DE60233153D1 - Hochtemperaturepoxidklebfilme - Google Patents

Hochtemperaturepoxidklebfilme

Info

Publication number
DE60233153D1
DE60233153D1 DE60233153T DE60233153T DE60233153D1 DE 60233153 D1 DE60233153 D1 DE 60233153D1 DE 60233153 T DE60233153 T DE 60233153T DE 60233153 T DE60233153 T DE 60233153T DE 60233153 D1 DE60233153 D1 DE 60233153D1
Authority
DE
Germany
Prior art keywords
polyepoxide
hochtemperaturepoxidklebfilme
polyepoxide resin
adhesives
aminophenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60233153T
Other languages
German (de)
English (en)
Inventor
Clayton A George
William J Schultz
Wendy L Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60233153D1 publication Critical patent/DE60233153D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
DE60233153T 2001-11-08 2002-09-23 Hochtemperaturepoxidklebfilme Expired - Lifetime DE60233153D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films
PCT/US2002/030155 WO2003040251A1 (en) 2001-11-08 2002-09-23 High temperature epoxy adhesive films

Publications (1)

Publication Number Publication Date
DE60233153D1 true DE60233153D1 (de) 2009-09-10

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60233153T Expired - Lifetime DE60233153D1 (de) 2001-11-08 2002-09-23 Hochtemperaturepoxidklebfilme

Country Status (10)

Country Link
US (1) US6624213B2 (enExample)
EP (1) EP1442090B1 (enExample)
JP (1) JP4242771B2 (enExample)
CN (1) CN1256396C (enExample)
AT (1) ATE437932T1 (enExample)
BR (1) BR0213751B1 (enExample)
CA (1) CA2462454C (enExample)
DE (1) DE60233153D1 (enExample)
ES (1) ES2330926T3 (enExample)
WO (1) WO2003040251A1 (enExample)

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US20060261312A1 (en) * 2003-05-28 2006-11-23 Lonza Inc. Quaternary ammonium salts containing non-halogen anions as anticorrosive agents
US20060240198A1 (en) * 2003-06-04 2006-10-26 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
WO2004108790A1 (ja) * 2003-06-04 2004-12-16 Sekisui Chemical Co., Ltd. 硬化性樹脂組成物、液晶表示素子用シール剤及び液晶表示素子
US7199165B2 (en) 2003-06-26 2007-04-03 L & L Products, Inc. Expandable material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US7521093B2 (en) 2004-07-21 2009-04-21 Zephyros, Inc. Method of sealing an interface
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
ATE534703T1 (de) * 2005-08-24 2011-12-15 Henkel Kgaa Epoxidzusammensetzungen mit verbesserter schlagzähigkeit
ES2691528T3 (es) 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
CN101547990B (zh) * 2006-10-06 2012-09-05 汉高股份及两合公司 可泵送的耐洗掉的环氧膏状粘合剂
EP2083865A2 (en) 2006-10-12 2009-08-05 C-3 International, Llc Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
US20090011247A1 (en) * 2007-07-02 2009-01-08 Oil States Industries, Inc. Molded Composite Mandrel for a Downhole Zonal Isolation Tool
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
US20110027592A1 (en) * 2007-10-26 2011-02-03 Attila Molnar Aqueous binder or sizing composition
MX2010004855A (es) * 2007-10-30 2010-06-30 Henkel Ag & Co Kgaa Adhesivos de pasta epoxi resistentes al lavado.
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
KR101727345B1 (ko) 2009-09-11 2017-04-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 및 경화된 접착제 조성물
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
CA2789281C (en) 2010-02-10 2015-11-24 C3 International, Llc Low temperature electrolytes for solid oxide cells having high ionic conductivity
US9096039B2 (en) 2010-03-04 2015-08-04 Zephyros, Inc. Structural composite laminates
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
WO2015009618A1 (en) 2013-07-15 2015-01-22 Fcet, Llc Low temperature solid oxide cells
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
WO2019116348A1 (en) 2017-12-15 2019-06-20 3M Innovative Properties Company High temperature structural adhesive films
CN112313262A (zh) * 2018-06-27 2021-02-02 3M创新有限公司 可固化组合物和相关方法
CN112969737B (zh) * 2018-10-31 2024-10-01 3M创新有限公司 可固化粘合剂、粘结膜及其粘结方法
KR20230037556A (ko) 2020-07-13 2023-03-16 헨켈 아게 운트 코. 카게아아 구리 결합용 전도성 에폭시 수지 조성물
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
CN116685642A (zh) * 2020-12-24 2023-09-01 Sika技术股份公司 高温粘合性改善的单组分热固性环氧粘合剂
WO2023168177A1 (en) * 2022-03-03 2023-09-07 Henkel Ag & Co. Kgaa Epoxy structural adhesives resistant to uncured and cured humidity exposure
WO2025240636A1 (en) * 2024-05-15 2025-11-20 Cytec Industries Inc. Adhesive composition for improved bonding performance

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US3449280A (en) 1960-04-27 1969-06-10 Minnesota Mining & Mfg Adhesive composition containing high molecular weight polyamides,epoxy resins and curing agents
US3298998A (en) 1961-03-07 1967-01-17 Eastman Kodak Co Bisglycidyl ethers of bisphenols
US3316195A (en) 1961-11-13 1967-04-25 Raybestos Manhattan Inc Curable binder composition comprising epoxy resin, curing agent, and polymeric latex
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US3894112A (en) 1969-10-31 1975-07-08 Minnesota Mining & Mfg Bonding film containing polytetramethyleneoxide elastomeric segments and polyepoxide
US3833683A (en) 1970-12-21 1974-09-03 Ford Motor Co Rubber-modified thermosets and process i
US3707583A (en) 1971-06-04 1972-12-26 Minnesota Mining & Mfg Adhesive
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US3856883A (en) 1973-05-29 1974-12-24 Ford Motor Co Graded rubber particles having hydroxy functionality and a polymeric crosslinking agent
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US4704331A (en) 1984-07-18 1987-11-03 Minnesota Mining And Manufacturing Company Method for adhering surfaces using fast curing epoxy resin compositions
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CA1264476A (en) * 1985-05-30 1990-01-16 William J. Schultz Epoxy resin curing agent, process, and composition
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JP2643706B2 (ja) * 1991-11-26 1997-08-20 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
JPH07165880A (ja) 1993-12-14 1995-06-27 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP3821870B2 (ja) 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
JPH08291278A (ja) 1995-04-21 1996-11-05 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物及び接着性フィルム
JPH098178A (ja) 1995-06-14 1997-01-10 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
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JP2001064483A (ja) * 1999-08-27 2001-03-13 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物
US6379799B1 (en) 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners

Also Published As

Publication number Publication date
EP1442090B1 (en) 2009-07-29
BR0213751A (pt) 2004-10-19
ES2330926T3 (es) 2009-12-17
BR0213751B1 (pt) 2012-09-04
CN1256396C (zh) 2006-05-17
ATE437932T1 (de) 2009-08-15
EP1442090A1 (en) 2004-08-04
US6624213B2 (en) 2003-09-23
CA2462454A1 (en) 2003-05-15
US20030125423A1 (en) 2003-07-03
CA2462454C (en) 2009-11-24
JP2005508436A (ja) 2005-03-31
WO2003040251A1 (en) 2003-05-15
CN1582320A (zh) 2005-02-16
JP4242771B2 (ja) 2009-03-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition