DE60233153D1 - Hochtemperaturepoxidklebfilme - Google Patents

Hochtemperaturepoxidklebfilme

Info

Publication number
DE60233153D1
DE60233153D1 DE60233153T DE60233153T DE60233153D1 DE 60233153 D1 DE60233153 D1 DE 60233153D1 DE 60233153 T DE60233153 T DE 60233153T DE 60233153 T DE60233153 T DE 60233153T DE 60233153 D1 DE60233153 D1 DE 60233153D1
Authority
DE
Germany
Prior art keywords
polyepoxide
hochtemperaturepoxidklebfilme
polyepoxide resin
adhesives
aminophenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60233153T
Other languages
German (de)
English (en)
Inventor
Clayton A George
William J Schultz
Wendy L Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60233153D1 publication Critical patent/DE60233153D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Adhesive Tapes (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
DE60233153T 2001-11-08 2002-09-23 Hochtemperaturepoxidklebfilme Expired - Lifetime DE60233153D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films
PCT/US2002/030155 WO2003040251A1 (en) 2001-11-08 2002-09-23 High temperature epoxy adhesive films

Publications (1)

Publication Number Publication Date
DE60233153D1 true DE60233153D1 (de) 2009-09-10

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60233153T Expired - Lifetime DE60233153D1 (de) 2001-11-08 2002-09-23 Hochtemperaturepoxidklebfilme

Country Status (10)

Country Link
US (1) US6624213B2 (enExample)
EP (1) EP1442090B1 (enExample)
JP (1) JP4242771B2 (enExample)
CN (1) CN1256396C (enExample)
AT (1) ATE437932T1 (enExample)
BR (1) BR0213751B1 (enExample)
CA (1) CA2462454C (enExample)
DE (1) DE60233153D1 (enExample)
ES (1) ES2330926T3 (enExample)
WO (1) WO2003040251A1 (enExample)

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US20060261312A1 (en) * 2003-05-28 2006-11-23 Lonza Inc. Quaternary ammonium salts containing non-halogen anions as anticorrosive agents
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US20060240198A1 (en) * 2003-06-04 2006-10-26 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
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US7521093B2 (en) 2004-07-21 2009-04-21 Zephyros, Inc. Method of sealing an interface
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
CA2620028C (en) * 2005-08-24 2014-01-28 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance
PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
WO2008045270A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
KR20090079934A (ko) * 2006-10-12 2009-07-22 씨-쓰리 인터내셔널, 엘엘씨 유체 가공 시스템 및 그의 성분을 위한 예방적 표면 처리를 제공하기 위한 방법
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
US20090011247A1 (en) 2007-07-02 2009-01-08 Oil States Industries, Inc. Molded Composite Mandrel for a Downhole Zonal Isolation Tool
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
JP2011500944A (ja) * 2007-10-26 2011-01-06 スリーエム イノベイティブ プロパティズ カンパニー 水性結合剤又はサイジング組成物
CA2703907C (en) * 2007-10-30 2016-11-01 Henkel Ag & Co. Kgaa Epoxy paste adhesives resistant to wash-off
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
EP2475730B1 (en) * 2009-09-11 2014-10-08 3M Innovative Properties Company Curable and cured adhesive compositions
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
EP2534723A4 (en) 2010-02-10 2015-08-05 Fcet Inc LOW TEMPERATURE ELECTROLYTE FOR SOLID FUEL CELLS WITH HIGH ION CONDUCTIVITY
BR112012022319B1 (pt) 2010-03-04 2020-01-28 Zephyros Inc laminado estrutural compósito
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
US9905871B2 (en) 2013-07-15 2018-02-27 Fcet, Inc. Low temperature solid oxide cells
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
EP3724290A1 (en) 2017-12-15 2020-10-21 3M Innovative Properties Company High temperature structural adhesive films
CN112313262A (zh) * 2018-06-27 2021-02-02 3M创新有限公司 可固化组合物和相关方法
EP3873963B1 (en) * 2018-10-31 2024-03-13 3M Innovative Properties Company Curable adhesive, bonding film, and method of bonding the same
JP7761628B2 (ja) * 2020-07-13 2025-10-28 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 銅結合のための導電性エポキシ樹脂組成物
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
US20240010889A1 (en) * 2020-12-24 2024-01-11 Sika Technology Ag One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
CN118451157A (zh) * 2022-03-03 2024-08-06 汉高股份有限及两合公司 耐受未固化和已固化湿度暴露的环氧结构型粘合剂
WO2025240636A1 (en) * 2024-05-15 2025-11-20 Cytec Industries Inc. Adhesive composition for improved bonding performance

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US3298998A (en) 1961-03-07 1967-01-17 Eastman Kodak Co Bisglycidyl ethers of bisphenols
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JP2643706B2 (ja) * 1991-11-26 1997-08-20 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
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Also Published As

Publication number Publication date
US20030125423A1 (en) 2003-07-03
ES2330926T3 (es) 2009-12-17
EP1442090A1 (en) 2004-08-04
CN1582320A (zh) 2005-02-16
US6624213B2 (en) 2003-09-23
CA2462454A1 (en) 2003-05-15
WO2003040251A1 (en) 2003-05-15
JP2005508436A (ja) 2005-03-31
JP4242771B2 (ja) 2009-03-25
CN1256396C (zh) 2006-05-17
BR0213751B1 (pt) 2012-09-04
BR0213751A (pt) 2004-10-19
CA2462454C (en) 2009-11-24
EP1442090B1 (en) 2009-07-29
ATE437932T1 (de) 2009-08-15

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Legal Events

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8364 No opposition during term of opposition