg Bonding film containing polytetramethyleneoxide elastomeric segments and polyepoxide
US3833683A (en) 1970-12-21 1974-09-03 Ford Motor Co Rubber-modified thermosets and process i
US3707583A (en) 1971-06-04 1972-12-26 Minnesota Mining & Mfg Adhesive
BE793030A (fr) 1971-12-20 1973-04-16 Goodrich Co B F Procede pour la realisation de matieres plastiques de resine epoxy
US3864426A (en) 1973-05-23 1975-02-04 Union Carbide Corp Thermal shock resistant epoxy compositions
US3856883A (en) 1973-05-29 1974-12-24 Ford Motor Co Graded rubber particles having hydroxy functionality and a polymeric crosslinking agent
US4331582A (en) 1980-01-14 1982-05-25 Hitco Epoxy latent catalyst
US4521490A (en) 1983-08-11 1985-06-04 Minnesota Mining And Manufacturing Co. Two-part epoxy composition
US4704331A (en) 1984-07-18 1987-11-03 Minnesota Mining And Manufacturing Company Method for adhering surfaces using fast curing epoxy resin compositions
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
CA1264476A (en) * 1985-05-30 1990-01-16 William J. Schultz Epoxy resin curing agent, process, and composition
US4904360A (en) 1986-09-12 1990-02-27 Minnesota Mining And Manufacturing Company Water-compatible coating composition
US4980234A (en) 1987-12-23 1990-12-25 Minnesota Mining And Manufacturing Co. Epoxide resin compositions and method
JP2643706B2 (ja) * 1991-11-26 1997-08-20 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
JPH07165880A (ja) 1993-12-14 1995-06-27 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP3821870B2 (ja) 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
JPH08291278A (ja) 1995-04-21 1996-11-05 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物及び接着性フィルム
JPH098178A (ja) 1995-06-14 1997-01-10 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
US6180696B1 (en) 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
JP2001064483A (ja) * 1999-08-27 2001-03-13 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物
US6379799B1 (en) 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners

Also Published As

Publication number Publication date
CA2462454C (en) 2009-11-24
CN1256396C (zh) 2006-05-17
ATE437932T1 (de) 2009-08-15
EP1442090A1 (en) 2004-08-04
WO2003040251A1 (en) 2003-05-15
US20030125423A1 (en) 2003-07-03
EP1442090B1 (en) 2009-07-29
US6624213B2 (en) 2003-09-23
DE60233153D1 (de) 2009-09-10
CN1582320A (zh) 2005-02-16
BR0213751A (pt) 2004-10-19
JP2005508436A (ja) 2005-03-31
JP4242771B2 (ja) 2009-03-25
ES2330926T3 (es) 2009-12-17
CA2462454A1 (en) 2003-05-15

Similar Documents

Publication Publication Date Title
BR0213751B1 (pt) composição adesiva curável.
BR0113964A (pt) Composição adesiva à base de dispersões de policloropreno
DK1409459T3 (da) ECL mærker, som har forbedrede, non-specifikke bindingsegenskaber, fremgangsmåder til anvendelse deraf, og kits indeholdende samme.
AU6932500A (en) Energy-curable composition for making a pressure sensitive adhesive
WO2003060029A3 (de) Strahlungshärtbare beschichtungen mit verbesserter haftung
DE50213252D1 (de) UV-vernetzbare Acrylathaftschmelzhaftkleber mit enger Molekulargewichtsverteilung
AU2002357782A1 (en) Labeling with polymer film label using water-based adhesive
WO2004083334A3 (en) Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
MY137823A (en) Adhesives with improved die-cutting performance
DE59709529D1 (de) Quellbarer schmelzklebstoff
BR0317593A (pt) Formas de dosagem compreendendo um inibidor de cetp e um inibidor de hmg-coa reductase
BR0017195A (pt) Composição adesiva dispersa em água, artigo, material de amortecimento de vibrações, método de ligação de um substrato, e, uso da composição adesiva
BRPI0600820A (pt) adesivo descamável fundido a quente
NO20054194D0 (no) Papir-slippmaterialer med forbedret adhesjon til papir og polymerfilmer
DE60119416D1 (de) Grundierungszusammensetzung für druckempfindliche Klebstoffe auf Basis von Silikonen
PL362552A1 (en) Aqueous dispersion and the use thereof in the production of coating agents, adhesives and sealing agents that can cured by heat or by actinic radiation
PL401407A1 (pl) Wodna kompozycja klejowa do laczenia elastomerów
TW340133B (en) Room-temperature stable, one-component, flexible epoxy adhesives
DE602005027241D1 (en) Photohärtbare michaeladditionspolymere
DE502005003908D1 (de) Härtbare zusammensetzungen auf basis von epoxidharzen und 3(4)-(aminomethyl)-cyclohexan-propanamin und 1,4(5)-cyclooctandimethanamin
WO2004013829A3 (en) Security label
ATE414727T1 (de) Flexibles, schlagfestes grundiermittel
EP1400546A4 (en) HARDENABLE, NON-RESISTANT RESIN COMPOSITION
TW200621624A (en) Assembly
AU2003240017A1 (en) Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/09/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE. PAGAR RESTAURACAO.

B21H Decision of lapse of a patent or of a certificate of addition of invention cancelled [chapter 21.8 patent gazette]

Free format text: REFERENTE AO DESPACHO 21.6 PUBLICADO NA RPI 2280 DE 16/09/2014.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B21H Decision of lapse of a patent or of a certificate of addition of invention cancelled [chapter 21.8 patent gazette]

Free format text: REFERENTE AO DESPACHOP 21.6 PUBLICADO NA RPI 2324 DE 21/07/2015.

B15K Others concerning applications: alteration of classification

Ipc: C09J 163/00 (2006.01), C08G 59/50 (2006.01), C08K